JPH05861B2 - - Google Patents
Info
- Publication number
- JPH05861B2 JPH05861B2 JP63194618A JP19461888A JPH05861B2 JP H05861 B2 JPH05861 B2 JP H05861B2 JP 63194618 A JP63194618 A JP 63194618A JP 19461888 A JP19461888 A JP 19461888A JP H05861 B2 JPH05861 B2 JP H05861B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge
- bonding
- length
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000630 rising effect Effects 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 11
- 230000001788 irregular Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ワイヤを挿通するガイド孔を先端面
に対して傾斜して備え、ワイヤが先端面下方に傾
斜して繰り出されるボンデイングウエツジ（以下
ウエツジと略）を用いて超音波によりワイヤボン
デイングを行うワイヤボンデイング方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding wedge (industrial application field) which is provided with a guide hole through which a wire is inserted and is inclined with respect to the distal end surface, and in which the wire is paid out at an angle downward from the distal end surface. The present invention relates to a wire bonding method in which wire bonding is performed using ultrasonic waves using a wedge (hereinafter abbreviated as wedge).
従来多用されているウエツジ１１は第４図ａに
示すようにガイド孔３１は先端面４１に対して約
30〜45°の傾きに形成されていて、ボンデイング
を行うときはウエツジ１１をボンデイング部の直
上部に位置せしめ、矢印１２のように真下に下降
せしめて超音波振動を印加していた。
As shown in FIG. 4a, the wedge 11 that has been widely used in the past has a guide hole 31 that is located approximately at a distance from the tip surface 41.
The wedge 11 is formed at an angle of 30 to 45 degrees, and when performing bonding, the wedge 11 is positioned directly above the bonding portion and moved downward as shown by the arrow 12 to apply ultrasonic vibrations.
従つて、ワイヤ２の繰り出し角が約30〜45°と
なるので基板６にある電子部品などにワイヤ２が
当たる場合があり不都合であつた。 Therefore, since the wire 2 is fed out at an angle of approximately 30 to 45 degrees, the wire 2 may hit electronic components on the board 6, which is inconvenient.
この不都合は、第４図ｂに示すように先端面４
に対して例えば約60°の傾きでガイド孔３を有す
るウエツジ１を用いれば少なくすることができ
る。 This inconvenience is caused by the distal end surface 4 as shown in FIG. 4b.
For example, by using a wedge 1 having a guide hole 3 at an angle of about 60°, the number of holes can be reduced.
ところが、このように大きな傾きでガイド孔３
を備えているウエツジ１を用いてワイヤボンデイ
ングを行おうとすれば、ワイヤ２がボンデイング
に所要の長さｌ（第１ボンデイングしろ）だけウ
エツジ１の先端面４から斜めに繰り出されている
状態からICチツプ１５のパツド７を第１ボンデ
イング部としてボンデイングを行う第１ボンデイ
ングにおいては、ワイヤ２の先端の第１ボンデイ
ングしろのICチツプ１５に対する傾きもガイド
孔３と同じ角の大きな傾きとなる。
However, with such a large inclination, the guide hole 3
If wire bonding is to be performed using wedge 1 equipped with In the first bonding process in which bonding is performed using the pad 7 of the chip 15 as the first bonding part, the inclination of the first bonding margin of the tip of the wire 2 with respect to the IC chip 15 also has a large inclination of the same angle as the guide hole 3.
従つて、ウエツジ１を矢印１２のように真下に
下降せしめてもワイヤ２はその先端から長さｌだ
け手前の部分で折れ曲りにくく、ウエツジ１の下
降に伴つてワイヤ２が撓みながら相対的にガイド
孔３の中に逃げて戻つてしまい、ボンデイングに
所要の長さｌのワイヤ２をウエツジ１の先端面４
とICチツプ１５のパツド７との間に挟圧するこ
とができない状態となつてしまう。これを避けよ
うとすればパツド７から大きく外側にはみ出す長
さだけワイヤ２を繰り出せばよいが、そうすると
はみ出させたワイヤ先端がシヨートすることもあ
り、またワイヤ２も無駄になる欠点がある。 Therefore, even if the wedge 1 is lowered straight down as shown by the arrow 12, the wire 2 is difficult to bend at the portion in front of the tip by a length l, and as the wedge 1 is lowered, the wire 2 bends and bends relatively. The wire 2 having the length l required for bonding is inserted into the tip surface 4 of the wedge 1.
