JPH05860B2 - - Google Patents

Info

Publication number
JPH05860B2
JPH05860B2 JP63194616A JP19461688A JPH05860B2 JP H05860 B2 JPH05860 B2 JP H05860B2 JP 63194616 A JP63194616 A JP 63194616A JP 19461688 A JP19461688 A JP 19461688A JP H05860 B2 JPH05860 B2 JP H05860B2
Authority
JP
Japan
Prior art keywords
wire
bonding
wedge
length
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63194616A
Other languages
Japanese (ja)
Other versions
JPH0244743A (en
Inventor
Masahiro Aoki
Yutaka Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP63194616A priority Critical patent/JPH0244743A/en
Publication of JPH0244743A publication Critical patent/JPH0244743A/en
Publication of JPH05860B2 publication Critical patent/JPH05860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ワイヤを挿通するガイド孔を先端面
に対して傾斜して備え、ワイヤが先端面下方に傾
斜して繰り出されるボンデイングウエツジ（以下
ウエツジと略）を用いて超音波によりワイヤボン
デイングを行うワイヤボンデイング方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding wedge (industrial application field) which is provided with a guide hole through which a wire is inserted and is inclined with respect to the distal end surface, and in which the wire is paid out at an angle downward from the distal end surface. The present invention relates to a wire bonding method in which wire bonding is performed using ultrasonic waves using a wedge (hereinafter abbreviated as wedge).

〔従来の技術〕[Conventional technology]

従来多用されているウエツジ１１は第４図ａに
示すようにガイド孔３１は先端面４１に対して約
30〜45°の傾きに形成されていて、ボンデイング
を行うときはウエツジ１１をボンデイング部の直
上部に位置せしめ、矢印１２のように真下に下降
せしめて超音波振動を印加していた。 As shown in FIG. 4a, the wedge 11 that has been widely used in the past has a guide hole 31 that is located approximately at a distance from the tip surface 41.
The wedge 11 is formed at an angle of 30 to 45 degrees, and when performing bonding, the wedge 11 is positioned directly above the bonding portion and moved downward as shown by the arrow 12 to apply ultrasonic vibrations.

従つて、ワイヤ２の繰り出し角が約30〜45°と
なるので基板６にある電子部品などにワイヤ２が
当たる場合があり不都合であつた。 Therefore, since the wire 2 is fed out at an angle of approximately 30 to 45 degrees, the wire 2 may hit electronic components on the board 6, which is inconvenient.

この不都合は、第４図ｂに示すように先端面４
に対して例えば約60°の傾きでガイド孔３を有す
るウエツジ１を用いれば少なくすることができ
る。 This inconvenience is caused by the distal end surface 4 as shown in FIG. 4b.
For example, by using a wedge 1 having a guide hole 3 at an angle of about 60°, the number of holes can be reduced.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが、このように大きな傾きでガイド孔３
を備えているウエツジ１を用いてワイヤボンデイ
ングを行おうとすれば、ワイヤ２がボンデイング
に所要の長さｌ（第１ボンデイングしろ）だけウ
エツジ１の先端面４から斜めに繰り出されている
状態からボンデイングを行う第１ボンデイング部
７のボンデイングにおいては、ワイヤ２の先端の
第１ボンデイングしろの第１ボンデイング部７に
対する傾きもガイド孔３と同じ角の大きな傾きと
なる。 However, with such a large inclination, the guide hole 3
If wire bonding is to be performed using wedge 1 equipped with In the bonding of the first bonding portion 7, the inclination of the first bonding margin of the tip of the wire 2 with respect to the first bonding portion 7 also becomes a large inclination of the same angle as the guide hole 3.

