JPS5845872A - Production method of diamond abrasive tool - Google Patents

Abstract

PURPOSE:To produce said tool with a high abrasion capability and having waste handling gaps on the surface by attaching nonconductive resist ink on a part of the substratum surface and by attaching diamond by means of metal plating. CONSTITUTION:Resist ink 2 is attached on the surface of a metallic substratum 1 in a lattice shape or net shape by means of screen printing or the like. Nickel is electroplated on the surface of the substratum 1 and diamond particles 5 are attached on it. Accordingly, portions of the resist ink 2 are not electroplated, and when the resist ink 2 is removed with a solvent, waste handling gaps 3 with no metalplating layer are formed. Next, metal plating is applied on all faces of the substratum 1, thus a thin metal plating layer is also attached on the waste handling gaps 3 in succession to the metal plating layer 4 attaching the diamond.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a diamond abrasive tool in which diamonds are fixed to each other via a plating layer, separated by a scrap clearance.

■ Prior Art The present inventor has developed a diamond abrasive tool with excellent abrasive power and durability that is incomparable to conventional tools by providing a debris clearance gap on the surface of the tool. Depending on the conditions of use, this type of polishing tool has almost twice the polishing capacity of a tool that does not dispose of waste, and even after a considerable period of use,
Achieved abrasive power superior to conventional new abrasive tools. This excellent abrasive power is due to the fact that the shape of the cutting chips generated by the diamond abrasive tool is particularly convenient for sliding plates compared to abrasive paper cloth or the like. In other words, when we look at cutting chips under a microscope, we can see that the chips cut with diamond have a long and continuous shape due to diamond's excellent cutting power.
It has the characteristics of being in close contact with diamonds and being difficult to be press-fitted.

For this reason, cutting debris is smoothly transported to the sliding plate gap, preventing clogging between the diamonds.

The inventor first fixed diamonds on the surface of the base material of a sheet material with a plating layer, cut this sheet material into small pieces and adhered them to the surface of the base material, thereby creating a sliding plate between the small pieces of sheets. A gap was formed. However, according to this structure,
It is extremely time-consuming to manufacture, making it impossible to mass-produce, and the manufacturing cost is considerably high.Due to the manufacturing method, it is difficult to form sliding plate gaps in delicate shapes, and the sliding plate gaps are prone to wear. .

6) Purpose The present invention has been developed to further eliminate this drawback.
An important object of the present invention is to provide a method for manufacturing a diamond abrasive tool which allows the creation of complex and fine sliding plate gaps simply and easily, and which is optimal for mass production. The important purpose of the invention is to form a metal plating layer on the entire surface of the base material, so that the plating layer on which the diamond is attached is completely fixed to the base material and does not fall off, and in addition, the plating layer is also formed in the gaps between the sliding plates. is formed, so there is no wear of the sliding plate gap or peeling of the plating layer from the sliding plate gap, and the plating layer and diamond are completely fixed, making it possible to manufacture a diamond abrasive tool with excellent durability. We are here to provide you with a method.

Furthermore, an important purpose of this invention is that although it is possible to manufacture abrasive tools with excellent cutting and polishing power, the manufacturing cost does not increase significantly, and the amount of diamond used is reduced, resulting in lower raw material costs. To provide a method for manufacturing a diamond abrasive tool which is inexpensive and can manufacture a diamond tool with excellent characteristics at a low cost.

C heart composition Embodiments of the present invention will be described below based on the drawings.

First, as shown in FIG. 1, linear resist ink 2 is applied in a lattice, net, or tortoise shape on the surface of a metal base material 1 at positions where sliding gaps are to be formed by a method such as screen printing. It sticks like that.

The resist ink 2 is used to prevent the adhered portions from being plated when the surface of the base material 1 is electroplated, and is completely washed away with a solvent after the plating process. Therefore, this resist ink is soluble in a solvent and non-conductive to prevent a metal plating layer from adhering to the surface during plating.

The sliding plate gap 3 is determined to be the optimum value by taking into consideration the application, diamond particle size, etc., but its width is usually set between several tenths of a millimeter to several millimeters, and the spacing between the sliding plate gaps, i.e. The pitch is determined to be approximately 0.5 to 15 iIm. .

Diamonds with a mesh size of 80 to 8,000 are used to attach the metal plating layer 4 to the surface of the base material.

After a pretreatment process such as pickling, a diamond 5 is attached to the surface of the base material 1 to which the resist ink has been applied, through a metal plating layer 4 such as Niranal, and after the plating process, the resist ink is applied. 2 with a solvent and the second
As shown in the figure, a sliding board gap 3 without a metal plating layer 4 is formed.

