JPH03265164A - Lead pin cutting and bending device of electronic component - Google Patents
Lead pin cutting and bending device of electronic componentInfo
- Publication number
- JPH03265164A JPH03265164A JP2065093A JP6509390A JPH03265164A JP H03265164 A JPH03265164 A JP H03265164A JP 2065093 A JP2065093 A JP 2065093A JP 6509390 A JP6509390 A JP 6509390A JP H03265164 A JPH03265164 A JP H03265164A
- Authority
- JP
- Japan
- Prior art keywords
- punch
- bending
- pin
- lead pin
- bend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 title abstract 9
- 230000001154 acute Effects 0.000 abstract 3
Abstract
PURPOSE: To bend a lead pin surely at an acute angle by providing a bending means to move a bending punch linearly and to bend the lead pin at 90° and a bending means to move the punch in an oblique direction and to bend the lead pin at an acute angle.
CONSTITUTION: A lead pin 3 of an electronic component 2 is held between a bending die 7 and a clamp base 8 and fixed. A cutting blade 1 is moved horizontally forward along a guide body 10 of a guide base 9 and the pin 3 is cut to a specified size by the blade 1 and a pressing body 13 of the bending punch 4. The punch 4 is moved forward by a slider 12 and the pin 3 is bent at 90° by the pressing body 13. The punch 4 is further moved forward horizontally; then, the punch 4 rises through mutual cam operation between a guide surface 11a of a punch guide body 11 and an incline 4a of the punch 4. Thereby, the pin 3 is slided up to a bending surface 7a of the bending die 7 by a sliding-up surface 4b of the punch 4 and a bending angle of the pin 3 makes an acute angle.
COPYRIGHT: (C)1991,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2065093A JPH03265164A (en) | 1990-03-14 | 1990-03-14 | Lead pin cutting and bending device of electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2065093A JPH03265164A (en) | 1990-03-14 | 1990-03-14 | Lead pin cutting and bending device of electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03265164A true JPH03265164A (en) | 1991-11-26 |
Family
ID=13276965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2065093A Pending JPH03265164A (en) | 1990-03-14 | 1990-03-14 | Lead pin cutting and bending device of electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03265164A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04111754U (en) * | 1991-03-19 | 1992-09-29 | ||
CN103309259A (en) * | 2013-06-18 | 2013-09-18 | 上海埃德电子股份有限公司 | Coil pin trimming equipment applicable to filter manufacturing |
KR101491742B1 (en) * | 2013-07-29 | 2015-02-09 | 주식회사 이랜텍 | Apparatus for bending condenser lead |
CN113410070A (en) * | 2021-06-18 | 2021-09-17 | 东莞士格电子集团有限公司 | Guide assembling mechanism of high seat plate of capacitor and using method thereof |
CN113724951A (en) * | 2021-08-27 | 2021-11-30 | 台州精丰智能科技有限公司 | Automatic corner folding machine for chip resistor and processing method thereof |
-
1990
- 1990-03-14 JP JP2065093A patent/JPH03265164A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04111754U (en) * | 1991-03-19 | 1992-09-29 | ||
CN103309259A (en) * | 2013-06-18 | 2013-09-18 | 上海埃德电子股份有限公司 | Coil pin trimming equipment applicable to filter manufacturing |
KR101491742B1 (en) * | 2013-07-29 | 2015-02-09 | 주식회사 이랜텍 | Apparatus for bending condenser lead |
CN113410070A (en) * | 2021-06-18 | 2021-09-17 | 东莞士格电子集团有限公司 | Guide assembling mechanism of high seat plate of capacitor and using method thereof |
CN113724951A (en) * | 2021-08-27 | 2021-11-30 | 台州精丰智能科技有限公司 | Automatic corner folding machine for chip resistor and processing method thereof |
CN113724951B (en) * | 2021-08-27 | 2022-03-18 | 台州精丰智能科技有限公司 | Automatic corner folding machine for chip resistor and processing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH03265164A (en) | Lead pin cutting and bending device of electronic component | |
JPH01183892A (en) | Lead-wire cutting apparatus for electronic part | |
JPS63123531A (en) | Bending method for sheet | |
JPS63183723A (en) | Bending method for lead of resin sealing semiconductor device | |
JPS62127137A (en) | Terminal straightening device | |
JPH03142019A (en) | Flanging method of panel parts | |
JPS5677030A (en) | Punching device | |
JPH0491836A (en) | Apparatus for producing lead terminal | |
JPS56139819A (en) | Wire end cutter | |
JPS5424389A (en) | Digital pitch setting device for unit punches | |
JPS60166135A (en) | Lead cut and lead bending device of hybrid ic or the like | |
JPH03230836A (en) | Method for bending and post processing suturing needle with cutting edge and its post processing device | |
JPS6165461A (en) | Automatic pressing apparatus for cutting ic lead frame | |
JPS62289334A (en) | Forming method for loop-shaped member to be formed and forming machine therefor | |
JPH01273627A (en) | Press die | |
JPH02137618A (en) | Method for bending blade plate and its preventing device for blade edge damage | |
JPH01143400A (en) | Lead forming apparatus | |
JPH03219661A (en) | Outer lead bending device for semiconductor package | |
JPS6272435A (en) | Method and device for burring working | |
JPH03218099A (en) | Component mounting method and component feeder | |
JPS60148635A (en) | Cutting and bending metallic die for chip forming article terminal | |
JPH02247024A (en) | Punching device | |
JPS5681936A (en) | Lead wire forming device | |
JPS63289899A (en) | Jumper wire insertion device | |
JPH01214149A (en) | Bending die for lead part in semiconductor device and the like |