JPS5826665B2 - wire bonding method - Google Patents
wire bonding methodInfo
- Publication number
- JPS5826665B2 JPS5826665B2 JP52124475A JP12447577A JPS5826665B2 JP S5826665 B2 JPS5826665 B2 JP S5826665B2 JP 52124475 A JP52124475 A JP 52124475A JP 12447577 A JP12447577 A JP 12447577A JP S5826665 B2 JPS5826665 B2 JP S5826665B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- tool
- bonding method
- clamper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は半導体のペレットと外部リードとの間を超音波
ワイヤボンディング装置のツールに挿通されたＡ７線等
のワイヤで接続するワイヤボンディング方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding method for connecting a semiconductor pellet and an external lead with a wire such as an A7 wire inserted through a tool of an ultrasonic wire bonding apparatus.
従来の超音波ワイヤボンディング装置は、細線用Ａ７線
を対象として開発されたもので、太線用ＡＡ線を使用し
てボンディングをすることは不可能である。Conventional ultrasonic wire bonding equipment was developed for thin A7 wire, and it is impossible to bond using thick AA wire.
そこで、太線用ＡＡ線をボンディングする場合はペレッ
トにボンディングし、外部リード上でＡｌ線をカッター
にて切断する動作を繰返してペレットのみをボンディン
グし、後で外部リードのみをスポット溶接するなどの特
殊な方法がとられていた。Therefore, when bonding a thick AA wire, it is necessary to bond it to a pellet, repeat the operation of cutting the Al wire with a cutter on the external lead, bond only the pellet, and then spot weld only the external lead later. A method was used.
このように太線用Ａｌ線をボンディングする作業は時間
的なロスが大きく非能率的であった。The work of bonding thick Al wires in this way involves a large amount of time loss and is inefficient.
本発明は上記従来の欠点に鑑みなされたもので、太線用
Ａｌ線をボンディングする場合でも細線用Ａｌ線のボン
ディングと同様に自動化が可能なワイヤボンディング方
法を提供することを目的とする。The present invention was made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to provide a wire bonding method that can be automated in the same way as bonding of thin Al wires even when bonding thick Al wires.
以下本発明を図示の実施例に基づいて説明する。The present invention will be explained below based on illustrated embodiments.
図は本発明になるワイヤボンディング方法の一実施例を
示す動作説明図である。The figure is an operational explanatory diagram showing an embodiment of the wire bonding method according to the present invention.
１はペレット、２は外部リード、３はＡＡ線、４は図示
しないボンディングヘッドに取付けられた超音波発振ホ
ーン、５は超音波発振ホーン４に保持されたツール、６
はＡｌ線３を繰出し及び切断するクランパーである。1 is a pellet, 2 is an external lead, 3 is an AA wire, 4 is an ultrasonic oscillation horn attached to a bonding head (not shown), 5 is a tool held by the ultrasonic oscillation horn 4, 6
is a clamper that feeds out and cuts the Al wire 3.
次にその動作について説明する。Next, its operation will be explained.
まず第１図の如く図示しないスプールから繰出されたＡ
ｌ線３はツール５の先端下まで延出しており、クランパ
ー６がＡｌ線３を保持しペレット１の上に停止している
。First, as shown in Figure 1, A is fed out from a spool (not shown).
The Al wire 3 extends to below the tip of the tool 5, and a clamper 6 holds the Al wire 3 and stops on the pellet 1.
この状態より第２図の如く図示しないボンディングヘッ
ドの駆動により超音波発振ホーン４に保持されたツール
５が下降し、ペレット１にＡｌ線３をはさみ込む形で接
地し超音波発振によってボンディングする。From this state, as shown in FIG. 2, the tool 5 held by the ultrasonic oscillation horn 4 is lowered by driving a bonding head (not shown), and the aluminum wire 3 is sandwiched between the pellet 1 and grounded, and bonded by ultrasonic oscillation.
ボンディング完了後、Ａｌ線３を保持していたクランパ
ー６が開く。After the bonding is completed, the clamper 6 holding the Al wire 3 opens.
