JP2821461B2 - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
JP2821461B2
JP2821461B2 JP9185131A JP18513197A JP2821461B2 JP 2821461 B2 JP2821461 B2 JP 2821461B2 JP 9185131 A JP9185131 A JP 9185131A JP 18513197 A JP18513197 A JP 18513197A JP 2821461 B2 JP2821461 B2 JP 2821461B2
Authority
JP
Japan
Prior art keywords
light emitting
pair
emitting diode
leads
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9185131A
Other languages
Japanese (ja)
Other versions
JPH1093142A (en
Inventor
栄二 島崎
和義 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP9185131A priority Critical patent/JP2821461B2/en
Publication of JPH1093142A publication Critical patent/JPH1093142A/en
Application granted granted Critical
Publication of JP2821461B2 publication Critical patent/JP2821461B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

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  • Led Device Packages (AREA)

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、発光ダイオードに
関する。 【0002】 【従来の技術】図2は、従来の発光ダイオードを示す図
であり、まず、その構成を説明すると、1は絶縁体に所
定パターンの導電膜を被着した基板であり、該基板1に
はリード差し込み用の孔が基板1の表面に略垂直に穿設
されている。この孔は一対づつ組になっており、該孔は
前記パターン形成された導電膜を介して図外の電源に接
続されている。 【0003】この一対の孔には発光ダイオード2の一対
のリード3が挿入されており、該リード3は発光部4に
接続されている。リード3は、発光部4から互いに平行
に延在する支持部5と、支持部5より広い間隔で互いに
平行に延在する挿入部6と、両端が支持部5と挿入部6
とにそれぞれ連結され略ハの字形に延在する連結部7と
で構成されている。 【0004】かかる構成の発光ダイオード2を基板1に
取り付けるには、まず、一対のリード3を基板1の孔に
位置合せし、発光部4を矢印Fの方向に押圧すると、挿
入部6は孔内に挿入され、発光ダイオード2は基板1に
固定される。 【0005】 【発明が解決しようとする課題】しかしながら、従来の
発光ダイオード2にあっては、連結部7が略ハの字形で
あったので、基板1への取り付け時に、矢印Fの方向の
力の外に矢印Fと異なる方向の力、例えば矢印Aの方向
の力を受けたり、切断のため一方のリードを引っ張る
と、一方のリードが孔内を摺動し、発光部2が図3に示
されているように傾くという問題点があった。 【0006】また、自動挿入機を使用してインサートす
る際に生じる打撃力により、リードのくい込みを生じる
ため、発光部14の頂点までの実装寸法Hがバラつくと
いった問題点もあった。また、従来においては、例えば
実開昭60−63962号公報に記載のような、砲弾形
状又は円筒形状の発光部と、該発光部から互いに平行に
延在する一対の支持部、該一対の支持部の間隔より広い
間隔でお互いに平行に延在する一対の挿入部及び前記支
持部から直角に折曲され前記挿入部へも直角に折曲され
て前記支持部と前記挿入部とを連結する一対の連結部か
らなる一対のリードとを具備し、取付高さを規定され得
る発光ダイオードランプが提案されている。 【0007】しかしながら、この種の発光ダイオードラ
ンプのようなリード形状とした場合には、該リードの支
持部と連結部とが直角に折曲されて連結されているため
に、自動実装機を使用して基板にリードを挿入して前記
発光ダイオードランプを取り付けるときに連結部が取付
基板に衝突したときに生じる衝撃力の垂直方向成分の力
のほぼ全てを発光部が受けることになり、発光部である
モールドに亀裂等が生じ発光機能を低減乃至損失する危
惧がある。また、発光部に斜め方向に応力がかかった場
合には、リードの支持部と連結部とが直角に折曲されて
連結されているために、該折曲部で変形し易いのであ
る。 【0008】また、一対の支持部及び一対の挿入部が両
方とも平行に延在するように構成されているため、一対
の支持部を発光部に取り付ける間隔を変更しないように
すると、挿入部の取付間隔が大きくなりスペースをとる
欠点があり、挿入部の取付間隔もそのままにすると連結
部が短くなり、図2のものと同じような欠点を有するこ
とになる。更に、挿入部及び連結部をそのままに設定し
ようとすると、発光部での支持部の取付間隔が狭くな
り、図2のように矢印A方向の力に対し、支持部での強
度が弱くなってしまうという欠点があった。例えば、実
開昭61−102062号公報では、支持部の発光部で
の取付位置を挿入部の基板での取付位置と直角方向にす
ることで連結部を長くとるようにしているがやはり図2
の矢印A方向(挿入部の取付位置方向の力)の力に対し
ては強度が極端に弱くなってしまう。 【0009】 【課題を解決するための手段】本発明は、上記の課題を
解決するために次のような構成をとる。すなわち、本発
明の発光ダイオードは、発光部と該発光部の底面から延
在する一対のリードとを有する発光ダイオードにおい
て、前記一対のリードは、前記発光部から互いに接近し
つつ延在する一対の支持部と、互いに略平行に且つ一対
の前記支持部の間隔より広い間隔で延在する一対の挿入
部と、前記支持部と前記挿入部とを連結する一対の連結
部とからなることを特徴とするものである。 【0010】また、本発明は、上記構成の発光ダイオー
ドにおいて、発光部が、該発光部の底面側に拡張部を有
するものを包含する。更に、本発明は、これら構成の発
光ダイオードにおいて、一対の挿入部の間隔が発光部の
幅と略同じかそれよりも狭いことを特徴とするものをも
包含する。 【0011】 【発明の実施の形態】図1は、本発明の一実施例を示す
正面図であり、図中、符号12は発光ダイオードを、符
号14は前記発光ダイオード12の発光部を、符号13
は基板11に形成された孔に挿入され取り付けられる一
対のリードをそれぞれ示す。発光ダイオード12は、発
光部14と該発光部14の底面から下方へ向かって延在
する一対のリード13からなり、前記発光部14の底面
側には拡張部14aが設けられている。 【0012】一対のリード13は、発光部14の底面か
ら下方へ向かって互いに接近しつつ延在する一対の支持
部15と、互いに略平行で基板11の孔に挿入される一
対の挿入部と、両端を支持部15と挿入部16とにそれ
ぞれ接続することにより支持部15と挿入部16とを連
結する一対の連結部17とからなり、該連結部17は挿
入部16に略垂直に延在し、前記一対の挿入部は一対の
支持部の間隔より広い間隔で下方へ向かって延在してい
る。 【0013】発光ダイオード12の一対のリード13
は、例えば一対のリードを発光部14の底面から略平行
に下方へ延びるようにして形成した後に、かかる支持部
15、連結部17及び挿入部16からなる構成に屈曲加
工される。このとき、一対の支持部17を、発光ダイオ
ード12の発光部14の底面から下方へ向かって互いに
接近するように曲げ加工するので、この曲げ加工時、一
対のリード13が延出する発光ダイオード12の発光部
14の底面部において、一対のリード13が発光部14
から突出する部位から外側方向への応力が生じ、発光部
14が例えば一般的に用いられる樹脂封止してなるもの
である場合には、発光部14の樹脂封止に亀裂が生じる
ことが危惧されるが、上記のように発光部14の底面側
に拡張部14aを設けることにより発光部14の樹脂封
止の亀裂発生等の問題を効果的に防止し得るのである。 【0014】また、上記のように発光ダイオード12の
一対のリード13の支持部15を徐々に接近させながら
延設させることにより、一対の挿入部17の間隔を狭く
し得るので、一対の挿入部17を発光ダイオード12の
発光部14の幅に対して略同一若しくはより狭くして形
成でき、発光ダイオードの高集積化を図ることができ、
更には発光ダイオードの発光部を大きくすることができ
る。 【0015】次に、発光ダイオード12を基板11に取
り付ける場合においては、発光ダイオード12は、その
一対のリード13が前記従来例で示したのと同様の構成