従つて、ウエツジ１を矢印１２のように真下に
下降せしめてもワイヤ２はその先端から長さｌだ
け手前の部分で折れ曲りにくく、ウエツジ１の下
降に伴つてワイヤ２が撓みながら相対的にガイド
孔３の中に逃げて戻つてしまい、ボンデイングに
所要の長さｌのワイヤ２をウエツジ１の先端面４
と第１ボンデイング部７との間に挟圧することが
できない状態となつてしまう。これを避けようと
すれば第１ボンデイング部７から大きく外側には
み出す長さだけワイヤ２を繰り出せばよいが、そ
うするとはみ出させたワイヤ先端がシヨートする
こともあり、またワイヤ２も無駄になる欠点があ
る。 Therefore, even if the wedge 1 is lowered straight down as shown by the arrow 12, the wire 2 is difficult to bend at the portion in front of the tip by a length l, and as the wedge 1 is lowered, the wire 2 bends and bends relatively. The wire 2 having the length l required for bonding is inserted into the tip surface 4 of the wedge 1.
This results in a state in which it is impossible to apply pressure between the first bonding portion 7 and the first bonding portion 7. If you want to avoid this, you can let out the wire 2 by a length that protrudes outward from the first bonding part 7, but if you do so, the tip of the protruding wire may be shot, and the wire 2 is also wasted. be.

本発明者は上述の従来の問題点を解決するため
に特願昭62−199039号でワイヤ先端を予め第１ボ
ンデイングに要する長さだけウエツジ１の先端面
に沿わしめ、第１ボンデイングしろを予め折曲形
成しておく方法を提案しているが、本発明はそれ
をさらに改善しようとするものである。 In order to solve the above-mentioned conventional problems, the present inventor proposed in Japanese Patent Application No. 62-199039 that the tip of the wire was placed along the tip surface of the wedge 1 by the length required for the first bonding in advance, and the margin for the first bonding was made in advance. Although a method of forming a bend is proposed, the present invention aims to further improve this method.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、ウエツジを用いて基板上でワイヤボ
ンデイングを行うワイヤボンデイング方法におい
て、第２ボンデイング部の超音波印加の終了後ウ
エツジを次の第１ボンデイングに要するワイヤの
長さｌと同じ距離だけ前方上方に斜めに又は真上
に上昇させてウエツジをワイヤに対して後退せし
めて第２ボンデイング部から連続しているワイヤ
のその立ち上がり基部からウエツジまでのワイヤ
の長さをｌとし、次いでウエツジのワイヤに対す
る後退を阻止した状態でウエツジを相対的に真下
に又は前方下方に斜めに下降せしめてワイヤを前
記第２ボンデイング部からの立ち上がり基部で切
断しかつ先端部の長さｌのワイヤを前記基板又は
基板に固着した部材に圧接してウエツジ先端面に
沿わしめ、その後、ウエツジを次の第１ボンデイ
ング部に移動せしめることを特徴とするワイヤボ
ンデイング方法である。 The present invention is a wire bonding method in which wire bonding is performed on a substrate using a wedge. The length of the wire from the rising base of the wire that is continuous from the second bonding part to the wedge is set as l by raising the wedge diagonally or directly upward and retracting the wedge relative to the wire, and then removing the wire from the wedge. The wire is cut at the base rising from the second bonding part by lowering the wedge relatively directly or forwardly and obliquely while preventing the wire from moving backward, and the wire having a length l of the tip is attached to the substrate or the wire. This wire bonding method is characterized in that the wedge is pressed into contact with a member fixed to a substrate so as to fit along the front end surface of the wedge, and then the wedge is moved to the next first bonding section.

なお、本明細書においては、第１ボンデイング
部から第２ボンデイング部へウエツジをボンデイ
ング移動せしめるときに進行方向に臨む側面をウ
エツジの前面とし、従つてウエツジの前方とはこ
の前面の臨んだ方向をいい、反対方向を後方とい
う。 In this specification, the front side of the wedge is the side facing in the direction of movement when the wedge is bonded and moved from the first bonding part to the second bonding part, and therefore, the front of the wedge refers to the direction in which this front face faces. Okay, the opposite direction is called backward.

