JPH064544Y2 - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH064544Y2 JPH064544Y2 JP1988165581U JP16558188U JPH064544Y2 JP H064544 Y2 JPH064544 Y2 JP H064544Y2 JP 1988165581 U JP1988165581 U JP 1988165581U JP 16558188 U JP16558188 U JP 16558188U JP H064544 Y2 JPH064544 Y2 JP H064544Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- lead frame
- claw
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は、集積回路基板に安定して固定可能にしたリ
ードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a lead frame which can be stably fixed to an integrated circuit board.
〔従来の技術〕 従来、リードフレームには、第５図の（Ａ）に示すよう
に、集積回路基板の表裏両面に形成された電極パッドを
外部に同時に引き出すための二つの爪１２、１４が、外
部リード１６から分岐して、Ｕ字状に形成されたもので
ある。双方の爪１２、１４には、集積回路基板へのリー
ドフレーム１０の設置位置を均一化する基板制止脚１２
２、１４２が形成されており、これが集積回路基板の側
面に突き当たったところで、リードフレーム１０の設置
位置が決定される。[Prior Art] Conventionally, as shown in FIG. 5 (A), a lead frame is conventionally provided with two claws 12 and 14 for simultaneously pulling out electrode pads formed on both front and back surfaces of an integrated circuit board to the outside. It is formed into a U-shape by branching from the external lead 16. On both of the claws 12 and 14, a board restraining leg 12 for uniformizing the installation position of the lead frame 10 on the integrated circuit board is provided.
2, 142 are formed, and the installation position of the lead frame 10 is determined when this abuts the side surface of the integrated circuit board.
そして、このような従来のリードフレーム１０では、第
５図の（Ｂ）に示すように、双方の爪１２、１４が外部
リード１６に沿う中心線に対して対称的に配置されてお
り、このような構造を採ることにより集積回路基板への
設置の安定化が図られている。Then, in such a conventional lead frame 10, as shown in FIG. 5B, both claws 12 and 14 are symmetrically arranged with respect to the center line along the outer lead 16. By adopting such a structure, the installation on the integrated circuit board is stabilized.
〔考案が解決しようとする課題〕 ところで、上述したリードフレーム１０は、集積回路基
板への設置位置を均一化するために形成されたものでは
あるが、これが設置される側の集積回路基板の特質を考
慮したものとはいえない。[Problems to be Solved by the Invention] Although the lead frame 10 described above is formed in order to make the installation positions on the integrated circuit board uniform, the characteristics of the integrated circuit board on the side where the lead frame 10 is installed are characteristic. Is not considered.
例えば、第６図に示すように、集積回路基板２０にリー
ドフレーム１０を設置しようとしても、集積回路基板２
０の側面にバリ２２が生じていた場合には、爪１４の基
板制止脚１４２がバリ２２に突き当たり、リードフレー
ム１０は集積回路基板２０の基板面と傾き（θ）が生じ
るため、リードフレーム１０の設置状態が不安定になる
とともに、リードフレーム１０に対する集積回路基板２
０の挿入長が短くなり、接続の信頼性が低下する。For example, as shown in FIG. 6, even if the lead frame 10 is installed on the integrated circuit board 20, the integrated circuit board 2
When the burr 22 is generated on the side surface of 0, the board restraining leg 142 of the claw 14 hits the burr 22, and the lead frame 10 is inclined (θ) with the board surface of the integrated circuit board 20. Of the integrated circuit board 2 with respect to the lead frame 10 becomes unstable.
The insertion length of 0 becomes short, and the reliability of connection decreases.
特に、集積回路基板２０は、セラミックやアルミナなど
で形成され、その表面にＶ溝を成すブレークラインを以
て切り離すため、切断端面にバリ２２が生じ易い。ま
た、集積回路基板２０にガラスエポキシ系や紙フェノー
ル系などの繊維質を含有する基板をプレス加工により打
ち抜いたものが使用される場合にも、その切断端面にバ
リ２２を生じるのは必死である。In particular, since the integrated circuit board 20 is formed of ceramic, alumina, or the like and is cut off by a break line forming a V groove on the surface thereof, burrs 22 are likely to occur on the cut end surface. Further, even when the integrated circuit board 20 used is one in which a board containing a fiber material such as glass epoxy or paper phenol is punched out by press working, it is inevitable that the burrs 22 are formed on the cut end face thereof. .
そこで、この考案は、集積回路基板の加工時に生じた縁
面のバリによる固定強度の低下やずれを防止したリード
フレームを提供することを目的とする。Therefore, an object of the present invention is to provide a lead frame in which the fixing strength is prevented from being lowered or displaced due to a burr on an edge surface generated during processing of an integrated circuit board.
