JPH03265164A - Lead pin cutting and bending device of electronic component - Google Patents

Abstract

PURPOSE:To bend a lead pin surely at an acute angle by providing a bending means to move a bending punch linearly and to bend the lead pin at 90 deg. and a bending means to move the punch in an oblique direction and to bend the lead pin at an acute angle. CONSTITUTION:A lead pin 3 of an electronic component 2 is held between a bending die 7 and a clamp base 8 and fixed. A cutting blade 1 is moved horizontally forward along a guide body 10 of a guide base 9 and the pin 3 is cut to a specified size by the blade 1 and a pressing body 13 of the bending punch 4. The punch 4 is moved forward by a slider 12 and the pin 3 is bent at 90 deg. by the pressing body 13. The punch 4 is further moved forward horizontally; then, the punch 4 rises through mutual cam operation between a guide surface 11a of a punch guide body 11 and an incline 4a of the punch 4. Thereby, the pin 3 is slided up to a bending surface 7a of the bending die 7 by a sliding-up surface 4b of the punch 4 and a bending angle of the pin 3 makes an acute angle.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a cutting and bending device for cutting lead pins of electronic components into predetermined dimensions and bending them into a predetermined shape.

<Prior art> Conventionally, when cutting and bending lead pins of electronic components, the cutting blade l is moved horizontally as shown in FIG. After cutting the lead pin 3 of the electronic component 2 into a predetermined size, the lead pin 3 of the electronic component 2 is bent by horizontally moving a bending punch 4 using a separate device, as shown in FIG.

In Figure 9.10, 5 is a cutting die (mold), 6 is a cutting clamp table for clamping and fixing the lead pin together with the cutting die 5 when cutting the lead pin 3, 7 is a bending die (mold), 8 is a bending clamp table for clamping and fixing the lead pin 3 together with the bending diamond when bending the lead pin, 2a is a lens of the electronic component 2, and 3a is an unnecessary lead pin portion.

<Problems to be Solved by the Invention> Generally, electronic components 2 are inserted into through-holes of a board and fixed by soldering, so if the bending angle of the lead pins 3 is 90 degrees, the board placed vertically When soldering after inserting the through hole, the electronic component 2 may tilt due to its own weight.
The lens 2a of the electronic component 2 is fixed to the substrate with its optical axis shifted. For this reason, the bending angle of the lead pin 3 of the electronic component 2 is made an acute angle, and the electronic component 2 when soldering is
It is necessary to prevent the tilting of the

However, in the above conventional technology, the lower part of the package of the electronic component 2 is supported and conveyed by the feeder rail, and the bending punch 4 is moved horizontally to bend the lead pin 3. Therefore, the bending angle of the lead pin 3 is 90 degrees. is the limit. That is, as shown in FIG.
The bending diamond is angled so that the lead pin 3 can be bent at an acute angle, but the bending punch 4 is simply moved horizontally and the lead pin 3 is pressed against the bending diamond side to bend it. can only be bent at a minimum of 90 degrees.

Further, the lead pin 3 is bent at 90 degrees by the bending punch 4, but when the lead pin 3 is bent and the bending punch 4 is moved back, springback occurs at the bent portion of the lead pin 3 with a return angle α, and the lead pin 3 The bending angle becomes an obtuse angle, that is, 90 degrees and ten α, which results in the electronic component 2 being more likely to be tilted when attached to the board.

Furthermore, in the prior art, as shown in Figure 9.10, the cutting process and the bending process of the lead pin 3 are performed using separate devices, which requires separate devices for each process, which leads to an increase in manufacturing costs. ing.

In view of the above, an object of the present invention is to provide a lead pin cutting and folding device for electronic components that can reliably bend the lead pins of electronic components at an acute angle and that can perform the cutting process and the bending process with a single device. .

