CN211102439U

CN211102439U - Workbench clamp of lead bonding equipment

Info

Publication number: CN211102439U
Application number: CN201922267267.8U
Authority: CN
Inventors: 周威; 种利
Original assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Current assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-07-28
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses a lead bonding equipment workbench clamp, which comprises a clamp base, a device bearing plate and a plurality of positioning blocks; the workbench clamp of the wire bonding equipment can be arranged on the workbench of the wire bonding equipment and used for fixing a bonding device in the bonding process, so that the bonding efficiency and the bonding quality of the equipment are improved. The device bearing plate can be embedded in the tool slot position by fixing the to-be-bonded component on the device bearing plate through the positioning block, and the positioning block can be used for positioning and fixing different components as required, so that the universality of the equipment is improved. The equipment can be quickly disassembled after being bonded, so that the operation efficiency of the equipment is obviously improved.

Description

Workbench clamp of lead bonding equipment

Technical Field

The utility model relates to a lead bonding technical field, concretely relates to lead bonding equipment workstation anchor clamps.

Background

The semiconductor industry, particularly integrated circuits, often uses bonders. Bonding is performed by soldering a lead (aluminum wire, copper wire, gold wire, silver wire, or the like) between a semiconductor chip (first pad) and a precision press area (second pad) of a lead frame. Is a key technology for rapidly developing electronic components. Wire bonding is a process of connecting a metal wire and a substrate pad by fusing a thin metal wire using heat, pressure, ultrasonic waves, or the like as energy.

In the prior art, when bonding a wire to a substrate, the substrate is usually first mounted in a fixture, the fixture usually includes a base and a cover plate pressed on the base, at least one bonding region is reserved on the cover plate, and the cover plate is connected to the base in a vacuum adsorption manner. And after the substrate is clamped between the base and the cover plate and fixed, the lead is bonded on the substrate through other auxiliary equipment. The above prior art solutions have the following drawbacks: when bonding the lead on the substrate, the clamp easily drives the substrate to shake due to the light weight of the clamp, so that partial deviation can occur in the bonding process.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a lead bonding equipment workbench clamp which can improve the stability of the lead bonding equipment; the specific scheme is as follows:

a lead bonding equipment workbench clamp comprises a clamp base, a device bearing plate and a plurality of positioning blocks; the fixture base is fixedly bonded on the workbench, a fixture groove is formed in the fixture base, and positioning grooves are formed in two adjacent side walls of the fixture groove; a clamping plate capable of sliding towards one positioning groove is arranged on one side, opposite to one positioning groove, in the tool groove position, and the clamping plate is movably connected with an adjusting screw rod which penetrates through the outer side surface of the clamp base and is in threaded connection with the clamp base; the device bearing plate is embedded in the tool groove, a positioning boss in sliding fit with the positioning groove is arranged on the side surface of the device bearing plate opposite to the positioning groove, and positioning holes in matrix arrangement are arranged on the upper surface of the device bearing plate; and the positioning block is provided with a positioning column which can be clamped into the positioning hole.

In the technical scheme: the workbench clamp of the wire bonding equipment can be arranged on the workbench of the wire bonding equipment and used for fixing a bonding device in the bonding process, so that the bonding efficiency and the bonding quality of the equipment are improved. The fixture base is fixed on a workbench of the bonding equipment, the device bearing plate can be embedded in the tool slot position by fixing the to-be-bonded component on the device bearing plate through the positioning block, and the positioning block can be used for positioning and fixing different components as required, so that the universality of the equipment is improved. The positioning boss on the device bearing plate is clamped into a corresponding positioning groove, so that the device bearing plate is prevented from offsetting, the positioned device bearing plate is clamped through the clamping plate, and the device bearing plate is clamped in the tool groove by the clamping plate in a manner of rotating the adjusting screw rod during clamping adjustment. The equipment can be quickly disassembled after being bonded, so that the operation efficiency of the equipment is obviously improved.