〔作用〕[Effect]

本発明は、第２ボンデイング部の超音波印加の
終了後ウエツジを次の第１ボンデイングに要する
ワイヤの長さｌと同じ距離だけ前方上方に斜めに
又は真上に上昇させてウエツジをワイヤに対して
後退せしめて第２ボンデイング部から連続してい
るワイヤのその立ち上がり基部からウエツジまで
のワイヤの長さをｌとし、次いでウエツジのワイ
ヤに対する後退を阻止した状態でウエツジを相対
的に真下に又は前方下方に斜めに下降せしめてワ
イヤを前記第２ボンデイング部からの立ち上がり
基部で切断しかつ先端部の長さｌのワイヤを前記
基板又は基板に固着した部材に圧接してウエツジ
先端面に沿わしめ、その後、ウエツジを次の第１
ボンデイング部に移動せしめるので、急な傾斜の
ガイド孔を有するウエツジを用いてボンデイング
を行うときであつても、第１ボンデイング部のボ
ンデイングに際してウエツジを真直に下降させれ
ばワイヤの先端部は所定長ｌだけ確実に第１ボン
デイング部とウエツジの先端面との間に挟圧さ
れ、確実にボンデイングされる。 In the present invention, after the application of ultrasonic waves to the second bonding section is completed, the wedge is raised forward and upward by a distance equal to the length l of the wire required for the next first bonding. The length of the wire from the rising base of the wire that is continuous from the second bonding part to the wedge is set as l, and then the wedge is moved relatively directly below or forward while the wedge is prevented from retreating with respect to the wire. lowering the wire diagonally downward to cut the wire at the base rising from the second bonding part, and press the wire having a length l of the tip end to the substrate or a member fixed to the substrate so as to run it along the tip end surface of the wedge; Then move the wedge to the next
Therefore, even when bonding is performed using a wedge with a steeply sloped guide hole, if the wedge is lowered straight during bonding at the first bonding section, the tip of the wire can be kept at a predetermined length. 1 is reliably pressed between the first bonding part and the distal end surface of the wedge, and bonding is ensured.

この場合、特願昭62−199039号の発明はワイヤ
繰り出し機構でワイヤを切断し、その後ワイヤ繰
り出し機構でワイヤの繰り出しを行うものであつ
たのでワイヤとガイド孔とのガタ、ワイヤ繰り出
し機構のバラツキ等により、ワイヤの繰り出し量
のバラツキ、折曲点のズレ、折曲形成した第１ボ
ンデイングしろの横方向への曲りなどが生じるお
それがあつたが、本発明は第２ボンデイング部か
らワイヤを連続させたままで先ずウエツジを相対
的に上昇させることにより第２ボンデイング部と
ウエツジとの間のワイヤの長さをｌとする（ワイ
ヤは第１ボンデイングしろである所定長ｌだけウ
エツジから突出したこととなる）。その後ウエツ
ジのワイヤに対する後退を阻止した状態でウエツ
ジを相対的に真下に又は前方下方に斜めに下降せ
しめる。するとこの動作だけでワイヤの切断と折
曲が殆ど同時に続いて起こる。従つて、ワイヤの
繰り出し量のバラツキ、折曲点のズレ、折曲形成
した第１ボンデイングしろの横方向への曲りなど
が生じるおそれがなく、また所要動作も少なく、
ワイヤ繰り出し機構も不要である。 In this case, the invention of Japanese Patent Application No. 62-199039 cuts the wire with a wire feeding mechanism, and then feeds out the wire with the wire feeding mechanism, so there is play between the wire and the guide hole and variations in the wire feeding mechanism. However, in the present invention, it is possible to continuously feed the wire from the second bonding part. The length of the wire between the second bonding part and the wedge is set to l by first relatively raising the wedge while keeping it in place (the wire protrudes from the wedge by a predetermined length l, which is the first bonding margin). Become). Thereafter, the wedge is lowered diagonally downward or forward while preventing the wedge from retreating relative to the wire. This action alone causes the wire to be cut and bent almost simultaneously. Therefore, there is no risk of variations in the amount of wire being fed out, deviation of the bending point, bending of the bent first bonding margin in the lateral direction, etc., and the required operations are small.
A wire feeding mechanism is also not required.