<Means for Solving the Problems> The means for solving the problems according to the present invention, as shown in FIGS. 1 to 8, include a bending die for bending the lead pins 3 of the electronic component 2, and a clamp for fixing the lead pins 3. A device for cutting and folding lead pins for electronic components, comprising a stand 8, a cutting blade l for cutting the lead pin 3 into a predetermined size, and a bending punch 4 for pressing the lead pin 3 toward the bending diamond and bending it. , a first moving means A for linearly moving the bending punch 4 to bend the lead pin 3 at 90 degrees, and the bending punch 4
Move the lead pin 3 diagonally to the linear direction.
A second moving means B for bending the sheet at an acute angle is provided.

<Operation> In the above problem solving means, after the lead pin 3 of the electronic component 2 is fixed by the clamp table 8, the lead pin 3 is cut into a predetermined size by the cutting blade 1.

Next, the bending punch 4 is linearly moved by the first moving means A to bend the lead pin 3 at 90 degrees.

Thereafter, the bending punch 4 is moved in a diagonal direction with respect to the linear direction by the second moving means B.

Then, the lead pin 3 is further pressed toward the bending diamond side by the bending punch 4 from a state where the bending surface is at 90 degrees, and is bent at an acute angle.

In this way, by incorporating the movement direction change operation of the bending punch 4, the cutting and bending steps can be performed with a single device, and the lead pin can be reliably bent at an acute angle.

<Example> An example of the present invention will be described below with reference to FIGS. 1 to 8.

Fig. 1 is a side view of a lead pin cutting/folding device for electronic components showing an embodiment of the present invention, Fig. 2 is a plan view thereof, and Fig. 3(a) is a plan view of a bending punch. b
) is the same side view, FIG. 4(c) is the front view, FIG. 4(a) is the top view of the slider, and FIG. 4(b) is the same side view.
) is a side view thereof, FIG. 5(a) is a plan view of the guide stand, FIG. 5(b) is a side view thereof, FIG. FIG. 7 is a diagram showing a state in which a lead pin of an electronic component is bent at 90 degrees, and FIG. 8 is a diagram showing a state in which a lead pin of an electronic component is bent at an acute angle. Note that the same reference numerals are given to the same functional parts as those of the prior art shown in FIGS. 9 to 11.

As shown in the figure, the electronic component glue doped pin cutting and bending device of this embodiment includes a bending die (mold) 7 for bending the lead pin 3 of the electronic component 2, and a clamp stand 8 for fixing the lead pin 3. , a cutting blade l for cutting the lead pin 3 into a predetermined size, and a bending punch 4 for pressing and bending the lead pin 3 toward the bending diamond side, and horizontally moving the bending punch 4 to cut the lead pin 3. a first moving means A for bending at 90 degrees;
A second moving means B is provided for moving the bending punch 4 diagonally upward with respect to the horizontal direction to bend the dobbin 3 at an acute angle.

The bending diamond is disposed above the cutting blade 1 as shown in FIG.
It is formed to be inclined upward from the side end toward the forward direction of the bending punch 4. The clamp table 8 is disposed above the bending punch 4 and facing the bending diamond so that the lead pin 3 of the electronic component 2 can be clamped and fixed together with the bending diamond.

The cutting blade 1 is placed on a guide stand 9, and is horizontally movable by driving a cylinder (not shown).

As shown in FIGS. 5(a) and 5(b), the guide stand 9 is
A cutting blade guide 10 that allows the cutting blade 1 to be moved horizontally relative to the electronic component 2, and a bending punch 4 that is integrally molded with the cutting blade guide 10 and moves diagonally upward with respect to the horizontal direction to form a bending die. A pair of punch guide bodies 11 that guide the punch to the bending surface 7a side of the punch guide body 11. The punch guide 11
As shown in FIG. 1, the guide surface 11a is formed to be inclined upward from its end on the bending punch 4 side toward the cutting blade guide lO. Further, a bending punch 4 is provided on the rear surface of the cutting blade guide 10 as shown in FIGS. 5(a) and 5(b).
A bending punch avoidance recess 10a is provided so that when the cutting blade moves along the punch guide 10, the cutting blade does not interfere with the cutting blade guide 10 and damage the cutting blade guide 10.

