JP2537389B2 - Wire bonding method and apparatus thereof - Google Patents

Wire bonding method and apparatus thereof

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Publication number
JP2537389B2
JP2537389B2 JP63290031A JP29003188A JP2537389B2 JP 2537389 B2 JP2537389 B2 JP 2537389B2 JP 63290031 A JP63290031 A JP 63290031A JP 29003188 A JP29003188 A JP 29003188A JP 2537389 B2 JP2537389 B2 JP 2537389B2
Authority
JP
Japan
Prior art keywords
bonding
wedge
wire
bending member
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63290031A
Other languages
Japanese (ja)
Other versions
JPH02137341A (en
Inventor
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
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Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP63290031A priority Critical patent/JP2537389B2/en
Publication of JPH02137341A publication Critical patent/JPH02137341A/en
Application granted granted Critical
Publication of JP2537389B2 publication Critical patent/JP2537389B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
    • H01L2224/85947—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by mechanical means, e.g. "pull-and-cut", pressing, stamping

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ワイヤを挿通するガイド孔を先端面に対し
て傾斜して備え、ワイヤが先端面下方に傾斜して繰り出
されるボンディングウェッジ（以下ウェッジと略）を用
いて超音波によりワイヤボンディングを行うワイヤボン
ディング方法及びその装置に関するものである。The present invention relates to a bonding wedge (hereinafter referred to as a bonding wedge) in which a guide hole through which a wire is inserted is tilted with respect to a tip end surface, and the wire is tilted downward and fed out. The present invention relates to a wire bonding method and apparatus for performing wire bonding by ultrasonic waves using a wedge).

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

本出願人は先に特願昭62−199039号で傾きが大きいガ
イド孔を備えたウェッジを用いるときに好適なワイヤボ
ンディング方法即ち第２ボンディング終了後に次の第１
ボンディングしろを予めウェッジ先端面に沿わしめてお
く方法を提案しているが、その方法は基板又は基板に固
着した部材にウェッジを押し付けて折り曲げるものであ
った。The applicant of the present application has previously proposed a wire bonding method suitable for using a wedge provided with a guide hole having a large inclination in Japanese Patent Application No. 62-199039, that is, the following first method after completion of the second bonding.
Although a method has been proposed in which the bonding margin is placed along the leading end surface of the wedge in advance, the method is to press the wedge against the substrate or a member fixed to the substrate and bend the wedge.

従って、ウェッジの押し付け時に基板に傷がつくおそ
れがあったし、基板に種々の部品が配設されているとウ
ェッジの斜め下降による押し付けが可能な広さの隙間領
域がないこともある。Therefore, the substrate may be damaged when the wedge is pressed, and if various components are arranged on the substrate, there may not be a gap area of a width that allows the wedge to be pressed downward.

また第２ボンディング終了後次の第１ボンディング部
へとウェッジを移動させる間にわざわざ第１ボンディン
グしろ折り曲げのための上下動,Y方向移動を基板に対し
て行わなければならず、折り曲げない場合に比べて第２
ボンディング終了から次の第１ボンディング部に移動す
るまでの時間を長く要する。In addition, when the wedge is moved to the next first bonding portion after the completion of the second bonding, it is necessary to purposely perform the vertical movement for the first bonding margin bending and the Y-direction movement to the substrate. Second compared
It takes a long time from the end of bonding to the movement to the next first bonding portion.

〔課題を解決するための手段〕[Means for solving the problem]

請求項１に係るワイヤボンディング方法は、ウェッジ
を用いて行うワイヤボンディング方法において、第２ボ
ンディング終了後ウェッジを次の第１ボンディング部に
移動させる間にワイヤ折曲部材をウェッジに対して相対
的に接近せしめ、ウェッジから繰り出されている第１ボ
ンディングしろをその基部で予め折曲しておくことを特
徴とするワイヤボンディング方法である。The wire bonding method according to claim 1 is a wire bonding method using a wedge, wherein the wire bending member is relatively moved with respect to the wedge while the wedge is moved to the next first bonding portion after completion of the second bonding. The wire bonding method is characterized in that the first bonding margins that are brought close to each other and that are fed out from the wedge are bent in advance at their bases.