This results in a situation in which it is impossible to press the pad 7 of the IC chip 15 between the IC chip 15 and the pad 7 of the IC chip 15. If you want to avoid this, you can let out the wire 2 by a length that protrudes outward from the pad 7, but if you do so, the tip of the protruding wire may be shot off, and the wire 2 is also wasted.
本発明者は上述の従来の問題点を解決するため
に特願昭62−199039号でワイヤ先端を予め第１ボ
ンデイングに要する長さだけウエツジ１の先端面
に沿わしめ、第１ボンデイングしろを予め折曲形
成しておく方法を提案しているが、本発明はそれ
をさらに改善しようとするものである。 In order to solve the above-mentioned conventional problems, the present inventor proposed in Japanese Patent Application No. 62-199039 that the tip of the wire was aligned in advance along the tip surface of the wedge 1 by the length required for the first bonding, and the margin for the first bonding was made in advance. Although a method of forming a bend is proposed, the present invention aims to further improve this method.
本発明は、ウエツジを用いてワイヤボンデイン
グを行うワイヤボンデイング方法において、第２
ボンデイング部の超音波印加の終了後ウエツジを
次の第１ボンデイングに要するワイヤの長さｌと
同じ距離だけ前方上方に斜めに又は真上に上昇さ
せてウエツジをワイヤに対して後退せしめて第２
ボンデイング部から連続しているワイヤのその立
ち上がり基部からウエツジまでのワイヤの長さを
ｌとし、次いでウエツジを相対的に真下に又は前
方下方に下降せしめてワイヤをその立ち上り基部
から長さｌだけ手前の部分で折曲し、次いでウエ
ツジのワイヤに対する後退を阻止した状態でウエ
ツジを相対的に前方に移動せしめてワイヤを前記
第２ボンデイング部からの立ち上がり基部で切断
し、その後、ウエツジを次の第１ボンデイング部
に移動せしめることを特徴とするワイヤボンデイ
ング方法である。
The present invention provides a second wire bonding method for wire bonding using a wedge.
After the application of ultrasonic waves to the bonding part is completed, the wedge is raised forward and upward diagonally or directly upward by a distance equal to the length l of the wire required for the next first bonding, and the wedge is retreated from the wire, and then the second bonding is performed.
Let the length of the wire from the rising base of the wire that is continuous from the bonding part to the wedge be l, and then lower the wedge relatively straight down or forward and downward to move the wire a length l from the rising base. Then, while preventing the wedge from retreating relative to the wire, the wedge is moved relatively forward to cut the wire at the base rising from the second bonding part. This is a wire bonding method characterized by moving the wire to one bonding section.
なお、本明細書においては、第１ボンデイング
部から第２ボンデイング部へウエツジをボンデイ
ング移動せしめるときに進行方向に臨む側面をウ
エツジの前面とし、従つてウエツジの前方とはこ
の前面の臨んだ方向をいい、反対方向を後方とい
う。 In this specification, the front side of the wedge is the side facing in the direction of movement when the wedge is bonded and moved from the first bonding part to the second bonding part, and therefore, the front of the wedge refers to the direction in which this front face faces. Okay, the opposite direction is called backward.