の基板11の孔に挿入されて取り付けられ、一対のリー
ド13の連結部17が挿入部16に対して略垂直に屈曲
されているので、基板11に実装されたときには、一対
のリード13の連結部17を基板11の表面に略水平と
なり、基板11の表面と線接触的に当接し得る。 【0016】かかる構成の発光ダイオード12を基板1
1に取り付ける動作について述べれば、発光ダイオード
12の一対のリード13の挿入部16を一対の孔にそれ
ぞれ合せ、しかる後、発光部14を下方(矢印F)へ押
圧する。そうすると、挿入部16は連結部17が基板1
1の表面に当接するまで挿入され、連結部17をストッ
パーとして用いることができる。 【0017】また、連結部17が基板11の表面に対し
て略水平に延在するので、連結部17を基板11の表面
にほとんど隙間の無い状態で当接でき、発光ダイオード
12の発光部14を基板面から距離(実装寸法)Lを一
定にして取付基板から所望の高さに制度よく取付できる
とともに、一対の支持部15が互いに接近しつつ延在す
るので、発光部14に斜め方向の力が加わったとしても
リード13の変形を軽減でき、発光ダイオード12の発
光部を傾くことなく基板11表面に垂直に取り付けるこ
とができ、取付後に外力により傾くことも防止できるの
である。 【0018】更に、本発明では発光ダイオード12の一
対のリード13を発光部14の底面から下方へ向かって
接近するように延在するので、連結部17と支持部15
とのなす角度θはθ<90゜になり、孔間隔Dを一定と
した場合、θ=90゜のときより連結部17の長さを長
くすることができるので、発光ダイオード12をその一
対のリード13を基板11に挿入して取り付けるときに
発光ダイオード12にかかる打撃力をより多く吸収する
ことができるのである。加えて、リード13の連結部1
7と支持部15とのなす角度θが鋭角となっているの
で、上記取り付けるときの打撃力を、角度θを直角とす
る場合に比して一層緩和でき、例えば発光ダイオード1
2の一対のリード13の変形、更には例えば発光部14
が発光素子をワイヤボンディングを用いてリードに接続
しこれを樹脂封止するようにしてなる一般的な構造を有
する場合には、樹脂封止の亀裂等の発生やワイヤボンデ
ィングのワイヤ切れなどによる接続の不良発生等を軽減
できるのである。 【0019】また、上記のように一対のリード13の連
結部17の長さを長くでき、しかも基板11の表面と略
水平とし得るので、連結部17を基板11の表面とほと
んど隙間の無い状態で当接でき、基板11の表面に対し
斜め方向の力が発光部に加えられても、該力のリードの
中心線に対する垂直方向分力は従来例に比べ小さくな
り、リードの変形量も少なくなるという利点を有する。 【0020】 【発明の効果】以上説明してきたように、本発明によれ
ば、発光ダイオードの一対のリードを、前記発光部から
互いに接近しつつ延在する一対の支持部と、互いに略平
行に且つ一対の前記支持部の間隔より広い間隔で延在す
る一対の挿入部と、前記支持部と前記挿入部とを連結す
る一対の連結部とから構成したので、基板への取付時に
発光ダイオードが受ける力を効果的に吸収でき、リード
の変形による実装寸法のズレや発光部への悪影響等を著
しく軽減でき、これまで以上に制度の高い取付が実現で
きるのである。 【0021】また、本発明において、発光部の底面側に
拡張部を設けたときは、一対のリードの支持部を徐々に
近接するように内側に曲げ加工する場合に、曲げ加工に
より発光部に不具合が発生することを効果的に防止でき
るのである。更に、本発明のように、発光ダイオードの
一対のリードの支持部を徐々に近接するよう設けること
により、一対のリードの挿入部の間隔を狭くでき、高集
積化を図るこができ、一対の挿入部の間隔を発光部の幅
と略同じかそれよりも狭くしたときには、発光ダイオー
ドを極めて近接乃至接触させた状態においても取付可能
とし得るのである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode. 2. Description of the Related Art FIG. 2 is a view showing a conventional light emitting diode. First, the structure of the light emitting diode will be described. In 1, a hole for inserting a lead is formed substantially perpendicularly to the surface of the substrate 1. The holes are formed in pairs, and the holes are connected to a power source (not shown) via the patterned conductive film. [0003] A pair of leads 3 of the light emitting diode 2 are inserted into the pair of holes, and the leads 3 are connected to the light emitting section 4. The lead 3 includes a support portion 5 extending in parallel from the light emitting portion 4, an insertion portion 6 extending in parallel with the support portion 5 at a wider interval than the support portion 5, and both ends of the support portion 5 and the insertion portion 6.
And a connecting portion 7 which is connected to each other and extends in a substantially C-shape. In order to mount the light emitting diode 2 having such a structure on the substrate 1, first, a pair of leads 3 are aligned with holes of the substrate 1, and the light emitting portion 4 is pressed in the direction of arrow F. The light emitting diode 2 is fixed to the substrate 1. [0005] However, in the conventional light emitting diode 2, since the connecting portion 7 has a substantially C-shape, when the light emitting diode 2 is attached to the substrate 1, the force in the direction of arrow F is required. When a force in a direction different from the arrow F, for example, a force in the direction of the arrow A is applied or one of the leads is pulled for cutting, one of the leads slides in the hole, and the light emitting unit 2 is moved to the position shown in FIG. There was the problem of tilting as shown. In addition, there is also a problem in that a lead force is generated due to a striking force generated when inserting using an automatic insertion machine, so that the mounting dimension H up to the apex of the light emitting portion 14 varies. Conventionally, as described in, for example, Japanese Utility Model Laid-Open Publication No. 60-63962, a bullet-shaped or cylindrical light-emitting portion, a pair of support portions extending parallel to each other from the light-emitting