JPS5842937U - 半導体ウエハのポリシング装置 - Google Patents

半導体ウエハのポリシング装置

Info

Publication number
JPS5842937U
JPS5842937U JP1981136317U JP13631781U JPS5842937U JP S5842937 U JPS5842937 U JP S5842937U JP 1981136317 U JP1981136317 U JP 1981136317U JP 13631781 U JP13631781 U JP 13631781U JP S5842937 U JPS5842937 U JP S5842937U
Authority
JP
Japan
Prior art keywords
temperature measuring
polishing
semiconductor wafer
wafer
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981136317U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62843Y2 (enrdf_load_stackoverflow
Inventor
正治 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1981136317U priority Critical patent/JPS5842937U/ja
Publication of JPS5842937U publication Critical patent/JPS5842937U/ja
Application granted granted Critical
Publication of JPS62843Y2 publication Critical patent/JPS62843Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
JP1981136317U 1981-09-16 1981-09-16 半導体ウエハのポリシング装置 Granted JPS5842937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981136317U JPS5842937U (ja) 1981-09-16 1981-09-16 半導体ウエハのポリシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981136317U JPS5842937U (ja) 1981-09-16 1981-09-16 半導体ウエハのポリシング装置

Publications (2)

Publication Number Publication Date
JPS5842937U true JPS5842937U (ja) 1983-03-23
JPS62843Y2 JPS62843Y2 (enrdf_load_stackoverflow) 1987-01-09

Family

ID=29929649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981136317U Granted JPS5842937U (ja) 1981-09-16 1981-09-16 半導体ウエハのポリシング装置

Country Status (1)

Country Link
JP (1) JPS5842937U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025094443A1 (ja) * 2023-10-30 2025-05-08 株式会社Sumco ワークの研磨装置及び研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025094443A1 (ja) * 2023-10-30 2025-05-08 株式会社Sumco ワークの研磨装置及び研磨方法

Also Published As

Publication number Publication date
JPS62843Y2 (enrdf_load_stackoverflow) 1987-01-09

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