そして第３図の如く図示しないボンディングヘッドの駆
動により超音波発振ホーン４に保持されたツール５が上
昇し、その後図示しないＸＹ駆動機構により外部リード
２上に移動する。Then, as shown in FIG. 3, the tool 5 held by the ultrasonic oscillation horn 4 is raised by driving a bonding head (not shown), and then moved onto the external lead 2 by an XY drive mechanism (not shown).
ツール５が移動している間にクランパー６は繰出し下限
位置６ａから切断位置６ｂへ移動する。While the tool 5 is moving, the clamper 6 moves from the lower limit feeding position 6a to the cutting position 6b.
次に第４図の如く図示しないボンディングヘッドの駆動
により超音波発振ホーン４に保持されたツール５が下降
し、外部リード２にＡｌ線３をはさみ込む形で接地し超
音波発振によってボンディングする。Next, as shown in FIG. 4, the tool 5 held by the ultrasonic oscillation horn 4 is lowered by driving a bonding head (not shown), and the aluminum wire 3 is grounded between the external leads 2 and bonded by ultrasonic oscillation.
ボンディング完了後、第５図の如く図示しないＸＹ駆動
機構によりＡｌ線３挿通方向に超音波発振ホーン４に保
持されたツール５をボンディング部分からずらし、再び
ボンディング時の超音波発振よりも強い超音波発振によ
ってＡｌ線３をつぶし切れ易すくする。After the bonding is completed, as shown in FIG. 5, the tool 5 held by the ultrasonic oscillation horn 4 is moved from the bonding area in the direction of insertion of the Al wire 3 by an XY drive mechanism (not shown), and the ultrasonic wave stronger than the ultrasonic oscillation during bonding is again generated. The oscillation makes the Al wire 3 easier to crush and break.
超音波発振完了後、クランパー６が閉じてＡｌ線３を保
持する。After the ultrasonic oscillation is completed, the clamper 6 closes and holds the Al wire 3.
クランパー６がＡｌ線３を保持した後、第６図の如くク
ランパー６は切断位置６ｂから上限６ｃにツールからｌ
線がはずれない程度移動してＡｌ線３を切断する。After the clamper 6 holds the Al wire 3, the clamper 6 moves from the tool to the upper limit 6c from the cutting position 6b as shown in FIG.
The Al wire 3 is cut by moving to an extent that the wire does not come off.
その後第７図の如く図示しないボンディングヘッドの駆
動により超音波発振ホーン４に保持されたツール５が上
昇する。Thereafter, as shown in FIG. 7, the tool 5 held by the ultrasonic oscillation horn 4 is raised by driving a bonding head (not shown).
ツール５が上昇完了後、第８図の如くＡｌ線３を保持し
たクランパー６は上限６ｃから繰出し下限位置６ａに移
動しツール５の先端下にＡｌ線３を繰出す。After the tool 5 has completed its ascent, the clamper 6 holding the Al wire 3 moves from the upper limit 6c to the lower limit position 6a and feeds out the Al wire 3 below the tip of the tool 5, as shown in FIG.
その後図示しないＸＹ駆動機構により超音波発振ホーン
４に保持されたツール５は、ペレットの次のバット上に
移動し、第１図の状態となる。Thereafter, the tool 5 held by the ultrasonic oscillation horn 4 by an XY drive mechanism (not shown) is moved onto the next vat of pellets, resulting in the state shown in FIG. 1.
この様に第１図から第８図までの動作を繰返えすことに
よって、１ケの半導体部品のボンディングが完了する。By repeating the operations from FIG. 1 to FIG. 8 in this manner, bonding of one semiconductor component is completed.
以上の説明から明らかな様に、本発明になるワイヤボン
ディング方法によれば、Ａｌ線の径に関係なく自動的に
超音波によるワイヤボンディングをする事ができる。As is clear from the above description, according to the wire bonding method of the present invention, wire bonding can be automatically performed using ultrasonic waves regardless of the diameter of the Al wire.