portion, The pair of insertion portions and the support portion extending parallel to each other at a wider interval than the portion are bent at a right angle from the pair of insertion portions, and are also bent at a right angle to the insertion portion to connect the support portion and the insertion portion. There has been proposed a light-emitting diode lamp including a pair of leads including a pair of connecting portions and capable of defining a mounting height. However, in the case of a lead shape such as this type of light emitting diode lamp, an automatic mounting machine is used because the support portion and the connection portion of the lead are connected by being bent at a right angle. When the lead is inserted into the substrate and the light emitting diode lamp is mounted, the light emitting portion receives substantially all of the force of the vertical component of the impact force generated when the connecting portion collides with the mounting substrate. There is a concern that cracks and the like may occur in the mold, and the light emitting function may be reduced or lost. Further, when stress is applied to the light emitting portion in an oblique direction, the support portion of the lead and the connecting portion are bent at a right angle and connected to each other, so that the lead portion is easily deformed at the bent portion. Further, since the pair of support portions and the pair of insertion portions are both configured to extend in parallel, if the interval at which the pair of support portions is attached to the light-emitting portion is not changed, the insertion portion may not be inserted. There is a disadvantage that the mounting interval is increased and a space is taken up, and if the mounting interval of the insertion portion is also kept as it is, the connecting portion is shortened, which has the same defect as that of FIG. Furthermore, if the insertion portion and the connection portion are set as they are, the mounting interval of the support portion in the light emitting portion becomes narrow, and the strength in the support portion becomes weak against the force in the direction of arrow A as shown in FIG. There was a disadvantage that it would. For example, in Japanese Utility Model Laid-Open Publication No. 61-102062, the connecting portion is made longer by setting the mounting position of the support portion at the light emitting portion at right angles to the mounting position of the insertion portion at the substrate.
With respect to the force in the direction of arrow A (the force in the direction of the mounting position of the insertion portion), the strength becomes extremely weak. The present invention has the following configuration in order to solve the above-mentioned problems. That is, a light-emitting diode of the present invention is a light-emitting diode having a light-emitting portion and a pair of leads extending from the bottom surface of the light-emitting portion, wherein the pair of leads extend from the light-emitting portion while approaching each other. It is characterized by comprising a support portion, a pair of insertion portions extending substantially parallel to each other and at an interval wider than the interval between the pair of support portions, and a pair of connection portions connecting the support portion and the insertion portion. It is assumed that. The present invention also includes a light emitting diode having the above structure, wherein the light emitting section has an extension on the bottom side of the light emitting section. Furthermore, the present invention also encompasses a light emitting diode having such a configuration, wherein the interval between the pair of insertion portions is substantially equal to or smaller than the width of the light emitting portion. FIG. 1 is a front view showing an embodiment of the present invention. In FIG. 1, reference numeral 12 denotes a light emitting diode, reference numeral 14 denotes a light emitting portion of the light emitting diode 12, and FIG. 13