本発明は、第２ボンデイング部の超音波印加の
終了後ウエツジを次の第１ボンデイングに要する
ワイヤの長さｌと同じ距離だけ前方上方に斜めに
又は真上に上昇させてウエツジをワイヤに対して
後退せしめて第２ボンデイング部から連続してい
るワイヤのその立ち上がり基部からウエツジまで
のワイヤの長さをｌとし、次いでウエツジを相対
的に真下に又は前方下方に下降せしめてワイヤを
その立ち上り基部から長さｌだけ手前の部分で折
曲し、次いでウエツジのワイヤに対する後退を阻
止した状態でウエツジを相対的に前方に移動せし
めてワイヤを前記第２ボンデイング部からの立ち
上がり基部で切断し、その後、ウエツジを次の第
１ボンデイング部に移動せしめるので、急な傾斜
のガイド孔を有するウエツジを用いてボンデイン
グを行うときであつても、第１ボンデイング部の
ボンデイングに際してウエツジを真直に下降させ
ればワイヤの先端部は所定長ｌだけ確実に第１ボ
ンデイング部とウエツジの先端面との間に挟圧さ
れ、確実にボンデイングされる。
In the present invention, after the application of ultrasonic waves to the second bonding section is completed, the wedge is raised forward and upward diagonally or directly upward by a distance equal to the length l of the wire required for the next first bonding, and the wedge is placed against the wire. The length of the wire from the rising base of the wire continuous from the second bonding part to the wedge is set as l, and then the wedge is lowered relatively straight down or forward downward to move the wire from the rising base. Then, while preventing the wedge from retreating relative to the wire, the wedge is moved relatively forward to cut the wire at the base rising from the second bonding part, and then , the wedge is moved to the next first bonding section, so even when bonding is performed using a wedge with a steeply sloped guide hole, it is possible to move the wedge straight down when bonding the first bonding section. The tip of the wire is reliably pressed by a predetermined length l between the first bonding part and the tip end surface of the wedge, thereby ensuring secure bonding.
この場合、出願人提出に係る特願昭62−199039
号の発明はワイヤ繰り出し機構でワイヤを切断
し、その後ワイヤ繰り出し機構でワイヤの繰り出
しを行うものであつたのでワイヤとガイド孔との
ガタ、ワイヤ繰り出し機構のバラツキ等により、
ワイヤの繰り出し量のバラツキ、折曲点のズレ、
折曲形成した第１ボンデイングしろの横方向への
曲りなどが生じるおそれがあつたが、本発明は第
２ボンデイング部からワイヤを連続させたままで
先ずウエツジを相対的に上昇させることにより第
２ボンデイング部とウエツジとの間のワイヤの長
さをｌとする（ワイヤは第１ボンデイングしろで
ある所定長ｌだけウエツジから突出したこととな
る）。次いでウエツジを再び相対的に下降させて
ワイヤをその立ち上り基部から長さｌだけ手前の
部分で折曲しておく。その後、ウエツジのワイヤ
に対する後退を阻止した状態でウエツジを相対的
に前方に移動せしめてワイヤを立ち上がり基部で
切断する。従つて、ワイヤの繰り出し量のバラツ
キ、折曲点のズレ、折曲形成した第１ボンデイン
グしろの横方向への曲りなどが生じるおそれがな
く、また所要動作も少なく、ワイヤ繰り出し機構
も不要である。 In this case, the patent application No. 62-199039 submitted by the applicant
In the invention of No. 1, the wire is cut by a wire feeding mechanism, and then the wire is fed out by the wire feeding mechanism.
Variation in wire payout amount, misalignment of bending point,
There was a risk that the bent first bonding margin would be bent in the lateral direction, but in the present invention, the second bonding margin is formed by first relatively raising the wedge while keeping the wire continuous from the second bonding section. Let the length of the wire between the part and the wedge be l (the wire protrudes from the wedge by a predetermined length l, which is the first bonding margin). Then, the wedge is lowered relatively again and the wire is bent a length l from the rising base. Thereafter, the wedge is moved relatively forward while the wedge is prevented from retreating relative to the wire, and the wire is cut at the rising base. Therefore, there is no risk of variations in the amount of wire being fed out, deviation of the bending point, bending of the bent first bonding margin in the lateral direction, etc., and the required operations are small, and a wire feeding mechanism is not required. .
本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.