The bending punch 4 has a cutting blade I as shown in Fig. 1.2.
, and is connected to a slider 12 as a first moving means A for horizontally moving the slider. As shown in FIGS. 3(a) to 3(c), the bending punch 4 includes a pressing body 13 for pressing and bending the lead pin 3 on the upper front surface, and a guide surface 11a of a punch guide body 11 for holding the bending punch 4 on the bottom surface. An inclined surface 4a for moving the lead pin 3 diagonally upward along the upper surface, and a pressing body 13 continuously formed on the upper surface for bending the lead pin 3 at 90 degrees and then further bending it to make the bending angle of the lead pin 3 an acute angle. It has a rubbing surface 4b. The pressing body 13 is
By integrally molding a cutting blade on the lower end thereof, the function of cutting the lead pin 3 together with the cutting blade 1 is added. Further, the inclined surface 4a is formed on the punch guide body 1 as shown in FIG.
The rubbing surface 4b is formed parallel to the bending surface 7a of the bending diamond.

In addition, in order to prevent damage to the mold when bending the lead pin 3 at an acute angle with the scraping surface 4b of the bending punch 4, the distance R1 from the scraping surface 4b to the lead pin 3 and the bending angle are set as shown in FIG. Distance M from the punch guide body 11 to the inclined surface 4a of the bending punch 4 when the punch 4 retreats
The relationship with I22 must be a1≦Q2.

As shown in FIG. 1, the slider 12 is arranged behind the bending punch 4, and is horizontally movable by driving a cylinder (not shown).

As shown in FIGS. 4(a) and 4(b), the slider 12 is provided with a recess 12a on its upper surface, and the recess is connected to a stopper 88 provided protruding from the inner wall of the clamp base 8 shown in FIG. The horizontal movement of the slider 12 is regulated by the contact.

The method of connecting the bending punch 4 and the slider 12 is to fix the bending punch 4 when the bending punch 4 moves horizontally, and to fix the bending punch 4 when the bending punch 4 moves diagonally upward with respect to the horizontal direction. In order to make the bending punch 4 free, a T-shaped fitting recess 4c (see FIGS. 3(a) and 3(b)) is formed vertically through the rear part of the bending punch 4, and the front surface of the slider 12. A T-shaped fitting protrusion 12b (Fig. 4(a)
(b)) are fitted and combined. Thereby, the bending punch 4 can be positioned in the horizontal direction and the bending punch 4 can be kept free in the vertical direction.

That is, the second moving means B is configured such that the bending punch 4 is connected to the inclined surface 4a of the bending punch 4 and the guide surface 11a of the punch guide 11 for moving the bending punch 4 diagonally upward with respect to the horizontal direction. It consists of a fitting recess 4C of the bending punch 4 and a fitting convex part 12b of the slider 12, which allow the bending punch 4 to be free vertically relative to the slider 12 when moving upward.

In addition, in FIG. 1, 20 is a chucking head.

Next, the cutting and bending operations of the glued pins of electronic components in the cutting and bending apparatus described above will be explained based on FIGS. 6 to 8.

In the first step, the lead pins 3 of the electronic component 2 are clamped between the bending diamond and the clamp table 8 to fix the lead pins 3 of the electronic component 2.

In the second stage, the cutting blade 1 is horizontally moved forward along the cutting blade guide 10 of the guide stand 9, and is brought to face the bending punch 4 at the retreating end position, and the pressing body 13 of the cutting blade 1 and the bending punch 4 is moved horizontally forward. The lead pin 3 is cut to a predetermined size (this state is shown in FIG. 6).

In the third stage, the bending punch 4 is horizontally moved forward by the slider 12, and the lead pin 3 is bent at 90 degrees by the pressing body 13 of the bending punch 4 (this state is
(shown in figure).