Denotes a pair of leads which are inserted and attached to holes formed in the substrate 11, respectively. The light emitting diode 12 includes a light emitting portion 14 and a pair of leads 13 extending downward from the bottom surface of the light emitting portion 14. An extended portion 14a is provided on the bottom surface side of the light emitting portion 14. The pair of leads 13 includes a pair of support portions 15 extending downward from the bottom surface of the light emitting portion 14 while approaching each other, and a pair of insertion portions inserted into holes of the substrate 11 substantially parallel to each other. And a pair of connecting portions 17 connecting the support portion 15 and the insertion portion 16 by connecting both ends to the support portion 15 and the insertion portion 16, respectively. The connection portion 17 extends substantially perpendicularly to the insertion portion 16. The pair of insertion portions extend downward at an interval wider than the interval between the pair of support portions. A pair of leads 13 of the light emitting diode 12
For example, a pair of leads is formed so as to extend downward substantially in parallel from the bottom surface of the light emitting section 14, and then is bent into a configuration including the support section 15, the connecting section 17, and the insertion section 16. At this time, since the pair of supporting portions 17 are bent so as to approach each other downward from the bottom surface of the light emitting portion 14 of the light emitting diode 12, the pair of leads 13 extend during this bending process. A pair of leads 13 is connected to the light emitting portion 14 at the bottom of the light emitting portion 14.
If the light emitting portion 14 is made of, for example, a commonly used resin sealing, a crack may occur in the resin sealing of the light emitting portion 14 when a stress is generated in an outward direction from a portion protruding from the light emitting portion 14. However, by providing the extended portion 14a on the bottom surface side of the light emitting portion 14 as described above, it is possible to effectively prevent problems such as generation of cracks in the resin sealing of the light emitting portion 14. Further, by extending the support portions 15 of the pair of leads 13 of the light emitting diode 12 while gradually approaching each other as described above, the interval between the pair of insertion portions 17 can be reduced. 17 can be formed so as to be substantially the same as or narrower than the width of the light emitting portion 14 of the light emitting diode 12, so that high integration of the light emitting diode can be achieved.
Further, the size of the light emitting portion of the light emitting diode can be increased. Next, when the light-emitting diode 12 is mounted on the substrate 11, the light-emitting diode 12 is mounted by inserting a pair of leads 13 into holes of the substrate 11 having the same structure as that of the conventional example. Since the connecting portion 17 of the pair of leads 13 is bent substantially perpendicularly to the insertion portion 16, when the connecting portion 17 of the pair of leads 13 is mounted on the board 11, the connecting portion 17 of the pair of leads 13 is And can come into line contact with the surface of the substrate 11. The light emitting diode 12 having such a structure is mounted on the substrate 1.
In terms of the operation of attaching the light emitting device to the light emitting device 1, the insertion portions 16 of the pair of leads 13 of the light emitting diode 12 are respectively aligned with the pair of holes, and then the light emitting portion 14 is pressed downward (arrow F). Then, the insertion portion 16 connects the connecting portion 17 to the substrate 1.