この考案のリードフレームは、集積回路基板の外部リー
ドとして設置されるリードフレームであって、前記集積
回路基板の表裏両面に設置された電極パッドを挟み込む
二つの爪を前記集積回路基板の表裏面側に互い違いに形
成し、各爪に前記集積回路基板の縁面に対応した基板制
止脚を形成し、一方の爪の基板制止脚と他方の爪の基板
制止脚とを、前記外部リードの長手方向に沿って互いに
ずらし、一方の基板制止脚を前記集積回路基板の縁面に
面接触させたことを特徴とする。The lead frame of the present invention is a lead frame installed as an external lead of an integrated circuit board, and has two claws for sandwiching electrode pads installed on both front and back surfaces of the integrated circuit board. Staggeredly formed on each claw, and a substrate stop leg corresponding to the edge surface of the integrated circuit board is formed on each claw, and a substrate stop leg of one claw and a substrate stop leg of the other claw are formed in the longitudinal direction of the external lead. Along one side of the integrated circuit board, and one of the board restraining legs is in surface contact with the edge surface of the integrated circuit board.
したがって、この考案のリードフレームでは、外部リー
ドの長手方向に沿って互いにずらして配置した双方の基
板制止脚のうち、集積回路基板の側面に対して後方にず
らして配置した基板制止脚を、集積回路基板の側面に生
じたバリに接触させることにより、集積回路基板の基板
面に対するリードフレームの傾きが打ち消され、集積回
路基板に安定した状態に設置することができる。Therefore, in the lead frame of the present invention, of the two board restraining legs arranged to be displaced from each other along the longitudinal direction of the external lead, the board restraining legs arranged to be shifted rearward with respect to the side surface of the integrated circuit board are integrated. By contacting the burr generated on the side surface of the circuit board, the inclination of the lead frame with respect to the board surface of the integrated circuit board is canceled, and the integrated circuit board can be installed in a stable state.
第１図は、この考案のリードフレームの実施例を示す。 FIG. 1 shows an embodiment of the lead frame of the present invention.
第１図の（Ａ）に示すように、この実施例のリードフレ
ーム１０では、集積回路基板を支持するための二つの爪
１２、１４が、外部リード１６から分岐してＵ字状に形
成されている。このリードフレーム１０は、金属板を所
定の形状に打ち抜いた後に加圧成形されたもので、この
関係上、双方の爪１２、１４は互い違いに対向して配置
されることになる。ここで、双方の爪１２、１４を、便
宜上、寸法基準爪１２および寸法調整爪１４と称して区
別するものとする。As shown in FIG. 1A, in the lead frame 10 of this embodiment, two claws 12 and 14 for supporting the integrated circuit board are branched from the external lead 16 and formed in a U shape. ing. The lead frame 10 is formed by punching a metal plate into a predetermined shape and then press-molding. Due to this relationship, both the claws 12 and 14 are alternately arranged to face each other. Here, both the claws 12 and 14 will be referred to as the size reference claw 12 and the size adjusting claw 14 for the sake of convenience.
寸法基準爪１２および寸法調整爪１４の双方には、それ
ぞれ、基板制止脚１２２、１４２、基板支持脚１２４、
１４４、基板挿入ガイド１２６、１４６が形成されてい
る。これらの各部位は、寸法基準爪１２および寸法調整
爪１４の双方の爪に対になって配置され、この対になっ
た脚部同士が互いに作用しあいながら、次に示すような
所定の機能を果たしている。For both the dimension reference claw 12 and the dimension adjustment claw 14, the substrate stop legs 122, 142, the substrate support legs 124,
144, and board insertion guides 126 and 146 are formed. Each of these parts is arranged in pairs with both the dimension reference claw 12 and the dimension adjustment claw 14, and the paired legs work together to perform a predetermined function as described below. Is playing.
即ち、基板制止脚１２２、１４２は、集積回路基板の側
面に突き当たる部位であり、これによって、リードフレ
ーム１０の集積回路基板に対する設置位置や設置角度が
決定される。また、基板支持脚１２４、１４４は、集積
回路基板の基板面に接触する部位であり、これによっ
て、集積回路基板はその表裏両面から挟み込まれる。さ
らに、基板挿入ガイド１２６、１４６によって、集積回
路基板へのリードフレーム１０の挟み込みが容易なもの
となる。That is, the board restraining legs 122 and 142 are portions that abut on the side surface of the integrated circuit board, and thereby the installation position and the installation angle of the lead frame 10 with respect to the integrated circuit board are determined. Further, the board supporting legs 124 and 144 are portions that come into contact with the board surface of the integrated circuit board, whereby the integrated circuit board is sandwiched from both front and back surfaces thereof. Further, the board insertion guides 126 and 146 facilitate the sandwiching of the lead frame 10 in the integrated circuit board.
