JPS5831566A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5831566A JPS5831566A JP56129049A JP12904981A JPS5831566A JP S5831566 A JPS5831566 A JP S5831566A JP 56129049 A JP56129049 A JP 56129049A JP 12904981 A JP12904981 A JP 12904981A JP S5831566 A JPS5831566 A JP S5831566A
- Authority
- JP
- Japan
- Prior art keywords
- dummy
- leads
- internal
- lead
- internal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56129049A JPS5831566A (ja) | 1981-08-18 | 1981-08-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56129049A JPS5831566A (ja) | 1981-08-18 | 1981-08-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831566A true JPS5831566A (ja) | 1983-02-24 |
| JPS628019B2 JPS628019B2 (enrdf_load_stackoverflow) | 1987-02-20 |
Family
ID=14999816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56129049A Granted JPS5831566A (ja) | 1981-08-18 | 1981-08-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831566A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373971U (enrdf_load_stackoverflow) * | 1986-10-31 | 1988-05-17 | ||
| JPS6414934A (en) * | 1987-07-09 | 1989-01-19 | Toshiba Corp | Semiconductor integrated circuit device and film carrier tape |
| JPH0367434U (enrdf_load_stackoverflow) * | 1989-10-31 | 1991-07-01 | ||
| US5243141A (en) * | 1990-11-28 | 1993-09-07 | Ibm Corporation | Tab tape, method of bonding tab tape and tab tape package |
-
1981
- 1981-08-18 JP JP56129049A patent/JPS5831566A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373971U (enrdf_load_stackoverflow) * | 1986-10-31 | 1988-05-17 | ||
| JPS6414934A (en) * | 1987-07-09 | 1989-01-19 | Toshiba Corp | Semiconductor integrated circuit device and film carrier tape |
| JPH0367434U (enrdf_load_stackoverflow) * | 1989-10-31 | 1991-07-01 | ||
| US5243141A (en) * | 1990-11-28 | 1993-09-07 | Ibm Corporation | Tab tape, method of bonding tab tape and tab tape package |
| US5394675A (en) * | 1990-11-28 | 1995-03-07 | International Business Machines Corp. | Tab tape, method of bonding tab tape and tab tape package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628019B2 (enrdf_load_stackoverflow) | 1987-02-20 |
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