第１〜３図において、ウエツジ１はワイヤ２を
挿通するガイド孔３を先端面４に対して45°〜
90°、本実施例では例えば60°、傾斜させて備え、
従来公知の構成の超音波ボンデイング装置に取り
付けられている。即ち、ウエツジ１はホーンの先
端に取り付けられており、クランプ５と一体に、
基板６に対して相対的に、水平面上でのＸ方向移
動、水平面上での、Ｘ方向と直角の方向のＹ方向
移動、Ｘ，Ｙ方向それぞれに直角の方向のＺ方向
移動（上下動）、基板６に固着したICチツプ１５
上の第１ボンデイング部であるパツド７と基板６
上の第２ボンデイング部８を結ぶ線をＹ方向に一
致させるθ回動が可能である。ウエツジ１とクラ
ンプ５は上述の如く一体に運動するようにしてあ
れば駆動部は共通であつてもそれぞれ別個に設け
てもよい。またクランプ５はガイド孔３の延長線
上に設けられている。 In Figures 1 to 3, the wedge 1 has a guide hole 3 through which the wire 2 is inserted at an angle of 45° to the distal end surface 4.
Provided at an angle of 90°, for example 60° in this example,
It is attached to an ultrasonic bonding device having a conventionally known configuration. That is, the wedge 1 is attached to the tip of the horn, and is integrated with the clamp 5.
Relative to the substrate 6, movement in the X direction on the horizontal plane, movement in the Y direction in the direction perpendicular to the X direction on the horizontal plane, movement in the Z direction (vertical movement) in the direction perpendicular to each of the X and Y directions. , IC chip 15 fixed to the board 6
Pad 7, which is the first bonding part on the top, and substrate 6
It is possible to perform θ rotation so that the line connecting the upper second bonding portions 8 coincides with each other in the Y direction. As long as the wedge 1 and the clamp 5 are configured to move together as described above, they may have a common drive unit or may be provided separately. Further, the clamp 5 is provided on an extension line of the guide hole 3.
なお、本実施例においては、XYテーブル上に
ボンデイングヘツドが載置され、ボンデイングヘ
ツドに上下動装置（回動装置）を備えたウエツジ
１とクランプ５が上下動可能に設けられ、基板６
の支持部材の方にθ回動装置が設けられているこ
ととする。ウエツジ１はその前後方向がＹ方向に
一致するように設けられているとする。 In this embodiment, a bonding head is placed on an XY table, and a wedge 1 and a clamp 5 equipped with a vertical movement device (rotation device) are provided on the bonding head so as to be vertically movable.
It is assumed that the θ rotation device is provided on the supporting member. It is assumed that the wedge 1 is provided so that its front-back direction coincides with the Y direction.
次に第１〜２図に基いてボンデイング動作につ
いて説明する。 Next, the bonding operation will be explained based on FIGS. 1 and 2.
第１図ａは第２ボンデイング部８の超音波印加
を終了したところを示し、第２図のＡ点に相当す
る。クランプ５は開である。 FIG. 1a shows the state where the application of ultrasonic waves to the second bonding part 8 has been completed, and corresponds to point A in FIG. 2. Clamp 5 is open.
クランプ５を開としたまま、ウエツジ１及びク
ランプ５を上下動装置により真上に又は上下動装
置及びXYテーブルにより前方上方に斜めに距離
ｌだけ上昇させる。このとき次のパツド７1のボ
ンデイングに要する所定のワイヤ長ｌ（第１ボン
デイングしろ）が第２ボンデイング部８のボンデ
イングされているワイヤに連続したままで立ち上
がつた状態でウエツジ１の先端面４から突出する
こととなる。即ち、ワイヤ立ち上がり基部１３か
らウエツジ１のガイド孔出口部１４までのワイヤ
の長さはｌとなる。なおこの実施例では傾き60°
のワイヤ２に沿つて斜めに上昇させるように、
Δz1，Δy1を選んでいる。…第１図ｂ、第２図では
Ｂ点。 With the clamp 5 open, the wedge 1 and the clamp 5 are raised directly upward by a vertical movement device or diagonally forward and upward by a distance l using a vertical movement device and an XY table. At this time, the predetermined wire length l (first bonding margin) required for bonding the next pad 71 remains continuous with the bonded wire of the second bonding part 8 and rises from the tip surface of the wedge 1. It will stand out from 4. That is, the length of the wire from the wire rising base 13 to the guide hole exit portion 14 of the wedge 1 is l. In this example, the slope is 60°.
so that it rises diagonally along the wire 2 of
Δ z1 and Δ y1 are selected. ...Point b in Figure 1 and point B in Figure 2.