Thereafter, after pretreatment again, the entire surface is electroplated, and a metal plating layer 4 is also adhered to the shoulder plate gap 3 in succession to the metal plating layer 4 adhered to diamond.

The depth of the shoulder plate gap 3 can be adjusted by the thickness of the metal plating layer initially deposited on the base material, that is, by the time and current value for depositing resist ink and electroplating. The thicker the first electroplated layer, the deeper the interlayer gap.

The thickness of the metal plating layer applied to the entire surface of the base material 1 including the bottom surface of the shoulder plate gap 3 is such that the metal plated layer attached to the shoulder plate gap 3 completely covers the bottom surface of the shoulder plate gap 3, and this is the diamond attachment point. In order to connect the plating layer and prevent it from peeling off from the ridges of the sliding plate during use, the diameter is preferably determined to be from several microns to several hundred microns, and the diameter is less than half the diameter of the diamond particle.

The sum of the thickness of the first plating layer to form the gap between the shoulder plates and the thickness of the entire plating layer including the bottom of the gap between the shoulder plates is the thickness at which the diamond is buried at least 60% of the entire gap. It is determined by

Nickel plating is usually used for both the first electroplating to attach the diamond and the second electroplating, but other plating, such as nickel plating first and chrome plating for the next plating, is usually used for both. It is also possible to do the following.

The diamond abrasive tool shown in Figures 1 to 3 attaches diamond directly to the surface of a relatively thick base material 1, but as shown in Figure 4, it attaches diamond directly to the surface of a base material 1 such as a copper plate. It is also possible to use the diamond 5 by providing a shoulder plate gap 3 and adhering it to another base material body 6 or the like. In this case as well, since the shoulder plate gap 3 is covered with the plating layer, it will not peel off from there during use.

As shown in Fig. 4, when a shoulder plate gap 3 is provided on one side of a base material 1 such as a copper plate and diamond is attached, a cut groove is carved on the back surface of the base material 1 using a cutter or the like. This allows the metal to be broken and separated into W1 layers due to metal brittleness. Therefore, it has the feature that the user can cut it into an optimal size and shape and use it by adhering it to another base material.

[White'] Effect As described above, the present invention applies resist ink to the surface of the base material, then attaches diamonds by electroplating, and forms shoulder plate gaps where diamonds are not attached locally by the resist ink. Then, the resist ink is removed and the entire surface is plated again, so even the most complex and detailed shoulder plate gaps can be processed easily and efficiently, making it ideal for mass production. However, since the plating layer is formed on the entire surface of the base material, the plating layer on which the diamond is attached is completely and firmly fixed to the base material and does not fall off.Furthermore, the gap between the shoulder plates is also covered with the plating layer. As a result, wear in the gap between the shoulder plates and peeling of the plating layer from there can be extremely effectively prevented, and the plating layer and diamond are more completely fixed to the base material, significantly extending durability. Although it has extremely superior friction and cutting ability compared to tools with no gap between shoulder plates, the manufacturing method is simple and the amount of diamond used is reduced, making it possible to manufacture tools with excellent physical properties at a lower cost. etc. It has a number of <(, @.

[Brief explanation of the drawing]

1 to 3 are cross-sectional views showing the manufacturing process of a polishing tool according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of a polishing tool having a different structure. 1. Base material, 2.・Resist ink, 3m・Sliding plate gap 4・Metal plating layer 5.・Diamond 6.・Base material body Applicant: Kure Seisakusho Co., Ltd.

Claims (3)

[Claims] (1) In a method of manufacturing a diamond abrasive tool in which diamond is fixed to the surface of the base material through a metal plating layer, and this diamond is fixed at a distance from the debris handling gap, the diamond is fixed at the debris handling gap on the surface of the base material. A non-3# conductive, solvent-soluble resist interlayer is attached to the position, and then diamond is attached to the surface of the base material by metal plating, and then the resist ink is removed with a solvent, and this resist ink is removed. A method for manufacturing a diamond abrasive tool in which metal plating is attached to the surface of a ground base material, and the scrap clearance gap where diamond is not attached is plated thinner than the diamond-attached area, thereby forming a scrap clearance gap on the surface. (2) A method of manufacturing a diamond abrasive tool according to claim 11, wherein nickel plating is used to adhere the diamond to the base material. (3) Apply resist ink to the striped surface in 41 shapes, net shapes,
A method for manufacturing a diamond abrasive tool according to claim (1), which adheres in a hexagonal pattern.