JPH0718551Y2 - Board divider - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board dividing machine, and more particularly, it is used for dividing / cutting a dummy part of the board after mounting electronic parts on the board and soldering. Substrate divider.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional board dividing machine. (A) is a schematic perspective view, (b) is a schematic side view. In FIG. 2, reference numeral 33 denotes a dividing jig fixing member, a dividing jig 31 is attached to an end of the dividing jig fixing member 33, and one end of the substrate 30 is vertically moved by the dividing jigs 31 and 31. It is supposed to be held by. A large number of electronic components such as chips 34 are mounted on the upper surface of the substrate 30, and the other end of the substrate 30 is held by the hands 35, 35.

Substrate 3 using the above-mentioned conventional substrate divider
In the case of dividing 0, as shown in FIG.
The hands 35, 35 holding one end of 0 were moved in the direction of arrow A, and were divided by the V cut portions 30a, 30a.

[0004]

[Problems to be Solved by the Invention] As described above, the hand 35,
When 35 is moved in the direction of arrow A and the substrate 30 is bent,
The board 30 bends and a force is applied to the parts other than the V-cut parts 30a, 30a, and cracks in the soldering part and the chip
There were cracks in the chips. In order to reduce the generation of stress due to the bending as much as possible, it is conceivable to move the holding position by the hands 35, 35 to the vicinity of the V cut portions 30a, 30a. However, as the gripping position by the hands 35, 35 moves from the end portion of the substrate 30 toward the V-cut portions 30a, 30a, a larger dividing force is required. Considering the labor in the substrate dividing step, it is desirable that the substrate 30 can be divided quickly with a small amount of force. Therefore, the substrate 30 is divided by the substrate divider shown in FIG.
In the case of splitting, it is inevitable that the end portion of the substrate 30 is clamped and bent, and it is difficult to avoid the above-described cracks (solder cracks) in the soldered portion and chip cracks in the chip 34.

The present invention has been made in view of the above problems, and provides a substrate dividing machine which can substantially eliminate the deflection of the substrate which occurs when the substrate is divided and which requires almost no force for dividing the substrate. It is an object.

[0006]

To achieve the above object, a board dividing machine according to the present invention divides a board body and a dummy part in a board having a board body on which components are mounted and a dummy part. In a board dividing machine, a stopper for positioning the board by abutting the board, a board retainer for sandwiching the vicinity of the dummy portion of the board body in a state where the board abuts the stopper, and the dummy portion of the board retainer It is characterized in that it is provided with a cutter which is arranged in the vicinity of the side and which reciprocates in the vertical direction from one surface side of the substrate to the other surface side of the substrate.

[0007]

The substrate dividing machine according to the present invention comprises a stopper for positioning the substrate when the substrate is in contact with the substrate, and a substrate retainer for sandwiching the dummy portion of the substrate body while the substrate is in contact with the stopper. Since the cutter is disposed near the dummy part side of the substrate retainer and reciprocates in the vertical direction with respect to the substrate from one surface side of the substrate to the other surface side, the substrate is stopped by the stopper. After the positioning, the dummy part of the substrate held by the substrate retainer is knocked off by the cutter that reciprocates in the vertical direction. That is, a stress for division is generated from a portion of the substrate held by the substrate pressing to the dummy portion, but the stress is not transmitted to the substrate body on which the chip parts and the like are mounted by the substrate pressing. Therefore, the deflection of the substrate generated when the substrate is divided is suppressed to the minimum, and the quality of the substrate is ensured.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a substrate dividing machine according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic side view showing an embodiment. Reference numeral 24 denotes a substrate receiver, and a substrate retainer 21b is attached to an end portion of the substrate receiver 24. Substrate retainer 2
Substrate retainer 21 at a position facing 1b at an appropriate interval.
a is disposed, and the upper end of the substrate retainer 21a is attached to the front end portion of the substrate retainer fixing member 25. By the substrate retainers 21a and 21b, the substrate 10 is V-cut portion 1
It is held near 0a, and the front end of the substrate 10 is held by the hand 20. The tip of the dummy portion 10b formed on the substrate 10 is configured to contact the stopper 23, and the upper end of the stopper 23 is attached to the cutter 22. Also, the cutter 22
A piston 28 is attached to the rear end of the piston 28, and the piston 28 is connected to an air cylinder 29. On the other hand, the piston 26 is also attached to the rear end of the substrate pressing and fixing member 25.
Is attached, and the piston 26 is the air cylinder 2
Connected to 7.