クランプ５を閉とする。…第１図ｃ、第２図で
はＣ点、第３図ａではウエツジ１Ｃ、ワイヤ２
Ｃ。次いでウエツジ１をクランプ５とともに真下
又は前方下方へ下降させ、ワイヤ２をワイヤ立ち
上がり基部１３から長さｌだけ手前の第１ボンデ
イングしろ基部９で折曲する（第１図ｂにおいて
ウエツジ１を斜めに上昇させた場合は真下でも前
方下方でもよいが、ウエツジ１を真上に上昇させ
た場合は前方下方に限られる）。この実施例では
Δz2，Δy2移動せしめ、ウエツジ１を第３図ａにお
けるウエツジ１Ｄの位置としてある。ウエツジ１
Ｄは第１ボンデイングしろを小さな傾きで先端面
４に沿わしめるように先端面４が基板６に近接す
る高さで、かつワイヤ立ち上がり基部１３からガ
イド孔出口部１４までのワイヤ２の長さがｌとな
る位置であり、Δz2，Δy2はその条件を満足するよ
うに選んでいる。 Clamp 5 is closed. ...Point c in Figure 1, point C in Figure 2, wedge 1C, wire 2 in Figure 3 a
C. Next, the wedge 1 is lowered directly or forwardly downward together with the clamp 5, and the wire 2 is bent at the first bonding base 9, which is a length l in front of the wire rising base 13. When raised, it may be directly below or forwardly downward; however, when the wedge 1 is raised directly above, it is limited to forwardly downwardly). In this embodiment, the wedge 1 is moved by Δ z2 and Δ y2 , and the wedge 1 is positioned at the wedge 1D in FIG. 3a. wedge 1
D is the height at which the tip surface 4 is close to the substrate 6 so that the first bonding margin is aligned with the tip surface 4 at a small inclination, and the length of the wire 2 from the wire rising base 13 to the guide hole exit portion 14 is Δ z2 and Δ y2 are selected so as to satisfy this condition.
ウエツジ１Ｃの位置からウエツジ１Ｄの位置ま
での移動は第３図ａの矢印１０のようにガイド孔
出口部１４がワイヤ立ち上がり基部１３を中心と
した円弧を描くようにすればガイド孔出口部１４
は常に第１ボンデイングしろ基部９に当接し、第
１ボンデイングしろ基部９を徐々に曲げながら下
降するので好ましいが、第３図ｂ，ｃの矢印１
０′，１０″のように円弧に近い軌跡を描くように
下降せしめてもよいし、さらには直線的に下降せ
しめてもよい。またΔz2の絶対値をΔz1と等しくす
ればウエツジ１は第１ボンデイングしろを基板６
に圧接するので先端面４に完全に沿わしめること
ができる。…第１図ｄ、第２図ではＤ点、第３図
ではウエツジ１Ｄ、ワイヤ２Ｄ。 To move from the position of the wedge 1C to the position of the wedge 1D, the guide hole exit portion 14 can be moved by making the guide hole exit portion 14 draw an arc centered on the wire rising base 13 as shown by the arrow 10 in FIG. 3a.
is preferable because it always comes into contact with the first bonding groove base 9 and descends while gradually bending the first bonding groove base 9.
0', 10'', it may be lowered to draw a trajectory close to a circular arc, or it may be lowered linearly.Also, if the absolute value of Δ z2 is made equal to Δ z1 , wedge 1 is The first bonding margin is the substrate 6.
Since it comes into pressure contact with the tip, it can be completely aligned with the tip surface 4. ...Point d in Figure 1, point D in Figure 2, wedge 1D and wire 2D in Figure 3.
次いでウエツジ１をクランプ５とともに前方へ
移動せしめる。本実施例では、Δy3だけ水平に前
方に移動せしめているが、前方斜め上方でも前方
斜め下方でもよい。するとワイヤ２はワイヤ立ち
上がり基部１３で切断される。…第１図ｅ、第２
図ではＥ点、第３図ではウエツジ１Ｅ、ワイヤ２
Ｅ。 Next, the wedge 1 is moved forward together with the clamp 5. In this embodiment, it is moved horizontally forward by Δy3 , but it may be moved diagonally upward or diagonally downward. Then, the wire 2 is cut at the wire rising base 13. ...Figure 1 e, 2
In the figure, point E, in Figure 3, wedge 1E, wire 2
E.
