JPS62150059U - - Google Patents
Info
- Publication number
- JPS62150059U JPS62150059U JP3673686U JP3673686U JPS62150059U JP S62150059 U JPS62150059 U JP S62150059U JP 3673686 U JP3673686 U JP 3673686U JP 3673686 U JP3673686 U JP 3673686U JP S62150059 U JPS62150059 U JP S62150059U
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- abrasive layer
- view
- base material
- material body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004070 electrodeposition Methods 0.000 claims 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案にかかる切削砥石の第１実施例
を示す正面図、第２図は切削砥粒層の端末部分を
拡大して示す断面図、第３図は本考案にかかる切
削砥石の第２実施例を示す正面図、第４図は第３
図の―線に沿つた断面図、第５図は切削砥粒
層の端末部分を拡大して示す断面図、第６図は従
来の軸付砥石の概略構成を示す正面図、第７図は
その切削砥粒層の端末部分を拡大して示す断面図
、第８図は従来の角砥石の概略構成を示す正面図
、第９図は第８図のｉｘ―ｉｘ線に沿つた断面図
、第１０図は第８図の切削砥粒層の端末部分を拡
大して示す断面図である。
１，２……切削砥石、３……母材本体、５……
切削砥粒層、７……境界部。
FIG. 1 is a front view showing a first embodiment of a cutting wheel according to the present invention, FIG. 2 is a cross-sectional view showing an enlarged end portion of a cutting abrasive layer, and FIG. 3 is a front view showing a first embodiment of a cutting wheel according to the present invention. A front view showing the second embodiment, FIG.
5 is an enlarged sectional view showing the end portion of the cutting abrasive layer, FIG. 6 is a front view showing the schematic structure of a conventional shafted grindstone, and FIG. 7 is a sectional view taken along line - in the figure. A cross-sectional view showing an enlarged end portion of the cutting abrasive layer, FIG. 8 is a front view showing the schematic structure of a conventional square grindstone, and FIG. 9 is a cross-sectional view taken along line ix-ix in FIG. FIG. 10 is an enlarged cross-sectional view of the terminal portion of the cutting abrasive layer shown in FIG. 8. 1, 2... Cutting wheel, 3... Base material body, 5...
Cutting abrasive layer, 7...boundary part.
Claims (1)
成した切削砥石において、前記母材本体と前記切
削砥粒層の境界部を曲線状に連続させて形成した
ことを特徴とする切削砥石。 A cutting whetstone in which a cutting abrasive layer is formed on the surface of a base material body by electrodeposition, characterized in that the boundary between the base material body and the cutting abrasive layer is formed in a continuous curved shape. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036736U JPH058050Y2 (en) | 1986-03-13 | 1986-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036736U JPH058050Y2 (en) | 1986-03-13 | 1986-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62150059U true JPS62150059U (en) | 1987-09-22 |
| JPH058050Y2 JPH058050Y2 (en) | 1993-03-01 |
Family
ID=30847422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986036736U Expired - Lifetime JPH058050Y2 (en) | 1986-03-13 | 1986-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058050Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845872A (en) * | 1981-09-11 | 1983-03-17 | Goei Seisakusho:Kk | Production method of diamond abrasive tool |
| JPS58155174A (en) * | 1982-03-10 | 1983-09-14 | Nippon Rejibon Kk | Grind stone usable for grinding and polishing |
-
1986
- 1986-03-13 JP JP1986036736U patent/JPH058050Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845872A (en) * | 1981-09-11 | 1983-03-17 | Goei Seisakusho:Kk | Production method of diamond abrasive tool |
| JPS58155174A (en) * | 1982-03-10 | 1983-09-14 | Nippon Rejibon Kk | Grind stone usable for grinding and polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058050Y2 (en) | 1993-03-01 |