When the substrate 20 is divided by using the substrate dividing machine configured as described above, it is carried out as follows. First, the piston 26 is raised to raise the substrate retainer 21a and the substrate retainer 2
The distance from 1b is widened, and the substrate 10 is inserted from this distance.
In addition, the V-cut portion 10a of the substrate 10 is the substrate retainer 21a,
The position of the stopper 23 is adjusted in advance so that it is located near 21b. Then, the dummy portion 10b is the stopper 2
When the substrate 10 is brought into contact with the substrate 3 and the positioning of the substrate 10 is completed, the piston 26 is lowered by the operation of an operation unit (not shown), and the substrate 10 is fixed / held by the substrate retainers 21a and 21b. After that, the piston 28 is lowered and the cutter 22 divides and cuts the dummy portion 10b from the substrate 10.

As described above, in the substrate dividing machine according to the embodiment, the substrate 10 is held / fixed by the substrate retainers 21a and 21b, and the dummy portion 10b is divided / cut off by the cutter 22. It is possible to suppress the bending that occurs in the substrate 10 when the substrate is divided into a minimum. As a result, it is possible to prevent solder cracks, chip breakages, etc., which have occurred in the conventional division technique, to ensure the quality of the substrate 10, and the operator hardly needs any force.

As shown by the broken line, an optical sensor 40 for detecting whether or not the substrate 10 is in contact with the stopper 23 is provided, and when the substrate 10 is in contact with the stopper 23, the cylinder 27, The dummy portion 10b may be cut off after the board 29 is clamped by the operation of 29 as described above. By doing so, the operation of the operation switch or the like becomes unnecessary, and the workability can be further improved.

[0012]

As is apparent from the above description, in the substrate dividing machine according to the present invention, the stopper for positioning the substrate by the contact of the substrate and the substrate in contact with the stopper A substrate retainer which holds the vicinity of the dummy portion of the substrate body, and a substrate retainer which is disposed in the vicinity of the dummy portion side of the substrate retainer and reciprocates in a vertical direction with respect to the substrate from one surface side of the substrate to the other surface side. Since the cutter is provided, it is possible to suppress the bending generated in the substrate to a minimum when dividing the substrate. That is, in the board dividing machine according to the present invention, since the generation of stress due to the deflection is prevented, it is possible to prevent solder cracks, chip breakage, etc. due to the stress, which cannot be avoided by the conventional board dividing technique. The quality of the substrate can be ensured. Moreover, the operator requires little force to divide the substrate.

[Brief description of drawings]

FIG. 1 is a schematic side view showing an embodiment of a substrate dividing machine according to the present invention.

FIG. 2 shows a conventional board dividing machine, (a)
Is a schematic perspective view, and (b) is a schematic side view.

[Simple explanation of the sign]

 10 substrate 10b dummy parts 21a and 21b substrate retainer 22 cutter 23 stopper

Claims (1)

[Scope of utility model registration request] 1. A substrate dividing machine for dividing a substrate main body and a dummy portion in a substrate having a substrate main body on which components are mounted and a dummy portion, and a stopper for positioning the substrate by abutting the substrate, A substrate retainer that holds the dummy body of the substrate body in the vicinity of the dummy portion with the substrate in contact with the stopper;
A substrate dividing machine comprising a cutter that reciprocates in a vertical direction from one surface side of the substrate to the other surface side of the substrate.