基板制止脚１２２、１４２は、第１図の（Ｂ）に示すよ
うに、外部リード１６の長手方向に対して、ｔ１の差異
を以て配置されている。また、寸法基準爪１２と寸法調
整爪１４との間隔、即ち、集積回路基板の基板面に接触
する基板支持脚１２４、１４４の間隔ｗ１は、集積回路
基板の肉厚よりも幾分狭くなるように配置されている。As shown in FIG. 1B, the substrate restraining legs 122 and 142 are arranged with a difference of t 1 with respect to the longitudinal direction of the external lead 16. In addition, the distance between the dimension reference claw 12 and the dimension adjusting claw 14, that is, the distance w 1 between the substrate support legs 124 and 144 contacting the substrate surface of the integrated circuit board is somewhat narrower than the thickness of the integrated circuit board. Are arranged as follows.
次に、第２図は、第１図に示したリードフレーム１０を
集積回路基板２０に設置した状態を示しており、リード
フレーム１０が設置される集積回路基板２０のエッジの
一方にはバリ２２が生じている。Next, FIG. 2 shows a state in which the lead frame 10 shown in FIG. 1 is installed on the integrated circuit board 20, and a burr 22 is formed on one edge of the integrated circuit board 20 on which the lead frame 10 is installed. Is occurring.
第２図の（Ａ）に示すように、集積回路基板２０のバリ
２２の生じている側に寸法調整爪１４を対応させて、リ
ードフレーム１０は矢印で示す力Ｆによって挟み込まれ
る。このとき、基板挿入ガイド１２６、１４６は、集積
回路基板２０のエッジとの接触時に、力Ｆに伴う応力を
受けることになる。この応力によって、寸法基準爪１２
および寸法調整爪１４の間隔ｗ１は、基板面の法線方向
に拡張される。As shown in FIG. 2A, the lead frame 10 is sandwiched by the force F indicated by the arrow, with the dimension adjusting claw 14 corresponding to the side where the burr 22 of the integrated circuit board 20 is formed. At this time, the board insertion guides 126 and 146 will be subjected to the stress caused by the force F when coming into contact with the edge of the integrated circuit board 20. Due to this stress, the dimension reference claw 12
And the interval w 1 between the dimension adjusting claws 14 is expanded in the direction normal to the substrate surface.
互いに拡張された寸法基準爪１２および寸法調整爪１４
は、集積回路基板２０の表裏両面に配置された電極パッ
ド２４と接触して力Ｆを表す矢印の方向に滑り動き、リ
ードフレーム１０は、その基板制止脚１２２、１４２が
集積回路基板２０の側面に突き当たって停止することに
なる。ここで、寸法基準爪１２および寸法調整爪１４
は、金属の有する復元力によって集積回路基板２０に固
く挟み込まれる。The dimension reference claw 12 and the dimension adjusting claw 14 which are mutually expanded.
Contacts the electrode pads 24 arranged on both front and back surfaces of the integrated circuit board 20 and slides in the direction of the arrow representing the force F. In the lead frame 10, the board stopping legs 122 and 142 of the lead frame 10 are located on the side surfaces of the integrated circuit board 20. It will hit and stop. Here, the size reference claw 12 and the size adjustment claw 14
Are firmly sandwiched between the integrated circuit boards 20 by the restoring force of the metal.
集積回路基板２０の側面に突き当たって停止したリード
フレーム１０は、第２図の（Ｂ）に示すように、基板制
止脚１２２、１４２の一部が集積回路基板２０のエッジ
に突き当たり、特に、寸法調整爪１４の基板制止脚１４
２はバリ２２に突き当たっている。これは、寸法基準爪
１２の基板制止脚１２２を以てリードフレーム１０全体
の集積回路基板２０への設置の位置が決定されるととも
に、寸法基準爪１２にｔ１だけ後方にずらして配置され
た寸法調整爪１４の基板制止脚１４２を以て集積回路基
板２０に生じたバリ２２が吸収されることを意味してい
る。In the lead frame 10 that stops by hitting the side surface of the integrated circuit board 20, as shown in FIG. 2B, a part of the board restraining legs 122, 142 hits the edge of the integrated circuit board 20, and particularly Adjusting claw 14 substrate stop leg 14
2 hits the burr 22. This is because the position of installation of the entire lead frame 10 on the integrated circuit board 20 is determined by the substrate stopping leg 122 of the dimension reference claw 12 and the dimension adjustment is performed by shifting the dimension reference claw 12 backward by t 1. It means that the burrs 22 generated on the integrated circuit board 20 are absorbed by the board stopping legs 142 of the claws 14.