このままの状態でウエツジ１をｘ，ｙ，ｚ移動
せしめ、次にボンデイングを行うICチツプ１５
のパツド７1の直上部に位置を合せる。基板６は
パツド７1と第２ボンデイング部８1を結ぶ線がＹ
方向即ちウエツジ１の前後方向に一致する如くθ
回動させられている。…第１図ｆ、第２図ではＦ
点。 In this state, the wedge 1 is moved in x, y, and z, and then the IC chip 15 to be bonded is moved.
Align the position directly above pad 7 1 . In the board 6, the line connecting the pad 71 and the second bonding part 81 is Y.
θ so as to match the direction, that is, the front-back direction of wedge 1.
It's being rotated. ...F in Figure 1, F in Figure 2
point.
次に、ウエツジ１を真下に下降せしめてウエツ
ジ１の先端面４とパツド７1との間に所定長ｌの
第１ボンデイングしろを挟圧し、ウエツジ１によ
り超音波を印加して第１ボンデイングを行う。 Next, the wedge 1 is lowered straight down to squeeze a first bonding margin of a predetermined length l between the distal end surface 4 of the wedge 1 and the pad 71 , and ultrasonic waves are applied by the wedge 1 to perform the first bonding. conduct.
第１図ｃから第１図ｅ即ち、第２図Ｃ〜Ｅのウ
エツジ１の移動を第３図ａに拡大して示す。 The movement of the wedge 1 in FIGS. 1c to 1e, ie, in FIGS. 2C to E, is shown enlarged in FIG. 3a.
このように本発明は、ウエツジ１を相対的に真
下に又は前方下方へ下降せしめてワイヤ２を第１
ボンデイングしろ基部９で折曲した後、ウエツジ
１を相対的に前方へ移動せしめてワイヤ２をワイ
ヤ立ち上がり基部１３でカツトすればよく、例え
ば、上述の実施例ではクランプ５を閉じた後ワイ
ヤ２を折曲したが、クランプ５は切断動作のとき
に閉じていればよく、クランプ５を開いたままで
ワイヤ２を折曲し、その後クランプ５を閉じて切
断すればよい。また、Ｘ，Ｙ，Ｚ方向移動装置が
基板６の方に設けられている場合では基板６を移
動させることもできる。 In this way, the present invention allows the wire 2 to be moved to the first position by lowering the wedge 1 relatively straight down or forward downward.
After bending the wire at the bonding base 9, the wedge 1 may be moved relatively forward to cut the wire 2 at the wire rising base 13. For example, in the above embodiment, the wire 2 may be cut after the clamp 5 is closed. However, it is sufficient that the clamp 5 is closed during the cutting operation, and the wire 2 may be bent while the clamp 5 is kept open, and then the clamp 5 may be closed and cut. Furthermore, if an X, Y, and Z direction moving device is provided on the substrate 6, the substrate 6 can also be moved.
〔発明の効果〕
本発明はワイヤを切断する前に予め第１ボンデ
イングしろをウエツジ先端より突出せしめ、かつ
第１ボンデイングしろ基部で折曲しておくので、
急な傾きのガイド孔を有するウエツジを用いての
第１ボンデイングも確実に行うことができること
はもちろん、さらに、ワイヤの繰り出し量のバラ
ツキ、折曲点のズレ、折曲形成した第１ボンデイ
ングしろの横方向への曲りなどが生じるおそれが
なく、また動作も少なく、ワイヤ繰り出し機構も
不要である。[Effects of the Invention] In the present invention, before cutting the wire, the first bonding margin is made to protrude from the tip of the wedge in advance, and the wire is bent at the base of the first bonding margin.
It goes without saying that the first bonding can be performed reliably using a wedge with a steeply inclined guide hole, but it is also possible to prevent variations in the amount of wire payout, misalignment of the bending point, and the possibility of the first bonding gap formed by bending. There is no risk of bending in the lateral direction, the movement is small, and a wire feeding mechanism is not required.
