JPS58448U - サイリスタ - Google Patents

サイリスタ

Info

Publication number
JPS58448U
JPS58448U JP1982076878U JP7687882U JPS58448U JP S58448 U JPS58448 U JP S58448U JP 1982076878 U JP1982076878 U JP 1982076878U JP 7687882 U JP7687882 U JP 7687882U JP S58448 U JPS58448 U JP S58448U
Authority
JP
Japan
Prior art keywords
insulating ring
control
emitter electrode
auxiliary emitter
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982076878U
Other languages
English (en)
Inventor
エルハルト・レ−マン
ハインツ・マルチン
ペ−タ・フオス
Original Assignee
シ−メンス・アクチエンゲゼルシヤフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シ−メンス・アクチエンゲゼルシヤフト filed Critical シ−メンス・アクチエンゲゼルシヤフト
Publication of JPS58448U publication Critical patent/JPS58448U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は本考案の一実施例であるサイリスタの縦断面図
、第2図、第3図は本考案の別の実施例であるサイリス
タの一部のそれぞれ縦断面図および■−■横断面図、第
4図は本考案のさらに別の実施例であるサイリスタの縦
断面図である。 1・・・上部金属板、3・・・絶縁環、6・・・半導体
素子、    10.40・・・空洞部、8. 9. 
22・・・溝、11゜12、 23. 24. 36.
 37・・・接続導体、19゜21、 2−9. 34
. 35・・・ブッシング、32・・・絶縁帽状体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属板とその間に1まさまれる絶縁環とをもつ平型容器
    と、制御電極と補助エミッタ電極を有する容器に包まれ
    る半導体素子と、この制御電極と前記絶縁環中のブッシ
    ングを電気的に接続する制御導体と、前記金属板に設け
    られ、内部にこの制御導体が配置される少なくとも1つ
    の溝とを備えるものにおいて、前記補助エミッタ電極は
    第2の制御導体と接続され、この第2の制御導体もまた
    前記溝に配置され、更にこの第2の制御導体は前記絶縁
    環中の第2のブッシングに接続され、前記金属板には制
    御導体と補助エミッタ電極に対向する空洞部に達する溝
    が配置され、絶縁環中の2つのブッシングが近接して配
    置されることを特徴とするサイリスタ。
JP1982076878U 1976-08-13 1982-05-25 サイリスタ Pending JPS58448U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19762636631 DE2636631A1 (de) 1976-08-13 1976-08-13 Thyristor
DE26366314 1976-08-13

Publications (1)

Publication Number Publication Date
JPS58448U true JPS58448U (ja) 1983-01-05

Family

ID=5985437

Family Applications (2)

Application Number Title Priority Date Filing Date
JP9653977A Pending JPS5323284A (en) 1976-08-13 1977-08-11 Thyristor
JP1982076878U Pending JPS58448U (ja) 1976-08-13 1982-05-25 サイリスタ

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP9653977A Pending JPS5323284A (en) 1976-08-13 1977-08-11 Thyristor

Country Status (11)

Country Link
US (1) US4158850A (ja)
JP (2) JPS5323284A (ja)
BR (1) BR7705338A (ja)
CA (1) CA1094693A (ja)
CH (1) CH617536A5 (ja)
CS (1) CS204006B2 (ja)
DE (1) DE2636631A1 (ja)
FR (1) FR2361746A1 (ja)
GB (1) GB1529157A (ja)
IT (1) IT1085731B (ja)
SE (1) SE7709107L (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855648Y2 (ja) * 1978-12-04 1983-12-20 三菱電機株式会社 半導体装置
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
US4305087A (en) * 1979-06-29 1981-12-08 International Rectifier Corporation Stud-mounted pressure assembled semiconductor device
US4386362A (en) * 1979-12-26 1983-05-31 Rca Corporation Center gate semiconductor device having pipe cooling means
FR2487126A1 (fr) * 1980-07-16 1982-01-22 Silicium Semiconducteur Ssc Dispositif de contact pour composant semi-conducteur, et composant semi-conducteur
JPS61208873A (ja) * 1985-03-13 1986-09-17 Res Dev Corp Of Japan 圧接構造型両面ゲ−ト静電誘導サイリスタ
EP0320618A1 (de) * 1987-12-14 1989-06-21 BBC Brown Boveri AG Gehäuse für einen abschaltbaren Leistungsthyristor (GTO)
US6501157B1 (en) * 1998-04-15 2002-12-31 Micron Technology, Inc. Substrate for accepting wire bonded or flip-chip components
EP2071621A1 (en) * 2007-12-11 2009-06-17 ABB Research Ltd. Semiconductor switching device with gate connection

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1639426A1 (de) * 1968-03-14 1971-02-25 Siemens Ag Bilateralthyristor
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
FR2131846B1 (ja) * 1971-03-30 1977-04-22 Cogie
US3896480A (en) * 1971-10-22 1975-07-22 Gen Electric Semiconductor device with housing of varistor material
BE790502A (fr) * 1971-10-26 1973-04-25 Westinghouse Electric Corp Dispositif semiconducteur encapsule a l'aide d'un elastomere
DE2246423C3 (de) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor mit scheibenförmigem Gehäuse
US3896476A (en) * 1973-05-02 1975-07-22 Mitsubishi Electric Corp Semiconductor switching device
JPS556304B2 (ja) * 1974-03-13 1980-02-15
US3975758A (en) * 1975-05-27 1976-08-17 Westinghouse Electric Corporation Gate assist turn-off, amplifying gate thyristor and a package assembly therefor

Also Published As

Publication number Publication date
BR7705338A (pt) 1978-07-04
DE2636631A1 (de) 1978-02-16
IT1085731B (it) 1985-05-28
US4158850A (en) 1979-06-19
CS204006B2 (en) 1981-03-31
CA1094693A (en) 1981-01-27
JPS5323284A (en) 1978-03-03
FR2361746A1 (fr) 1978-03-10
CH617536A5 (ja) 1980-05-30
GB1529157A (en) 1978-10-18
SE7709107L (sv) 1978-02-14

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