次に、第３図は、この考案のリードフレームの他の実施
例を示す。Next, FIG. 3 shows another embodiment of the lead frame of the present invention.
この実施例におけるリードフレーム１０も、第３図の
（Ａ）に示すように、先の実施例に示したものと同様な
部位を有しており、寸法基準爪１２および寸法調整爪１
４の双方には、それぞれ、基板制止脚１２２、１４２、
基板支持脚１２４、１４４、基板挿入ガイド１２６、１
４６が形成されている。そして、これらの各部位は、寸
法基準爪１２および寸法調整爪１４に対になって配置さ
れ、対になった脚部同士が互いに作用しあいながら、先
の実施例で示したような所定の機能を果たしている。The lead frame 10 in this embodiment also has the same parts as those shown in the previous embodiment, as shown in FIG.
4 on both sides of the board stop legs 122, 142,
Substrate support legs 124, 144, substrate insertion guides 126, 1
46 is formed. Then, these respective parts are arranged in pairs with the dimension reference claw 12 and the dimension adjusting claw 14, and the paired legs interact with each other to achieve a predetermined function as shown in the previous embodiment. Plays.
基板制止脚１２２、１４２は、第３図の（Ｂ）に示すよ
うに、外部リード１６の長手方向に対して直角を成し
て、ｔ２の差異を以て配置されている。また、寸法基準
爪１２と寸法調整爪１４との間隔ｗ２が、集積回路基板
２０の肉厚よりも幾分狭くなるように配置されているの
も、先の実施例と同様である。As shown in FIG. 3B, the substrate restraining legs 122 and 142 are arranged at right angles to the longitudinal direction of the external lead 16 with a difference of t 2 . Further, the distance w 2 between the dimension reference claw 12 and the dimension adjusting claw 14 is arranged to be slightly smaller than the thickness of the integrated circuit board 20, as in the previous embodiment.
次に、第４図は、第３図に示したリードフレームを集積
回路基板に実装した状態を示す。Next, FIG. 4 shows a state in which the lead frame shown in FIG. 3 is mounted on an integrated circuit board.
リードフレーム１０の集積回路基板２０への設置の度合
いについては、集積回路基板２０の側面に、リードフレ
ーム１０が最初に突き当たる位置に決定される。この実
施例の場合では、集積回路基板２０の側面はリードフレ
ーム１０の寸法基準爪１２の基板制止脚１２２の全面を
以て制止され、バリ２２は寸法調整爪１４の基板制止脚
１４２の一部で制止されることになる。The degree of installation of the lead frame 10 on the integrated circuit board 20 is determined at the position where the lead frame 10 first strikes the side surface of the integrated circuit board 20. In the case of this embodiment, the side surface of the integrated circuit board 20 is restrained by the entire surface of the substrate restraining leg 122 of the dimension reference claw 12 of the lead frame 10, and the burr 22 is restrained by a part of the substrate restraining leg 142 of the dimension adjusting claw 14. Will be done.
これら両実施例で示した集積回路基板２０には、その
後、その電極パッド２４部分にハンダが塗布され、集積
回路基板２０に形成された電子回路とリードフレーム１
０との電気的な接続が図られる。この場合、この電極パ
ッド２４にはハンダの塗布による機械的な強度が付与さ
れ、リードフレーム１０は集積回路基板２０の電極パッ
ド２４に安定して設置されることになる。そして、リー
ドフレーム１０の電気的な接続が完了した集積回路基板
２０には、その全体に樹脂モールドが施され、所望の集
積回路素子が形成されることになる。Thereafter, the integrated circuit board 20 shown in both of these embodiments is coated with solder on the electrode pad 24 portion thereof, and the electronic circuit and the lead frame 1 formed on the integrated circuit board 20.
Electrical connection with 0 is achieved. In this case, the electrode pad 24 is given mechanical strength by applying solder, and the lead frame 10 is stably installed on the electrode pad 24 of the integrated circuit board 20. Then, the integrated circuit board 20 on which the electrical connection of the lead frame 10 is completed is resin-molded on the entire surface thereof, and a desired integrated circuit element is formed.
