JPS5848926A - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS5848926A
JPS5848926A JP56146158A JP14615881A JPS5848926A JP S5848926 A JPS5848926 A JP S5848926A JP 56146158 A JP56146158 A JP 56146158A JP 14615881 A JP14615881 A JP 14615881A JP S5848926 A JPS5848926 A JP S5848926A
Authority
JP
Japan
Prior art keywords
plate
metal
semiconductor device
bonded
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56146158A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6326542B2 (enExample
Inventor
Yasutoshi Kurihara
保敏 栗原
Komei Yatsuno
八野　耕明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56146158A priority Critical patent/JPS5848926A/ja
Publication of JPS5848926A publication Critical patent/JPS5848926A/ja
Publication of JPS6326542B2 publication Critical patent/JPS6326542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Die Bonding (AREA)
JP56146158A 1981-09-18 1981-09-18 絶縁型半導体装置 Granted JPS5848926A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56146158A JPS5848926A (ja) 1981-09-18 1981-09-18 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56146158A JPS5848926A (ja) 1981-09-18 1981-09-18 絶縁型半導体装置

Publications (2)

Publication Number Publication Date
JPS5848926A true JPS5848926A (ja) 1983-03-23
JPS6326542B2 JPS6326542B2 (enExample) 1988-05-30

Family

ID=15401437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56146158A Granted JPS5848926A (ja) 1981-09-18 1981-09-18 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS5848926A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032343A (ja) * 1983-08-02 1985-02-19 Toshiba Corp パワ−半導体モジユ−ル基板
JPS62219546A (ja) * 1986-03-19 1987-09-26 Toshiba Corp 半導体装置
JPH01185928A (ja) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd 半導体装置の製造方法
US4965659A (en) * 1987-06-30 1990-10-23 Sumitomo Electric Industries, Ltd. Member for a semiconductor structure
US5138439A (en) * 1989-04-04 1992-08-11 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2000086368A (ja) * 1998-09-16 2000-03-28 Fuji Electric Co Ltd 窒化物セラミックス基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102310A (en) * 1977-02-18 1978-09-06 Tokyo Shibaura Electric Co Heat conducting base plates
JPS5551774A (en) * 1978-10-06 1980-04-15 Kyoto Ceramic Composition and method for metallizing nonnoxide ceramic body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102310A (en) * 1977-02-18 1978-09-06 Tokyo Shibaura Electric Co Heat conducting base plates
JPS5551774A (en) * 1978-10-06 1980-04-15 Kyoto Ceramic Composition and method for metallizing nonnoxide ceramic body

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032343A (ja) * 1983-08-02 1985-02-19 Toshiba Corp パワ−半導体モジユ−ル基板
JPS62219546A (ja) * 1986-03-19 1987-09-26 Toshiba Corp 半導体装置
US4965659A (en) * 1987-06-30 1990-10-23 Sumitomo Electric Industries, Ltd. Member for a semiconductor structure
JPH01185928A (ja) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd 半導体装置の製造方法
US5138439A (en) * 1989-04-04 1992-08-11 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2000086368A (ja) * 1998-09-16 2000-03-28 Fuji Electric Co Ltd 窒化物セラミックス基板

Also Published As

Publication number Publication date
JPS6326542B2 (enExample) 1988-05-30

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