KR970006142Y1 - Bonding holder of circuit board - Google Patents
Bonding holder of circuit board Download PDFInfo
- Publication number
- KR970006142Y1 KR970006142Y1 KR2019940012166U KR19940012166U KR970006142Y1 KR 970006142 Y1 KR970006142 Y1 KR 970006142Y1 KR 2019940012166 U KR2019940012166 U KR 2019940012166U KR 19940012166 U KR19940012166 U KR 19940012166U KR 970006142 Y1 KR970006142 Y1 KR 970006142Y1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- holder
- bonding
- fixed
- bonding holder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
요약없음No summary
Description
제1도는 회로기판 본딩홀더의 정면도.1 is a front view of a circuit board bonding holder.
제2도는 회로기판 본딩홀더의 평면도.2 is a plan view of a circuit board bonding holder.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 : 회로기판 본딩홀더12 : 회로기판10: circuit board bonding holder 12: circuit board
14 : 나사16 : 고정대14: screw 16: holder
17 : 홈18 : 고정축17: groove 18: fixed shaft
20 : 클램핑지그22 : 스프링20: clamping jig 22: spring
24 : 자석부26 : 나사24: magnet portion 26: screw
본 고안은 HIC의 회로기판 본딩홀더에 관한 것으로, 특히 3인치의 회로기판을 절단하지 않고 그대로 사용하여 알루미늄선을 본딩함으로써 생산성을 높일 수 있는 회로기판본딩 홀더에 관한 것이다.The present invention relates to a circuit board bonding holder of the HIC, and more particularly to a circuit board bonding holder that can increase the productivity by bonding the aluminum wire without cutting the circuit board of 3 inches.
일반적으로 인쇄를 한 기판은 소성공정을 거치며, 이후 트리밍(trimming)공정을 거쳐서 제품을 측정하며, 마운팅(mounting)공정을 거친후 알루미늄선을 본딩(bonding)하는 본딩공정을 거친다.In general, a printed substrate is subjected to a sintering process, and then a trimming process is used to measure a product, and after a mounting process, a bonding process of bonding aluminum wires.
상기의 본딩공정 에서는 3인치 크기의 인쇄회로기판을 12개의 조각으로 절단하여 각조각들을 개별로 홀더상면에 위치시켜서 알루미늄선을 본딩한다.In the bonding process, a 3 inch sized printed circuit board is cut into 12 pieces, and each piece is individually placed on the upper surface of the holder to bond the aluminum wire.
그러나 상기와 같이 3인치의 인쇄회로기판을 절단하여 본딩을 실시하면 작업시간이 많이 소요되며 이로인해 생산률이 저하되는 문제점이 발생한다.However, when the bonding is performed by cutting a 3 inch printed circuit board as described above, a lot of work time is required, which causes a problem in that the production rate is lowered.
따라서 본 고안은 상기의 문제점을 해결하기 위해 안출한 것이다.Therefore, the present invention is devised to solve the above problems.
본 고안은 3인치의 인쇄회로기판을 그대로 수용하여 알루미늄 선을 본딩함으로서 작업공정의 소요 시간을 단축시키며, 생산성을 향상시키는 구조를 갖는 회로기판 본딩 홀더를 제공함이 그 목적이다.The object of the present invention is to provide a circuit board bonding holder having a structure to reduce the time required for the work process by improving the productivity by bonding the aluminum wire by accommodating a 3 inch printed circuit board as it is.
상기의 목적을 달성하기 위한 본 고안은 상면에 회로기판을 고정하는 고정대와, 측변부에 위치하며 상기 회로기판을 고정축과 스프링에 의해 고정하는 클램핑 지그와, 하측부에 형성한 자석부로 구성함을 특징으로 한다.The present invention for achieving the above object comprises a clamp for fixing a circuit board on the upper surface, a clamping jig for fixing the circuit board by a fixed shaft and a spring located on the side portion, and a magnet portion formed on the lower side It is characterized by.