請求項２に係るワイヤボンディング装置は、XYテーブ
ル上にウェッジをＺ移動可能に備えたワイヤボンディン
グ装置において、前記XYテーブル上にワイヤ折曲部材を
前記ウェッジに対して相対的に移動可能に設け、該ワイ
ヤ折曲部材を前記ウェッジに対して相対的な接近せしめ
て前記ウェッジの先端から繰り出されている第１ボンデ
ィングしろを折り曲げることができるようにしたことを
特徴とするワイヤボンディング装置である。The wire bonding apparatus according to claim 2, wherein the wire bonding apparatus is provided with a wedge on the XY table so as to be movable in Z, and a wire bending member is provided on the XY table so as to be movable relative to the wedge. The wire bonding apparatus is characterized in that the wire bending member is brought relatively close to the wedge so that the first bonding margin fed from the tip of the wedge can be bent.

〔作 用〕[Work]

本発明のワイヤボンディング方法は第２ボンディング
終了後ウェッジを次の第１ボンディング部に移動させる
間にワイヤ折曲部材をウェッジに対して相対的に接近せ
しめ、ウェッジから繰り出されている第１ボンディング
しろをその基部で予め折曲しておくので、基板に傷がつ
くおそれは全くないし、基板に所要の広さの隙間領域が
ない場合でも第１ボンディングしろをその基部で折曲す
ることができる。According to the wire bonding method of the present invention, after the second bonding is completed, while moving the wedge to the next first bonding portion, the wire bending member is brought relatively close to the wedge, and the first bonding portion fed from the wedge is removed. Since the substrate is previously bent at its base, there is no possibility of scratching the substrate, and the first bonding margin can be bent at the base even if the substrate does not have a gap area of a required width.

本発明のワイヤボンディング装置はXYテーブル上にワ
イヤ折曲部材を前記ウェッジに対して相対的に移動可能
に設け、該ワイヤ折曲部材を前記ウェッジに対して相対
的に接近せしめて前記ウェッジの先端から繰り出されて
いる第１ボンディングしろを折り曲げることができるよ
うにしたので、第２ボンディング終了後XYテーブルによ
りウェッジを次の第１ボンディング部へ移動せしめるま
での間にワイヤ折曲部材をウェッジに対して相対的に接
近せしめることによりウェッジの先端に繰り出された第
１ボンディングしろをその基部で予め折曲しておくこと
ができる。In the wire bonding apparatus of the present invention, a wire bending member is provided on an XY table so as to be movable relative to the wedge, and the wire bending member is brought relatively close to the wedge so that the tip end of the wedge is formed. Since it is possible to bend the first bonding margin that has been fed from the wire bending member, the wire bending member can be moved to the wedge until the wedge is moved to the next first bonding portion by the XY table after the second bonding is completed. By making them relatively close to each other, the first bonding margin extended to the tip of the wedge can be bent in advance at its base.

従って、XYテーブルに第１ボンディングしろ折り曲げ
のための動作をさせる必要がなく、XYテーブルは第２ボ
ンディング終了後直ちに次の第１ボンディング部へウェ
ッジを移動せしめる動作を行え、その動作の間に併行し
て第１ボンディングしろの折曲を行うことができるの
で、特願昭62−199039号のものに比べ大幅に所要時間が
短縮される。Therefore, it is not necessary to operate the XY table for the first bonding and bending, and the XY table can perform the operation of moving the wedge to the next first bonding portion immediately after the completion of the second bonding. Since the first bonding margin can be bent, the required time is greatly shortened as compared with that of Japanese Patent Application No. 62-199039.

従って、請求項２に係る装置は請求項１に係る方法を
所要時間を短縮できる形態として実現できる。Therefore, the apparatus according to claim 2 can implement the method according to claim 1 in a form that can reduce the required time.

〔実施例〕〔Example〕

本発明の実施例を第１〜５図を用いて説明する。 An embodiment of the present invention will be described with reference to FIGS.

第１図において、１はXYテーブル、14はボンディング
ヘッド、２はウェッジ、21はホーン、３はクランプ、31
はクランプスライダ、32はアーム、33はクランプ３開閉
用のアクチュエーター、34はクランプスライダ31用のア
クチュエーター、６はワイヤ、15はリール、５は基板、
16は保持台で、ウェッジ２がXYZ移動を行い、基板５が
θ回動を行い、クランプ３はウェッジ２と一体に運動す
るほか、クランプスライダ31によりウェッジ２とは別個
に単独でワイヤ６に沿って往復動する、公知の超音波ボ
ンディング装置であるが、この実施例ではXYテーブル１
上にワイヤ折曲部材４をアクチュエーター41によりＹ方
向に往復動可能に設けている。In FIG. 1, 1 is an XY table, 14 is a bonding head, 2 is a wedge, 21 is a horn, 3 is a clamp, 31
Is a clamp slider, 32 is an arm, 33 is an actuator for opening and closing the clamp 3, 34 is an actuator for the clamp slider 31, 6 is a wire, 15 is a reel, 5 is a substrate,
Reference numeral 16 is a holding table, the wedge 2 moves XYZ, the substrate 5 rotates θ, the clamp 3 moves integrally with the wedge 2, and the clamp slider 31 separates the wire 6 independently from the wedge 2. A known ultrasonic bonding device that reciprocates along the XY table 1 is used in this embodiment.
The wire bending member 4 is provided above the actuator 41 so as to be capable of reciprocating in the Y direction.