以上説明したように、この考案のリードフレームによれ
ば、集積回路基板の電極パッドを挟み込む二つの爪を集
積回路基板の表裏面に互い違いに分岐させ、各爪に集積
回路基板の縁面に対応した基板制止脚を形成し、一方の
爪の基板制止脚と他方の爪の基板制止脚とを、外部リー
ドの長手方向に沿って互いにずらし、一方の基板制止脚
を集積回路基板の縁面に面接触させるようにしたので、
集積回路基板の加工時にその側面に生じるバリによって
ずれを生じることがなく、一方の基板制止脚を集積回路
基板の縁面に面接触させることができ、リードフレーム
を集積回路基板の基板面と一致させた状態で強固な固定
状態を実現することができる。As described above, according to the lead frame of the present invention, the two claws sandwiching the electrode pads of the integrated circuit board are alternately branched to the front and back surfaces of the integrated circuit board, and each claw corresponds to the edge surface of the integrated circuit board. The substrate stopping leg of one claw and the substrate stopping leg of the other claw are shifted from each other along the longitudinal direction of the external lead, and one substrate stopping leg is formed on the edge surface of the integrated circuit board. Since it was made to contact the surface,
There is no misalignment due to burrs on the side surface of the integrated circuit board when it is processed, and one board stop leg can be brought into surface contact with the edge surface of the integrated circuit board, and the lead frame matches the board surface of the integrated circuit board. A strong fixed state can be realized in this state.
第１図はこの考案のリードフレームの実施例を示す図、
第２図は第１図に示したリードフレームを集積回路基板
に設置した状態を示す図、第３図はこの考案リードフレ
ームの他の実施例を示す図、第４図は第３図に示したリ
ードフレームを集積回路基板に設置した状態を示す図、
第５図は従来のリードフレームを示す図、第６図は第５
図に示したリードフレームを集積回路基板に設置した状
態を示す図である。 １０……リードフレーム １２……寸法基準爪 １４……寸法調整爪 １２２、１４２……基板制止脚 １６……外部リードFIG. 1 is a diagram showing an embodiment of a lead frame of the present invention,
FIG. 2 is a view showing a state in which the lead frame shown in FIG. 1 is installed on an integrated circuit board, FIG. 3 is a view showing another embodiment of the lead frame of the invention, and FIG. 4 is shown in FIG. Showing a state in which the lead frame is installed on the integrated circuit board,
FIG. 5 shows a conventional lead frame, and FIG. 6 shows a conventional lead frame.
It is a figure which shows the state which installed the lead frame shown in the figure on the integrated circuit board. 10 ... Lead frame 12 ... Dimension reference claw 14 ... Dimension adjustment claw 122, 142 ... Board stop leg 16 ... External lead
Claims (1)
るリードフレームであって、前記集積回路基板の表裏両
面に設置された電極パッドを挟み込む二つの爪を前記集
積回路基板の表裏面側に互い違いに形成し、各爪に前記
集積回路基板の縁面に対応した基板制止脚を形成し、一
方の爪の基板制止脚と他方の爪の基板制止脚とを、前記
外部リードの長手方向に沿って互いにずらし、一方の基
板制止脚を前記集積回路基板の縁面に面接触させたこと
を特徴とするリードフレーム。1. A lead frame installed as an external lead of an integrated circuit board, wherein two claws sandwiching electrode pads installed on both front and back surfaces of the integrated circuit board are staggered on the front and back sides of the integrated circuit board. And a substrate restraining leg corresponding to the edge surface of the integrated circuit board is formed on each claw, and a substrate restraining leg of one claw and a substrate restraining leg of the other claw are formed along the longitudinal direction of the external lead. A lead frame, wherein one of the substrate stopping legs is in surface contact with the edge surface of the integrated circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165581U JPH064544Y2 (en) | 1988-12-21 | 1988-12-21 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165581U JPH064544Y2 (en) | 1988-12-21 | 1988-12-21 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286066U JPH0286066U (en) | 1990-07-06 |
| JPH064544Y2 true JPH064544Y2 (en) | 1994-02-02 |
Family
ID=31452198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165581U Expired - Lifetime JPH064544Y2 (en) | 1988-12-21 | 1988-12-21 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064544Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2828578B2 (en) * | 1993-07-29 | 1998-11-25 | 京セラ株式会社 | Semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153861U (en) * | 1976-05-19 | 1977-11-22 |
-
1988
- 1988-12-21 JP JP1988165581U patent/JPH064544Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0286066U (en) | 1990-07-06 |
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