In the fourth step, when the folding punch 4 is further horizontally moved forward, the folding punch 4 is raised by the mutual cam action of the guide surface 11a of the punch guide 11 and the inclined surface 4a of the folding punch 4. Then, the lead pin 3 is rubbed up against the bending surface 7a of the bending diamond by the rubbing surface 4b of the bending punch 4, so that the bending angle of the lead pin 3 becomes an acute angle (this state is shown in FIG. 8).

After cutting the lead pin 3 to a predetermined size, the first moving means A moves the bending punch 4 horizontally to bend the lead pin 3 at 90 degrees, and then the second moving means B moves the bending punch 4 from the horizontal direction. Since the lead pin 3 can be bent at an acute angle by moving diagonally upward, the lead pin 3 of the electronic component 2 can be reliably bent at an acute angle.

Therefore, it is possible to prevent the electronic component 2 from tilting when it is mounted on the board, and moreover, the cutting and bending steps, which were conventionally performed by separate devices, can be performed with a single device.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, the second moving means in the above embodiment may be configured to move the bending punch 4 in a diagonal direction with respect to the linear direction using a cylinder or the like after cutting the lead pin.

<Effects of the Invention> As is clear from the above description, according to the present invention, a bending die for bending a glued pin of an electronic component, a clamping stand for fixing a lead pin, and a cutting die for cutting a lead pin to a predetermined size are provided. It is equipped with a cutting blade and a bending punch for pressing the lead pin toward the bending die and bending the lead pin.
A first moving means for bending the lead pin at an acute angle and a second moving means for moving the bending punch diagonally with respect to the straight direction to bend the lead pin at an acute angle are provided, so the lead pin is fixed in the first step. Then, in the second step, the lead pin is cut, in the third step, the bending punch is moved linearly by the first moving means to bend the lead pin at 90 degrees, and in the fourth step, the moving direction of the bending punch is changed by the second moving means. The lead pin can be bent at an acute angle.

Therefore, it is possible to reliably bend the lead pin of an electronic component at an acute angle, and there is an excellent effect that the cutting process and the bending process can be performed with a single device.

[Brief explanation of drawings]

Fig. 1 is a side view of a lead pin cutting/folding device for electronic components showing an embodiment of the present invention, Fig. 2 is a plan view thereof, and Fig. 3(a) is a plan view of a bending punch. b
) is a side view of the slider, FIG. 4(e) is a front view of the slider, FIG. 4(a) is a plan view of the slider, and FIG.
) is a side view thereof, FIG. 5(a) is a plan view of the guide stand, FIG. 5(b) is a side view thereof, FIG. The figure shows a state in which an electronic component glue-do pin is bent at 90 degrees, FIG. 8 shows a state in which an electronic component lead bin is bent at an acute angle, and FIG. 9 is a side view of a conventional electronic component lead pin cutting device. FIG. 10 is a side view of a conventional electronic component glue-dopin bending device, and FIG. 11 is an explanatory diagram showing that the lead bin cannot be bent at an acute angle in the prior art. 4c: Fitting recess, 7: Bending die, 7a: Bending surface, 8: Clamp stand, 9: Guide stand, lO: Cutting blade guide, 11: Punch guide, 'lla: Guide surface, 12 Nislider 12
b: Fitting convex portion, 13: Pressing body, A: First moving means, B:
Second means of transportation. Applicant Sharp Corporation

Claims (1)

[Claims] A bending die for bending lead pins of electronic components,
Lead pin cutting for electronic components, comprising a clamp stand for fixing the lead pin, a cutting blade for cutting the lead pin to a predetermined size, and a bending punch for pressing the lead pin toward a bending die and bending the lead pin. In the bending device, a first moving means for linearly moving the bending punch to bend the lead pin at 90 degrees;
A lead pin cutting/folding device for electronic components, further comprising a second moving means for moving the bending punch in a diagonal direction with respect to a linear direction to bend the lead pin at an acute angle.