次に第2,3図を用いてウェッジ２とワイヤ折曲部材４
について説明する。Next, referring to FIGS. 2 and 3, the wedge 2 and the wire bending member 4 are used.
Will be described.

ウェッジ２はワイヤ６を挿通するガイド孔７を先端面
８に対して45゜〜90゜、本実施例では例えば60゜、傾斜
させて備え、ガイド孔７が、XY平面に垂直でかつＹ方向
に平行のYZ平面上に位置するように、設けられている
（以下ガイド孔７の中心線を含むこのYZ平面を便宜上中
心面９と称す。）。The wedge 2 is provided with a guide hole 7 through which the wire 6 is inserted at an angle of 45 ° to 90 ° with respect to the tip surface 8, for example, 60 ° in this embodiment, and the guide hole 7 is perpendicular to the XY plane and in the Y direction. Is provided so as to be located on a YZ plane parallel to (the YZ plane including the center line of the guide hole 7 is hereinafter referred to as a center plane 9 for convenience).

ワイヤ折曲部材４は先端上面が先端に向かって漸次低
くなる斜面部10に形成され、斜面部10の中央には傾斜方
向にガイド凹部11が設けられている。The wire bending member 4 is formed on a slope portion 10 whose top surface gradually lowers toward the tip, and a guide recess 11 is provided at the center of the slope portion 10 in the inclination direction.

そして第２図において、２点鎖線で示した待機位置か
ら実線で示した折曲位置（このときウェッジ２は所定の
高さｈである）までワイヤ折曲部材４をアクチュエータ
ー41により往復動させたときにガイド凹部11が中心面９
上を往復動するように設けられている。In FIG. 2, the wire bending member 4 is reciprocated by the actuator 41 from the standby position shown by the chain double-dashed line to the bending position shown by the solid line (at this time, the wedge 2 has a predetermined height h). Sometimes the guide recess 11 is in the center plane 9
It is provided to reciprocate above.

なお、この例のワイヤ折曲部材４は２点鎖線で示した
ウェッジ4Aを待機位置とし、矢印４′ＡのようにＹ方向
に水平に往復動させているが、待機位置をウェッジ4Bと
して矢印４′Ｂのように斜め上方に往復動せしめてもよ
いし、ウェッジ4Cとして矢印４′Ｃのように斜め下方に
往復動せしめるように設けてもよい。いずれにしても所
定の高さｈに上昇したウェッジ２の下方に、ガイド孔７
の入口のあるウェッジ前方から反対のウェッジ後方に向
けて前進せしめ、ワイヤ６を第１ボンディングしろの基
部12で折曲する如く設ければよい。In the wire bending member 4 of this example, the wedge 4A indicated by the chain double-dashed line is used as the standby position and is horizontally reciprocated in the Y direction as indicated by the arrow 4'A. 4'B may be reciprocally moved obliquely upward, or wedge 4C may be provided so as to be reciprocally moved obliquely downward as indicated by arrow 4'C. In any case, the guide hole 7 is provided below the wedge 2 that has risen to a predetermined height h.
The wire 6 may be provided so as to be bent at the base 12 of the first bonding margin by advancing from the front of the wedge having the entrance of the above to the rear of the opposite wedge.

斜面部10の傾斜角α１は図示の如くガイド孔７の出口
と斜面部10とを両者で第１ボンディングしろの基部12を
挟圧する程度まで接近せしめるときはウェッジ２の先端
面８と折曲された第１ボンディングしろのなす角度α２
に等しくなるので斜面部10の傾斜角α１を選ぶことによ
り所望の角度α２が得られるが、必ずしも基部12を挟圧
しなくともよく、斜面部10とする要はないし、ガイド凹
部11も必須のものではない。As shown in the figure, the inclination angle α 1 of the slope 10 is bent with the tip 8 of the wedge 2 when the outlet of the guide hole 7 and the slope 10 are brought close to each other so as to press the base 12 of the first bonding margin. Angle α 2 formed by the bonded first bonding margin
Since a desired angle α 2 can be obtained by selecting the inclination angle α 1 of the slope portion 10, it is not always necessary to clamp the base portion 12, and it is not necessary to form the slope portion 10 and the guide recess 11 is also essential. Not the one.