Preferably, the bottom surface of the tool slot is provided with a vibration absorption structure layer, the vibration absorption structure layer comprises a vibration absorption pad, and the end surface of the vibration absorption pad is provided with a plurality of fixing clamping protrusions clamped into the bottom wall of the tool slot. The bonding equipment can be absorbed by the shock absorption cushion blocks when running at high speed, so that the whole equipment has higher shock resistance, the equipment can be ensured to run stably at high speed, and the bonding production efficiency is improved.

Preferably, the clamp base is provided with guide columns arranged along the extension direction of the adjusting screw corresponding to two sides of the adjusting screw, and the guide columns are sleeved with linear bearings fixed in the clamping plate. The guide post can guide the chucking board along adjusting screw rod extending direction steady removal.

Preferably, a holding handle is arranged on the outer side surface of the device bearing plate between the corresponding positioning groove and the adjusting screw rod. The arrangement of the holding handle facilitates the removal of the entire device carrier plate from the fixture base after the bonding operation is completed.

Preferably, the upper end surface of the clamp base is provided with an installation notch for accommodating the holding handle at one side corresponding to the extension direction of the holding handle. The mounting notch can accommodate a grip handle that can move within the mounting notch when the device carrier plate is moved.

Preferably, one end of the adjusting screw penetrating through the clamp base is provided with a rotating handle. The rotating handle is convenient for an operator to rotate the adjusting screw rod.

Preferably, the surface of the clamping plate opposite to the device bearing plate is provided with a supporting cushion layer, and the outer surface of the supporting cushion layer is provided with a clamping groove adaptive to the thickness of the device bearing plate. The support cushion layer can improve the stability of chucking board fastener spare loading board.

Preferably, the locating piece includes right angle type locating piece and linear type locating piece, the terminal surface is equipped with the reference column with locating hole block adaptation under right angle type locating piece and the linear type locating piece. The right-angle positioning block and the linear positioning block can be used for positioning a bonding device, so that the design period of different fixtures and manufacture periods for different devices is saved, and the production of various different devices can be met.

Preferably, the device bearing plate further comprises a fixing frame fixed on the upper surface of the device bearing plate, and a plurality of fixing screw holes are formed in the edge of the fixing frame. The fixing frame can be fixed on the clamp base, and can fix the positioning block, so that the fixing firmness of the bonding device is improved.

The utility model has the advantages that: the utility model provides a lead bonding equipment workstation anchor clamps can install on the workstation of lead bonding equipment, and the anchor clamps base is fixed on the workstation of bonding equipment, treats that the bonding part passes through the locating piece to be fixed and to inlay the dress in the frock trench with the device loading board on the device loading board, improve equipment's commonality. When the clamping is adjusted, the clamping plate clamps the device bearing plate in the tool slot position in a mode of rotating the adjusting screw rod. The device can be quickly detached after bonding is completed, so that the operating efficiency of the device is obviously improved, and in addition, the device can absorb the vibration generated in the bonding process of the device in the bonding operation; so that the entire apparatus has higher vibration resistance. Effectively solves the technical problems existing in the prior art and has higher practical value.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a structural diagram of a table clamp of a wire bonding apparatus according to an embodiment.

The individual reference symbols have the following meanings: the fixture comprises a fixture base 100, a fixture slot position 110, a positioning slot 120, an installation notch 130, a device bearing plate 200, a positioning hole 210, a positioning boss 220, a holding handle 230, a clamping plate 300, an adjusting screw 400, a guide column 500, a rotating handle 600, a positioning block 700 and a fixing frame 800.

Detailed Description

Here, it is to be noted that the functions, methods, and the like related to the present invention are only conventional adaptive applications of the related art. Therefore, the present invention is an improvement of the prior art, which substantially lies in the connection relationship between hardware, not in the functions and methods themselves, that is, the present invention relates to a few functions and methods, but does not include the improvements proposed in the functions and methods themselves. The present invention is described for better illustration of the function and method for better understanding of the present invention.