이하 첨부된 도면을 통하여 본 고안의 기술적 구성과 이에 따른 작용 및 효과를 설명하면 다음과 같다.Hereinafter, the technical configuration of the present invention and its effects and effects through the accompanying drawings are as follows.
제1도는 본 고안에 의한 회로기판 본당홀더의 정면도이다.1 is a front view of a circuit board main hall holder according to the present invention.
동 도면에서, 회로기판 본딩홀더(10)는 상면에 위치하는 고정대(16)와 클램핑지그(20)로 회로기판(12)을 고정한다.In the same figure, the circuit board bonding holder 10 fixes the circuit board 12 with the clamp 16 and the clamping jig 20 positioned on the upper surface.
하측부에는 자석부(24)를 형성하여 상기 회로기판본딩홀더(10)의 고정을 용이하게 하며, 움직임을 방지한다.A magnet 24 is formed on the lower side to facilitate the fixing of the circuit board bonding holder 10 and to prevent movement.
상기의 클램핑지그(20)는 상측에 고정축(18)을 구성하여 축을 중심으로 움직임을 가지며, 하측엔 회로기판 본딩홀더(10)외의 스프링(22) 연결이 이루어진다.The clamping jig 20 has a fixed shaft 18 on the upper side to move around the axis, and the lower side of the clamping jig 20 is connected to the spring 22 other than the circuit board bonding holder 10.
하측부에 형성한 자석부(24)는 나사(26)로 고정된다.The magnet part 24 formed in the lower part is fixed by the screw 26. As shown in FIG.
제2도는 회로기판 본딩홀더(10)의 평면도이다.2 is a plan view of the circuit board bonding holder 10.
동 도면에서, 고정대(16)는 중앙부에 홈(17)을 형성하며, 나사(14)에 의해 고정된다.In the figure, the holder 16 forms a groove 17 in the center and is fixed by a screw 14.
상기의 나사(14)에 의한 고정에서는 고정대(16)의 홈(17)에 의해 고정대(16)를 좌우로 움직일 수 있으며, 상기의 작용에 의해 회로기판(12)을 꼭 맞게 고정한다.In the fixing by the screw 14, the holder 16 can be moved to the left and right by the groove 17 of the holder 16, and the circuit board 12 is firmly fixed by the above action.
회로기판본딩홀더(10)의 상면에 위치한 3인치의 회로기판(12)은 클램핑지그(20)와 고정대(16)에 의해 고정이 이루어지며, 이후 알루미늄선을 본딩하여 본딩공정을 진행한다.The circuit board 12 of 3 inches positioned on the upper surface of the circuit board bonding holder 10 is fixed by the clamping jig 20 and the holder 16, and then bonding the aluminum wire to the bonding process.
상기와 같이 본 고안은 3인치의 회로기판을 클램핑지그와 고정대에 의해 고정하여 알루미늄선의 본딩을 실시함으로서, 종래와는 달리 작업소요시간이 단축되며, 또한 생산성의 향상이 기대되는 아주 유용한 고안이다.As described above, the present invention is a 3 inch circuit board is fixed by the clamping jig and the fixing stand to perform the bonding of the aluminum wire, unlike the prior art is a very useful design is expected to shorten the work time, and also to improve the productivity.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940012166U KR970006142Y1 (en) | 1994-05-30 | 1994-05-30 | Bonding holder of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940012166U KR970006142Y1 (en) | 1994-05-30 | 1994-05-30 | Bonding holder of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950034672U KR950034672U (en) | 1995-12-18 |
| KR970006142Y1 true KR970006142Y1 (en) | 1997-06-19 |
Family
ID=19384364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940012166U KR970006142Y1 (en) | 1994-05-30 | 1994-05-30 | Bonding holder of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970006142Y1 (en) |
-
1994
- 1994-05-30 KR KR2019940012166U patent/KR970006142Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950034672U (en) | 1995-12-18 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| LAPS | Lapse due to unpaid annual fee |