第１図ａ〜ｆは動作説明図、第２図はタイムチ
ヤート、第３図ａ，ｂ，ｃは動作の主要部の拡大
説明図、第４図ａ，ｂはそれぞれ従来用いられて
いるウエツジの説明図である。
１，１１……ウエツジ、２……ワイヤ、３，３
１……ガイド孔、４，４１……先端面、５……ク
ランプ、６……基板、７，７1……パツド、８，
８1……第２ボンデイング部、９……第１ボンデ
イングしろ基部、１０，１２……矢印、１３……
ワイヤ立ち上がり基部、１４……ガイド孔出口
部、１５……ICチツプ。
Figures 1 a to f are explanatory views of the operation, Figure 2 is a time chart, Figures 3 a, b, and c are enlarged explanatory views of the main parts of the operation, and Figures 4 a and b are conventional wedges. FIG. 1, 11... Wedge, 2... Wire, 3, 3
1... Guide hole, 4, 41... Tip surface, 5... Clamp, 6... Board, 7, 7 1 ... Pad, 8,
8 1 ...Second bonding part, 9...First bonding base, 10, 12...Arrow, 13...
Wire rising base, 14...Guide hole exit part, 15...IC chip.
Claims (1)
イングを行うワイヤボンデイング方法において、
第２ボンデイング部の超音波印加の終了後ボンデ
イングウエツジを次の第１ボンデイングに要する
ワイヤの長さｌと同じ距離だけ前方上方に又は真
上に上昇させてボンデイングウエツジをワイヤに
対して後退せしめて第２ボンデイング部から連続
しているワイヤのその立ち上がり基部からボンデ
イングウエツジまでのワイヤの長さをｌとし、次
いでボンデイングウエツジを相対的に真下に又は
前方下方に下降せしめてワイヤをその立ち上り基
部から長さｌだけ手前の部分で折曲し、次いでボ
ンデイングウエツジのワイヤに対する後退を阻止
した状態でボンデイングウエツジを相対的に前方
に移動せしめてワイヤを前記第２ボンデイング部
からの立ち上がり基部で切断し、その後、ボンデ
イングウエツジを次の第１ボンデイング部に移動
せしめることを特徴とするワイヤボンデイング方
法。1 In a wire bonding method in which wire bonding is performed using a bonding wedge,
After the application of ultrasonic waves to the second bonding section is completed, the bonding wedge is raised forward and upward or directly above by a distance equal to the length l of the wire required for the next first bonding, and the bonding wedge is retreated relative to the wire. At least the length of the wire from the rising base of the wire that is continuous from the second bonding part to the bonding wedge is l, and then the bonding wedge is lowered relatively straight down or forward downward to lower the wire. Bend the wire by a length l in front of the rising base, and then move the bonding wedge relatively forward while preventing the bonding wedge from retreating with respect to the wire to cause the wire to rise from the second bonding part. A wire bonding method characterized by cutting at the base and then moving the bonding wedge to the next first bonding part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194618A JPH0244744A (en) | 1988-08-05 | 1988-08-05 | Wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194618A JPH0244744A (en) | 1988-08-05 | 1988-08-05 | Wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244744A JPH0244744A (en) | 1990-02-14 |
| JPH05861B2 true JPH05861B2 (en) | 1993-01-06 |
Family
ID=16327530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63194618A Granted JPH0244744A (en) | 1988-08-05 | 1988-08-05 | Wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244744A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6390376B2 (en) * | 2000-02-23 | 2002-05-21 | Paul Bermel | Method and apparatus for providing targeted advertising in public areas |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568831A (en) * | 1979-06-21 | 1981-01-29 | Shinkawa Ltd | Wire bonding method |
| JPS5889833A (en) * | 1981-11-25 | 1983-05-28 | Shinkawa Ltd | Wire bonding method |
-
1988
- 1988-08-05 JP JP63194618A patent/JPH0244744A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568831A (en) * | 1979-06-21 | 1981-01-29 | Shinkawa Ltd | Wire bonding method |
| JPS5889833A (en) * | 1981-11-25 | 1983-05-28 | Shinkawa Ltd | Wire bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244744A (en) | 1990-02-14 |
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