As shown in fig. 1, in an embodiment, the present invention provides a worktable clamp for a wire bonding apparatus, which includes a clamp base 100, a device carrier 200, and a plurality of positioning blocks 700; the workbench clamp of the wire bonding equipment can be arranged on the workbench of the wire bonding equipment and used for fixing a bonding device in the bonding process, so that the bonding efficiency and the bonding quality of the equipment are improved. The fixture base 100 is fixed on the bonding workbench through fixing parts such as screws, a tooling slot position 110 is arranged on the fixture base 100, and positioning slots 120 are arranged on two adjacent side walls of the tooling slot position 110; a clamping plate 300 capable of sliding towards one positioning groove 120 is arranged on one side, opposite to one positioning groove 120, in the tooling groove position 110, and the clamping plate 300 is movably connected with an adjusting screw rod 400 which penetrates through the outer side surface of the clamp base 100 and is in threaded connection with the clamp base 100; the device bearing plate 200 is embedded in the tooling slot position 110, a positioning boss 220 in sliding fit with the positioning slot 120 is arranged on the side surface of the device bearing plate 200 opposite to the positioning slot 120, and positioning holes 210 in matrix arrangement are arranged on the upper surface of the device bearing plate 200; the positioning block 700 is provided with a positioning column which can be clamped into the positioning hole 210. Before the bonding operation, the component to be bonded is fixed on the component bearing plate 200 through the positioning block 700, so that the component bearing plate 200 can be embedded in the tooling slot position 110, and the positioning block 700 can position and fix different components as required, so that the universality of the equipment is improved. The positioning bosses 220 on the device bearing plate 200 are clamped into a corresponding positioning groove 120 to prevent the device bearing plate 200 from deviating, the positioned device bearing plate 200 is clamped by the clamping plate 300, and the clamping plate 300 clamps the device bearing plate 200 in the tooling slot position 110 by rotating the adjusting screw 400 during clamping adjustment. The equipment can be quickly disassembled after being bonded, so that the operation efficiency of the equipment is obviously improved.

Because equipment can inevitably produce the vibration at high-speed bonding in-process, in order to reduce the vibration, this embodiment is equipped with the structural layer that shakes at frock trench 110 bottom surface, the structural layer that shakes includes the shock pad that shakes, the shock pad terminal surface that shakes is equipped with the fixed card that a plurality of cards go into the frock trench 110 diapire protruding. The bonding equipment can be absorbed by the shock absorption cushion blocks when running at high speed, so that the whole equipment has higher shock resistance, the equipment can be ensured to run stably at high speed, and the bonding production efficiency is improved.

In this embodiment, the device carrier plate 200 is clamped and fixed in the tooling slot 110 by the clamping plate 300, in order to improve the moving stability of the clamping plate 300, the fixture base 100 is provided with guide posts 500 arranged along the extending direction of the adjusting screw 400 corresponding to two sides of the adjusting screw 400, and the guide posts 500 are sleeved with linear bearings fixed in the clamping plate 300. The guide column 500 can guide the chucking plate 300 to stably move in the extending direction of the adjustment screw 400 while reducing the frictional force of the chucking plate 300 when moving by providing a linear bearing.

After the bonding operation is completed, in order to facilitate the removal of the components, a grip handle 230 is disposed on the outer side surface of the device carrier 200 corresponding to the location groove 120 and the adjustment screw 400. The provision of the grip handle 230 facilitates the removal of the entire device carrier plate 200 from the fixture base 100 after the bonding operation is completed.

In order to reduce the interference of the grip 230 on the clamp base 100, the present embodiment is provided with an installation notch for accommodating the grip 230 on the upper end surface of the clamp base 100 corresponding to the extending direction of the grip 230. The mounting notches can accommodate a grip handle 230, and the grip handle 230 can move within the mounting notches when the device carrier plate 200 is moved.

Since the movement of the chucking plate 300 requires the rotation of the adjustment screw 400, in order to rotate the adjustment screw 400, a rotation knob 600 is provided at one end of the adjustment screw 400 penetrating the jig base 100. Rotating the handle 600 facilitates the operator turning the adjustment screw 400. The twist grip 600 may be provided with anti-slip features to prevent slippage during rotation.

Further, in order to improve the stability of the chucking plate 300 for fixing the device loading plate 200, a supporting cushion layer is disposed on the surface of the chucking plate 300 opposite to the device loading plate 200, and a fastening groove adapted to the thickness of the device loading plate 200 is disposed on the outer surface of the supporting cushion layer. The support cushion layer can improve the stability of the chucking plate 300 chucking the device carrier plate 200.