The connecting portion 17 can be used as a stopper until it is inserted into contact with the surface of the first member. Further, since the connecting portion 17 extends substantially horizontally with respect to the surface of the substrate 11, the connecting portion 17 can be brought into contact with the surface of the substrate 11 with almost no gap. Can be mounted at a desired height from the mounting substrate with a constant distance (mounting dimension) L from the substrate surface, and since the pair of support portions 15 extend while approaching each other, Even if a force is applied, the deformation of the lead 13 can be reduced, and the light emitting portion of the light emitting diode 12 can be mounted vertically on the surface of the substrate 11 without tilting, and can be prevented from being tilted by external force after mounting. Further, in the present invention, the pair of leads 13 of the light emitting diode 12 extend downward from the bottom surface of the light emitting portion 14 so as to approach, so that the connecting portion 17 and the support portion 15 are provided.
Θ <90 °, and when the hole interval D is constant, the length of the connecting portion 17 can be made longer than when θ = 90 °. When the lead 13 is inserted into and attached to the substrate 11, the impact force applied to the light emitting diode 12 can be absorbed more. In addition, the connecting portion 1 of the lead 13
7 and the supporting portion 15 are acute, so that the impact force at the time of mounting can be further reduced as compared with the case where the angle θ is a right angle.
Deformation of the pair of leads 13, and further, for example, the light emitting section 14
Has a general structure in which a light emitting element is connected to a lead using wire bonding and is sealed with a resin. This can reduce the occurrence of defects. Further, as described above, the length of the connecting portion 17 of the pair of leads 13 can be lengthened and can be substantially horizontal with the surface of the substrate 11, so that the connecting portion 17 has almost no gap with the surface of the substrate 11. Even if a force in an oblique direction to the surface of the substrate 11 is applied to the light emitting portion, the component of the force in the vertical direction with respect to the center line of the lead is smaller than in the conventional example, and the amount of deformation of the lead is smaller. Has the advantage of becoming As described above, according to the present invention, a pair of leads of a light-emitting diode are connected to a pair of support portions extending from the light-emitting portion while approaching each other and substantially parallel to each other. In addition, the light emitting diode includes a pair of insertion portions extending at an interval wider than the interval between the pair of support portions, and a pair of connection portions connecting the support portion and the insertion portion. The received force can be effectively absorbed, the displacement of the mounting dimensions due to the deformation of the lead, the adverse effect on the light emitting section, and the like can be significantly reduced, and the mounting with higher precision than before can be realized. Further, in the present invention, when the extended portion is provided on the bottom surface side of the light emitting portion, when the support portion of the pair of leads is bent inward so as to gradually approach, the bending portion is formed on the light emitting portion. Failure can be effectively prevented from occurring. Further, as in the present invention, by providing the support portions of the pair of leads of the light emitting diode so as to gradually approach each other, the interval between the insertion portions of the pair of leads can be narrowed, and high integration can be achieved. When the distance between the insertion portions is substantially equal to or smaller than the width of the light emitting portion, the light emitting diode can be attached even in a state of being extremely close to or in contact with the light emitting diode.