図は本発明になるワイヤボンディング方法の一実施例を
示し、第１図乃至第８図は動作説明図である。
１・・・・・・ペレット、２・・・・・・外部リード、
３・・・・・・Ａｌ線、４・・・・・・超音波発振ホー
ン、５・・・・・・ツール、６・・・・・・クランパー
。The figure shows an embodiment of the wire bonding method according to the present invention, and FIGS. 1 to 8 are explanatory diagrams of the operation. 1...Pellet, 2...External lead,
3... Al wire, 4... Ultrasonic oscillation horn, 5... Tool, 6... Clamper.
Claims (1)
ィング装置のツールに挿通されたワイヤで接続するワイ
ヤボンディング方法において、第２ボンディング位置で
ある外部リードにボンディングした後、ツールをワイヤ
挿通方向に少しずらし、更にボンディングより強い発振
をかけることによってワイヤをつぶして切れ易くし、そ
の後クランパーで引張ってワイヤを切断するワイヤボン
ディング方法。1 In a wire bonding method in which a pellet and an external lead are connected by a wire inserted through a tool of an ultrasonic wire bonding device, after bonding to the external lead which is the second bonding position, the tool is slightly shifted in the wire insertion direction. , a wire bonding method that crushes the wire to make it easier to break by applying a stronger oscillation than bonding, and then pulls it with a clamper to cut the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52124475A JPS5826665B2 (en) | 1977-10-19 | 1977-10-19 | wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52124475A JPS5826665B2 (en) | 1977-10-19 | 1977-10-19 | wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5458353A JPS5458353A (en) | 1979-05-11 |
| JPS5826665B2 true JPS5826665B2 (en) | 1983-06-04 |
Family
ID=14886429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52124475A Expired JPS5826665B2 (en) | 1977-10-19 | 1977-10-19 | wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826665B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5867189U (en) * | 1981-10-29 | 1983-05-07 | 株式会社エポゾ−ル | pipe cover |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5032958B2 (en) * | 1972-03-27 | 1975-10-25 | ||
| JPS5267262A (en) * | 1975-12-01 | 1977-06-03 | Seiko Epson Corp | Wire bonding method and its device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5032958U (en) * | 1973-07-20 | 1975-04-10 |
-
1977
- 1977-10-19 JP JP52124475A patent/JPS5826665B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5032958B2 (en) * | 1972-03-27 | 1975-10-25 | ||
| JPS5267262A (en) * | 1975-12-01 | 1977-06-03 | Seiko Epson Corp | Wire bonding method and its device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5458353A (en) | 1979-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61125062A (en) | Method and device for attaching pin | |
| DE68902904D1 (en) | QUALITY CONTROL IN WIRE BINDING. | |
| US5797388A (en) | Wire-bonding apparatus and method using a covered wire | |
| JP2530224B2 (en) | Wire bonding method | |
| US4597520A (en) | Bonding method and means | |
| JPS5826665B2 (en) | wire bonding method | |
| US5056217A (en) | Method for manufacturing semiconductor elements equipped with leads | |
| JPS6256659B2 (en) | ||
| JPS6052585B2 (en) | wire bonding method | |
| JPS5855665B2 (en) | wire bonding method | |
| JPH0530058B2 (en) | ||
| JPH05226428A (en) | Wire bonding method | |
| JP3372313B2 (en) | Wire bonding equipment | |
| JP2574054B2 (en) | Wire bonder and wire bonding method | |
| JPH0617291Y2 (en) | Wire-bonding equipment | |
| JPS6138186Y2 (en) | ||
| JPS5925377B2 (en) | Wire bonding method | |
| JPS61105850A (en) | Wire bonding method | |
| JPS6056288B2 (en) | wire bonding equipment | |
| JPH1012652A (en) | Wire bonding method | |
| JP2978852B2 (en) | Wire bonding connection method for semiconductor device | |
| JPS5879728A (en) | Wire bonding method | |
| JPS5943732Y2 (en) | Wedge for wire bonding equipment | |
| JPS62126643A (en) | Wire bonding method | |
| JP3369764B2 (en) | Torch electrode body for discharge in wire bonding equipment |