Because the component to be bonded needs the positioning block 700 to be positioned and fixed, the positioning block 700 in this embodiment includes a right-angle positioning block and a linear positioning block, and the lower end surfaces of the right-angle positioning block and the linear positioning block are provided with positioning columns which are in clamping fit with the positioning holes 210. The right-angle positioning block and the linear positioning block can be used for positioning a bonding device, so that the design period of different fixtures and manufacture periods for different devices is saved, and the production of various different devices can be met. Further, in order to further improve the positioning stability, the embodiment further provides a fixing frame 800 fixed on the upper surface of the device carrier plate 200, and the edge of the fixing frame 800 is provided with a plurality of fixing screw holes. The fixing frame 800 may be fixed to the jig base 100, and may fix the positioning block 700, thereby improving fixing firmness of the bonding device.

In the specification of the present invention, a large number of specific details are explained. It can be understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, systems, and techniques have not been shown in detail in order not to obscure an understanding of this description.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments can be modified, or some or all of the technical features can be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. The utility model provides a wire bonding equipment workstation anchor clamps which characterized in that: comprises that

The fixture comprises a fixture base (100), wherein the fixture base (100) is fixedly bonded on a workbench, a tooling slot position (110) is arranged on the fixture base (100), and positioning slots (120) are arranged on two adjacent side walls of the tooling slot position (110); a clamping plate (300) capable of sliding towards one positioning groove (120) is arranged on one side, opposite to one positioning groove (120), in the tooling groove position (110), and the clamping plate (300) is movably connected with an adjusting screw rod (400) which penetrates through the outer side surface of the clamp base (100) and is in threaded connection with the clamp base (100);

the device bearing plate (200) is embedded in the tooling groove position (110), a positioning boss (220) in sliding fit with the positioning groove (120) is arranged on the side surface, opposite to the positioning groove (120), of the device bearing plate (200), and positioning holes (210) in matrix arrangement are formed in the upper surface of the device bearing plate (200);

the positioning blocks (700) are provided with positioning columns which can be clamped into the positioning holes (210).

2. The wire bonding apparatus table clamp of claim 1, wherein: the bottom surface of the tool groove (110) is provided with a vibration absorption structure layer, the vibration absorption structure layer comprises a vibration absorption pad, and the end surface of the vibration absorption pad is provided with a plurality of fixing clamping protrusions clamped into the bottom wall of the tool groove (110).

3. The wire bonding apparatus table clamp of claim 1, wherein: the clamp base (100) is provided with guide columns (500) arranged along the extending direction of the adjusting screw rod (400) corresponding to the two sides of the adjusting screw rod (400), and linear bearings fixed in the clamping plate (300) are sleeved on the guide columns (500).

4. The wire bonding apparatus table clamp of claim 1, wherein: and a holding handle (230) is arranged on the outer side surface of the device bearing plate (200) corresponding to the position between the positioning groove (120) and the adjusting screw rod (400).

5. The wire bonding apparatus table clamp of claim 4, wherein: the upper end surface of the clamp base (100) is provided with an installation notch (130) for accommodating the holding handle (230) at one side corresponding to the extension direction of the holding handle (230).

6. The wire bonding apparatus table clamp of claim 1, wherein: one end of the adjusting screw rod (400) penetrating through the clamp base (100) is provided with a rotating handle (600).

7. The wire bonding apparatus table clamp of claim 1, wherein: the surface that chucking plate (300) and device loading board (200) are relative is equipped with the support bed course, the support bed course surface is equipped with the block groove that suits with device loading board (200) thickness.

8. The wire bonding apparatus table clamp of claim 1, wherein: locating piece (700) are including right angle type locating piece and linear type locating piece, the terminal surface is equipped with the reference column with locating hole (210) block adaptation under right angle type locating piece and the linear type locating piece.

9. The wire bonding apparatus table clamp of any one of claims 1-8, wherein: the device bearing plate fixing frame is characterized by further comprising a fixing frame (800) fixed on the upper surface of the device bearing plate (200), and a plurality of fixing screw holes are formed in the edge of the fixing frame (800).