JPS5834938A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS5834938A
JPS5834938A JP56135280A JP13528081A JPS5834938A JP S5834938 A JPS5834938 A JP S5834938A JP 56135280 A JP56135280 A JP 56135280A JP 13528081 A JP13528081 A JP 13528081A JP S5834938 A JPS5834938 A JP S5834938A
Authority
JP
Japan
Prior art keywords
wire
bonding
spark
ccd
feed length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56135280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628021B2 (enrdf_load_stackoverflow
Inventor
Kazuya Noguchi
野口　一哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56135280A priority Critical patent/JPS5834938A/ja
Publication of JPS5834938A publication Critical patent/JPS5834938A/ja
Publication of JPS628021B2 publication Critical patent/JPS628021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56135280A 1981-08-27 1981-08-27 ボンデイング装置 Granted JPS5834938A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135280A JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135280A JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5834938A true JPS5834938A (ja) 1983-03-01
JPS628021B2 JPS628021B2 (enrdf_load_stackoverflow) 1987-02-20

Family

ID=15148010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135280A Granted JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5834938A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7857190B2 (en) * 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US20150243627A1 (en) * 2012-11-16 2015-08-27 Shinkawa Ltd. Wire-bonding apparatus and method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7857190B2 (en) * 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US20150243627A1 (en) * 2012-11-16 2015-08-27 Shinkawa Ltd. Wire-bonding apparatus and method of manufacturing semiconductor device
US9368471B2 (en) * 2012-11-16 2016-06-14 Shinkawa Ltd. Wire-bonding apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS628021B2 (enrdf_load_stackoverflow) 1987-02-20

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