JPS5832417A - プラズマエツチング装置及びプラズマエツチング方法 - Google Patents
プラズマエツチング装置及びプラズマエツチング方法Info
- Publication number
- JPS5832417A JPS5832417A JP13018781A JP13018781A JPS5832417A JP S5832417 A JPS5832417 A JP S5832417A JP 13018781 A JP13018781 A JP 13018781A JP 13018781 A JP13018781 A JP 13018781A JP S5832417 A JPS5832417 A JP S5832417A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- parallel
- magnetic field
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001020 plasma etching Methods 0.000 title claims description 11
- 238000005530 etching Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000010409 thin film Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- 230000005684 electric field Effects 0.000 claims abstract 4
- 230000005284 excitation Effects 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 7
- 239000010935 stainless steel Substances 0.000 abstract description 7
- 150000002500 ions Chemical class 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 239000010453 quartz Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000001312 dry etching Methods 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000010849 ion bombardment Methods 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13018781A JPS5832417A (ja) | 1981-08-21 | 1981-08-21 | プラズマエツチング装置及びプラズマエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13018781A JPS5832417A (ja) | 1981-08-21 | 1981-08-21 | プラズマエツチング装置及びプラズマエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5832417A true JPS5832417A (ja) | 1983-02-25 |
| JPH0311542B2 JPH0311542B2 (enrdf_load_stackoverflow) | 1991-02-18 |
Family
ID=15028151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13018781A Granted JPS5832417A (ja) | 1981-08-21 | 1981-08-21 | プラズマエツチング装置及びプラズマエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832417A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58225637A (ja) * | 1982-06-23 | 1983-12-27 | Sony Corp | イオンビ−ム装置 |
| JPS6214429A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Ltd | 表面処理方法及び表面処理装置 |
| WO1999035667A1 (en) * | 1998-01-09 | 1999-07-15 | E.I. Du Pont De Nemours And Company | Plasma treatment for producing electron emitters |
| WO2003003403A1 (en) * | 2001-06-29 | 2003-01-09 | Lam Research Corporation | Configurable plasma volume etch chamber |
| US7459098B2 (en) | 2002-08-28 | 2008-12-02 | Kyocera Corporation | Dry etching apparatus, dry etching method, and plate and tray used therein |
| US7556741B2 (en) | 2002-08-28 | 2009-07-07 | Kyocera Corporation | Method for producing a solar cell |
| US7556740B2 (en) | 2002-08-27 | 2009-07-07 | Kyocera Corporation | Method for producing a solar cell |
| JP2010087009A (ja) * | 2008-09-29 | 2010-04-15 | Kyocera Corp | エッチング装置 |
-
1981
- 1981-08-21 JP JP13018781A patent/JPS5832417A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58225637A (ja) * | 1982-06-23 | 1983-12-27 | Sony Corp | イオンビ−ム装置 |
| JPS6214429A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Ltd | 表面処理方法及び表面処理装置 |
| WO1999035667A1 (en) * | 1998-01-09 | 1999-07-15 | E.I. Du Pont De Nemours And Company | Plasma treatment for producing electron emitters |
| WO2003003403A1 (en) * | 2001-06-29 | 2003-01-09 | Lam Research Corporation | Configurable plasma volume etch chamber |
| US6527911B1 (en) | 2001-06-29 | 2003-03-04 | Lam Research Corporation | Configurable plasma volume etch chamber |
| CN1309000C (zh) * | 2001-06-29 | 2007-04-04 | 兰姆研究有限公司 | 可控制等离子体容积的蚀刻室 |
| US7556740B2 (en) | 2002-08-27 | 2009-07-07 | Kyocera Corporation | Method for producing a solar cell |
| US7459098B2 (en) | 2002-08-28 | 2008-12-02 | Kyocera Corporation | Dry etching apparatus, dry etching method, and plate and tray used therein |
| US7556741B2 (en) | 2002-08-28 | 2009-07-07 | Kyocera Corporation | Method for producing a solar cell |
| JP2010087009A (ja) * | 2008-09-29 | 2010-04-15 | Kyocera Corp | エッチング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311542B2 (enrdf_load_stackoverflow) | 1991-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4431473A (en) | RIE Apparatus utilizing a shielded magnetron to enhance etching | |
| US4826585A (en) | Plasma processing apparatus | |
| US4233109A (en) | Dry etching method | |
| EP0084970B1 (en) | Magnetically enhanced plasma process and apparatus | |
| TWI333225B (en) | Method and apparatus to confine plasma and to enhance flow conductance | |
| US4521286A (en) | Hollow cathode sputter etcher | |
| US4277304A (en) | Ion source and ion etching process | |
| JPH1055983A (ja) | ファラデー・スパッタ・シールドを有する誘導結合されたプラズマリアクタ | |
| JP2000269196A (ja) | プラズマ処理方法及びプラズマ処理装置 | |
| CN106548918A (zh) | 一种射频和直流混合驱动的磁化容性耦合等离子体源 | |
| JPH1012597A (ja) | プラズマエッチング装置及びプラズマエッチング方法 | |
| JPS5832417A (ja) | プラズマエツチング装置及びプラズマエツチング方法 | |
| JPS6136589B2 (enrdf_load_stackoverflow) | ||
| US6096176A (en) | Sputtering method and a sputtering apparatus thereof | |
| JP2761172B2 (ja) | プラズマ発生装置 | |
| KR101124178B1 (ko) | 가스 원자 내포 플러렌의 제조 장치 및 제조 방법 그리고가스 원자 내포 플러렌 | |
| JPS5822381A (ja) | プラズマエツチング方法およびそのための装置 | |
| JP2006253190A (ja) | 中性粒子ビーム処理装置および帯電電荷の中和方法 | |
| JP2929150B2 (ja) | プラズマ装置 | |
| JPS6348826A (ja) | ドライエツチング装置 | |
| GB2049560A (en) | Plasma etching | |
| JP3220528B2 (ja) | 真空処理装置 | |
| JPS6094724A (ja) | ドライエツチング装置 | |
| JP3668535B2 (ja) | エッチング装置 | |
| Wickramanayaka et al. | Magnetically Enhanced Dual Frequency Capacitively Coupled Plasma Source for Large-area Wafer Processing |