【図面の簡単な説明】 【図1】本発明の一実施例を示す正面図。 【図2】従来例の正面図。 【図3】従来例の問題点を説明するための説明図。 【符号の説明】 11 基板 12 発光ダイオード 13 リード 14 発光部 14a 拡張部 15 支持部 16 挿入部 17 連結部[Brief description of the drawings] FIG. 1 is a front view showing an embodiment of the present invention. FIG. 2 is a front view of a conventional example. FIG. 3 is an explanatory diagram for explaining a problem of a conventional example. [Explanation of symbols] 11 Substrate 12. Light emitting diode 13 Lead 14 Light emitting unit 14a Extension 15 Support 16 insertion section 17 Connecting part

Claims (1)

(57)【特許請求の範囲】 1.発光部と該発光部の底面から延在する一対のリード
とを有する発光ダイオードにおいて、前記一対のリード
は、前記発光部から互いに接近しつつ延在する一対の支
持部と、互いに略平行に且つ一対の前記支持部の間隔よ
り広い間隔で延在する一対の挿入部と、前記支持部と前
記挿入部とを連結する一対の連結部とからなることを特
徴とする発光ダイオード。 2.発光部が、該発光部の底面側に拡張部を有すること
を特徴とする請求項1に記載の発光ダイオード。 3.一対の挿入部の間隔が発光部の幅と略同じかそれよ
りも狭いことを特徴とする請求項1又は2に記載の発光
ダイオード。
(57) [Claims] In a light emitting diode having a light emitting portion and a pair of leads extending from a bottom surface of the light emitting portion, the pair of leads are substantially parallel to each other and a pair of support portions extending from the light emitting portion while approaching each other. A light-emitting diode comprising: a pair of insertion portions extending at an interval wider than the interval between the pair of support portions; and a pair of connection portions connecting the support portion and the insertion portion. 2. The light emitting diode according to claim 1, wherein the light emitting unit has an extension on a bottom side of the light emitting unit. 3. The light emitting diode according to claim 1, wherein a distance between the pair of insertion portions is substantially equal to or smaller than a width of the light emitting portion.
JP9185131A 1997-07-10 1997-07-10 Light emitting diode Expired - Lifetime JP2821461B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9185131A JP2821461B2 (en) 1997-07-10 1997-07-10 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9185131A JP2821461B2 (en) 1997-07-10 1997-07-10 Light emitting diode

Publications (2)

Publication Number Publication Date
JPH1093142A JPH1093142A (en) 1998-04-10
JP2821461B2 true JP2821461B2 (en) 1998-11-05

Family

ID=16165423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9185131A Expired - Lifetime JP2821461B2 (en) 1997-07-10 1997-07-10 Light emitting diode

Country Status (1)

Country Link
JP (1) JP2821461B2 (en)

Also Published As

Publication number Publication date
JPH1093142A (en) 1998-04-10

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