JPS5943732Y2 - Wedge for wire bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a wedge for wire bonding equipment.

As is well known, a wire bonding device is equipped with a wedge provided with a guide hole that guides the wire diagonally or a guide hole provided with a guide hole that guides the wire vertically as a tool for bonding the wire to the sample. A capillary is used.

The present invention is directed to the former wedge, and FIG. 1 shows an outline of a well-known wire bonding apparatus using this wedge, and FIG. 2 shows a partially cutaway cross section of the conventional wedge.

Since a wire bonding device using such a wedge can perform wire bonding only in a fixed direction, the sample stage 2 on which the material 1 is positioned and placed can be rotated so that the first bonding point and the second bonding point are always lined up in one direction. It looks like this.

The wedge 3 is attached to the tip of a hoe 75 that is driven up and down by a bonding head 4, and the bonding head 4 is moved on an XY screen by an XY table 6.

Further, the wedge 3 is provided with a guide hole 3a inclined downward from the side surface through which the wire 7 is inserted. The clamper 9 and the wedge 30 are guided to the bottom surface 3b of the tip of the wedge 3 through the guide hole 3a.

Therefore, by operating the Chessman 10 to move the XY table 6 and aligning an arbitrary fixed point on the sample 1 with a mark projected on the monitor (not shown) using a camera (not shown) fixed on the bonding head 4, the sample A microcomputer (not shown) automatically calculates the bonding position from the amount of deviation of 1, and thereafter all bonding points are automatically bonded according to the operation shown in FIG.

That is, the sample stage 2 rotates, the first bonding point and the second bonding point are aligned in one direction, and at the same time the XY table 6 moves to position the wedge 3 above the first bonding point, and the bonding head 4 is aligned. The wedge 3 is driven downward to bond the tip of the wire I to the first bonding point 1a as shown in FIG. 3a, and at the same time the clamper 9 is opened.

Next, the wedge 3 and the clamper 9 are raised by the drive of the bonding head 4, and positioned above the second bonding point by the movement of the XY table 6, and then the wedge 3 and the clamper 9 are lowered by the drive of the bonding head 4. As shown in the figure, bonding is performed at the second bonding point 1b.

Next, the wire 1 is held by the clamper 9, and the clamper 9 moves diagonally backward to hold the wedge 3 as shown in FIG.
Cut the wire T from the end of the bottom surface 3b of the tip.

Next, the wedge 3 and the clamper 9 are raised by driving the bonding head 4, and the clamper 9 is further moved obliquely forward to feed out the wire T below the lower surface 3b of the wedge 30.

This completes pair bonding.

In this way, in the conventional wedge 3, the first bonding (FIG. 3a) and the second bonding (FIG. 3b) are bonded on the same lower surface 3b, making wire cutting (FIG. 3C) easy. If the edge 3c of the capillary 3 is made acute in order to achieve this, the neck during the first bonding will be weakened.

On the other hand, if the edge 3c of the capillary 3 is made to have a large radius in order to strengthen the neck during the first bonding, there is a drawback that it becomes difficult to cut the wire during the second bonding.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a wedge for a wire bonding device that eliminates the drawbacks of the prior art described above.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 4 shows an embodiment of the wedge according to the present invention, in which a is a front view and b is a partially cutaway side view.

The wedge 11 is formed with a guide hole 11a that is inclined downward from the side surface and through which the wire 7 is inserted.
A first bonding lower surface 11b is formed on the lower surface on the side 1a, and a second bonding lower surface 11c is further formed on the lower surface on the side remote from the guide hole 11a so as to protrude from the first bonding lower surface 11b.

Further, at the end of the second bonding lower surface 11c on the first bonding lower surface 11b side, a cutter portion 11d protrudes downward.
is formed.

FIG. 5 is an explanatory diagram showing a bonding process using the wedge 11 having such a structure.

Note that each step of ay by (!t d in FIG. 5 corresponds to as b and C* d in FIG. 3, respectively, and the vertical movement and XY on-screen movement of the wedge 11 for bonding are as shown in FIG. Since it is the same as in the case of
The explanation will be omitted here as it would be redundant.

As mentioned above, since the wedge 11 is a two-stage type, as shown in FIG. 5a, the wire 1 is connected to the first bonding point 1a.
When bonding the tip of the first bonding bottom surface 1
The first ponding is performed by 1b.

As shown in the figure, when bonding the wire 1 to the second bonding point 1b, since the second bonding lower surface 11c protrudes from the first bonding lower surface 11b, the second bonding point 11c is used to bond the wire 1 to the second bonding point 1b. Ru.

At the same time, since the wire is damaged by the cutter part 11d, the wire is easily cut by the cutter part 11d when cutting the wire, as shown in FIG.

Finally, the tip of the wire 7 is connected to the first
By feeding it out to the bonding lower surface 11b, preparation for the first bonding point for next bonding is completed.

Here, the cutter part 11d does not need to be provided, but if this cutter part 11d is provided, wire cutting becomes easier.

As is clear from the above explanation, if you pay 1 yen for the wire bonding device wedge according to the present invention, bonding is performed on different lower surfaces during the first bonding and during the second bonding, so the wire neck part of the first bonding is strong. , In the second bonding, bonding can be performed to facilitate wire cutting.

In addition, a portion of the cutter protruding downward is formed at the end of the lower surface of the second bonding on the side of the lower surface of the first bonding.
Wires can be easily cut.

In particular, this effect is more effective for solar wires.

[Brief explanation of drawings]

Figure 1 is a schematic diagram of a wire bonding device, Figure 2 is a side view with a partially cutaway cross section of a conventional wedge, and Figure 3 a.
, be e+ d is an explanatory diagram showing a bonding process using the wedge shown in FIG. 2, FIG. 4 shows an embodiment of the wedge according to the present invention, a is a front view, and b is a partially cutaway sectional view. Side view shown in Figure 5 as be ct
d is an explanatory view showing a bonding process using the wedge shown in FIG. 4; 1...Test M, 1a...1st bonding point, 1b...2nd bonding point, 1...
...wire, 11...wedge, 11a/curve/guide hole, 11b...first bonding lower surface,
11c/old/second bonding bottom surface.

Claims (1)

[Scope of utility model registration request] In a wedge for a wire bonding device that guides a wire to the lower surface of the tip through a guide hole formed at an angle downward from the side surface and connects the wire between a first bonding point and a second bonding point, the lower surface of this wedge is A first bonding lower surface is formed on the guide hole side, and a second bonding surface protruding from the first bonding lower surface is formed on the side remote from the guide hole.
A wedge for a wire bonding apparatus, comprising a lower bonding surface, and a cutter part protruding downwardly formed at an end of the second bonding lower surface on the side of the first bonding lower surface.