次に第４〜５図に基づいてボンディング動作について
説明する。Next, the bonding operation will be described with reference to FIGS.

第１図（ａ）は第２ボンディング部13のボンディング
を終了したところを示し、第２図のＡ点に相当する。ク
ランプ３はウェッジ２に対して中間位置で閉、ワイヤ折
曲部材４は待機位置である。FIG. 1 (a) shows the end of the bonding of the second bonding portion 13, and corresponds to point A in FIG. The clamp 3 is closed at an intermediate position with respect to the wedge 2, and the wire bending member 4 is at a standby position.

クランプ３を閉としたまま、クランプスライダ31をワ
イヤカットに要するだけウェッジ２から離隔する向きに
Δl1だけ後退させる。するとワイヤ６は第２ボンディン
グ部13と固着している部分の端部でカットされる。…第
１図（ｂ）、第２図ではＢ点。With the clamp 3 kept closed, the clamp slider 31 is retracted by Δl 1 in the direction away from the wedge 2 for the wire cutting. Then, the wire 6 is cut at the end of the portion fixed to the second bonding portion 13. ... Point B in Figs. 1 (b) and 2.

ウェッジ２とクランプ３を一体的に上昇せしめながら
かつクランプスライダ31をΔl1＋Δl2だけワイヤ６に沿
って前進させ、所定の長さΔl2の第１ボンディングしろ
をウェッジ２の先端面８から繰り出す。このとき併行し
てXYテーブル１は次の第１ボンディング部への移動を開
始している。…第１図（ｃ）、第２図ではＣ点。The wedge 2 and clamp 3 is advanced along the and clamp slider 31 while allowed integrally elevated .DELTA.l 1 + .DELTA.l 2 only wire 6, fed out a predetermined first bonding white length .DELTA.l 2 from the distal end surface 8 of the wedge 2 . At this time, in parallel, the XY table 1 has started to move to the next first bonding portion. ... Point C in FIGS. 1 (c) and 2.

次でウェッジ２の高さがｈとなったあとでワイヤ折曲
部材４を折曲位置まで前進させる。するとワイヤ６は所
定長さΔl2の第１ボンディングしろの基部12で確実に折
れ曲がる。…第１図（ｄ）、第２図ではＤ点。Next, after the height of the wedge 2 becomes h, the wire bending member 4 is advanced to the bending position. Then, the wire 6 is surely bent at the base portion 12 of the first bonding margin having a predetermined length Δl 2 . ... Point D in FIG. 1 (d) and FIG.

ワイヤ折曲部材４を待機位置まで復帰せしめ、次の第
１ボンディングに備える。The wire bending member 4 is returned to the standby position to prepare for the next first bonding.

クランプスライダ31の前進位置から中間位置への復帰
はクランプ３を開とした状態でウェッジ２を第１ボンデ
ィング部から第２ボンディング部に移動させるループ形
成中に行われる。The return of the clamp slider 31 from the advanced position to the intermediate position is performed during formation of a loop for moving the wedge 2 from the first bonding portion to the second bonding portion with the clamp 3 opened.

以上ワイヤ折曲部材４を移動させて折曲する例で説明
したが、ワイヤ折曲部材４の固定して設け、ウェッジ２
をZ,X,Y方向に往復動せしめて折曲する構造とすること
もできる。Although the wire bending member 4 is moved and bent in the above description, the wire bending member 4 is fixedly provided, and the wedge 2 is provided.
It is also possible to adopt a structure in which is bent by reciprocating in the Z, X, and Y directions.

〔発明の効果〕〔The invention's effect〕

本発明のワイヤボンディング方法は第１ボンディング
しろの折曲をワイヤ折曲部材を用いて行うので、基板に
傷がつくおそれは全くないし、基板に所要の広さの隙間
領域がない場合でも第１ボンディングしろをその基部で
折曲することができる。In the wire bonding method of the present invention, since the bending of the first bonding margin is performed by using the wire bending member, there is no possibility of scratching the substrate, and even when the substrate does not have a gap area of a required width, The bond strip can be folded at its base.

本発明のワイヤボンディング装置はXYテーブル上にワ
イヤ折曲部材を前記ウェッジに対して相対的に移動可能
に設け、該ワイヤ折曲部材を前記ウェッジに対して相対
的に接近せしめて前記ウェッジの先端から繰り出されて
いる第１ボンディングしろを折り曲げることができるよ
うにしたので、請求項１に係る方法を所要時間を短縮で
きる形態として実現できる。In the wire bonding apparatus of the present invention, a wire bending member is provided on an XY table so as to be movable relative to the wedge, and the wire bending member is brought relatively close to the wedge so that the tip end of the wedge is formed. Since it is possible to bend the first bonding margin that is fed out from the above, the method according to claim 1 can be realized in a form that the required time can be shortened.

【図面の簡単な説明】[Brief description of drawings]

第１図は本発明の実施例の側面図、第２図は折曲時の主
要部の縦断面図、第３図はその正面図、第４図は（ａ）
〜（ｄ）は動作説明図、第５図はタイムチャートであ
る。 １……XYテーブル、２……ウェッジ、21……ホーン、３
……クランプ、31……クランプスライダ、32……アー
ム、33,34……アクチュエーター、４……ワイヤ折曲部
材、41……アクチュエーター、５……基板、６……ワイ
ヤ、７……ガイド孔、８……先端面、９……中心面、10
……斜面部、11……ガイド凹部、12……基部、13……第
２ボンディング部、14……ボンディングヘッド、15……
リール。FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a main part when bent, FIG. 3 is a front view thereof, and FIG. 4 is (a).
(D) is an operation explanatory view, and FIG. 5 is a time chart. 1 ... XY table, 2 ... wedge, 21 ... horn, 3
…… Clamp, 31 …… Clamp slider, 32 …… Arm, 33,34 …… Actuator, 4 …… Wire bending member, 41 …… Actuator, 5 …… Board, 6 …… Wire, 7 …… Guide hole , 8 ... Tip surface, 9 ... Center surface, 10
...... Slope surface, 11 ...... guide recess, 12 …… base, 13 …… second bonding part, 14 …… bonding head, 15 ……
reel.

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ボンディングウェッジを用いて行うワイヤ
ボンディング方法において、第２ボンディング終了後ボ
ンディングウェッジを次の第１ボンディング部に移動さ
せる間にワイヤ折曲部材をボンディングウェッジに対し
て相対的に接近せしめ、ボンディングウェッジから繰り
出されている第１ボンディングしろをその基部で予め折
曲しておくことを特徴とするワイヤボンディング方法。1. A wire bonding method using a bonding wedge, wherein a wire bending member is brought relatively close to the bonding wedge while moving the bonding wedge to the next first bonding portion after completion of the second bonding. A wire bonding method characterized in that the first bonding margin fed from the bonding wedge is bent in advance at its base. 【請求項２】XYテーブル上にボンディングウェッジをＺ
移動可能に備えたワイヤボンディング装置において、前
記XYテーブル上にワイヤ折曲部材を前記ボンディングウ
ェッジに対して相対的に移動可能に設け、該ワイヤ折曲
部材を前記ボンディングウェッジに対して相対的に接近
せしめて前記ボンディングウェッジの先端から繰り出さ
れている第１ボンディングしろを折り曲げることができ
るようにしたことを特徴とするワイヤボンディング装
置。2. A bonding wedge Z is mounted on an XY table.
In a wire bonding apparatus that is movable, a wire bending member is provided on the XY table so as to be movable relative to the bonding wedge, and the wire bending member is relatively close to the bonding wedge. A wire bonding apparatus characterized in that the first bonding margin extended from the tip of the bonding wedge can be bent at least.
JP63290031A 1988-11-18 1988-11-18 Wire bonding method and apparatus thereof Expired - Lifetime JP2537389B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63290031A JP2537389B2 (en) 1988-11-18 1988-11-18 Wire bonding method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63290031A JP2537389B2 (en) 1988-11-18 1988-11-18 Wire bonding method and apparatus thereof

Publications (2)

Publication Number Publication Date
JPH02137341A JPH02137341A (en) 1990-05-25
JP2537389B2 true JP2537389B2 (en) 1996-09-25

Family

ID=17750891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63290031A Expired - Lifetime JP2537389B2 (en) 1988-11-18 1988-11-18 Wire bonding method and apparatus thereof

Country Status (1)

Country Link
JP (1) JP2537389B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120032354A1 (en) * 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds

Also Published As

Publication number Publication date
JPH02137341A (en) 1990-05-25

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