〔実施例〕〔Example〕

本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.

第１〜３図において、ウエツジ１はワイヤ２を
挿通するガイド孔３を先端面４に対して45°〜
90°、本実施例では例えば60°、傾斜させて備え、
従来公知の構成の超音波ボンデイング装置に取り
付けられている。即ち、ウエツジ１はホーンの先
端に取り付けられており、クランプ５と一体に、
基板６に対して相対的に、水平面上でのＸ方向移
動、水平面上での、Ｘ方向と直角の方向のＹ方向
移動、Ｘ，Ｙ方向それぞれに直角の方向のＺ方向
移動（上下動）、基板６に固着したIC上の第１ボ
ンデイング部７と基板６上の第２ボンデイング部
８を結ぶ線をＹ方向に一致させるθ回動が可能で
ある。ウエツジ１とクランプ５は上述の如く一体
に運動するようにしてあれば駆動部は共通であつ
てもそれぞれ別個に設けてもよい。またクランプ
５はガイド孔３の延長線上に設けられている。 In Figures 1 to 3, the wedge 1 has a guide hole 3 through which the wire 2 is inserted at an angle of 45° to the distal end surface 4.
Provided at an angle of 90°, for example 60° in this example,
It is attached to an ultrasonic bonding device having a conventionally known configuration. That is, the wedge 1 is attached to the tip of the horn, and is integrated with the clamp 5.
Relative to the substrate 6, movement in the X direction on the horizontal plane, movement in the Y direction in the direction perpendicular to the X direction on the horizontal plane, movement in the Z direction (vertical movement) in the direction perpendicular to each of the X and Y directions. , it is possible to perform θ rotation so that the line connecting the first bonding portion 7 on the IC fixed to the substrate 6 and the second bonding portion 8 on the substrate 6 coincide with each other in the Y direction. As long as the wedge 1 and the clamp 5 are configured to move together as described above, they may have a common drive unit or may be provided separately. Further, the clamp 5 is provided on an extension line of the guide hole 3.

なお、本実施例においては、Ｘ，Ｙテーブル上
にボンデイングヘツドが載置され、ボンデイング
ヘツドに上下動装置（回動装置）を備えたウエツ
ジ１とクランプ５が上下動可能に設けられ、基板
６の方にθ回動装置が設けられていることとす
る。ウエツジ１はその前後方向がＹ方向に一致す
るように設けられているとする。 In this embodiment, a bonding head is placed on an X, Y table, and a wedge 1 and a clamp 5 equipped with a vertical movement device (rotation device) are provided on the bonding head so as to be vertically movable. It is assumed that the θ rotation device is provided on the side. It is assumed that the wedge 1 is provided so that its front-back direction coincides with the Y direction.

次に第１〜２図に基いてボンデイング動作につ
いて説明する。 Next, the bonding operation will be explained based on FIGS. 1 and 2.

第１図ａは第２ボンデイング部８の超音波印加
を終了したところを示し、第２図のＡ点に相当す
る。クランプ５は開である。 FIG. 1a shows the state where the application of ultrasonic waves to the second bonding part 8 has been completed, and corresponds to point A in FIG. 2. Clamp 5 is open.

クランプ５を開としたまま、ウエツジ１及びク
ランプ５を上下動装置により真上に又は上下動装
置及びＸ，Ｙテーブルにより前方上方に斜めに上
昇させる。このとき次の第１ボンデイング部７1
のボンデイングに要する所定のワイヤ長ｌ（第１
ボンデイングしろ）が第２ボンデイング部８のボ
ンデイングされているワイヤに連続したままでウ
エツジ１の先端面４から突出することとなる。な
おこの実施例では傾き60°のワイヤ２に沿つて斜
めに上昇させるように、Δz1，Δy1を選んでいる。
…第１図ｂ、第２図ではＢ点。 With the clamp 5 left open, the wedge 1 and the clamp 5 are raised diagonally upward by the vertical movement device directly or forward and upward by the vertical movement device and the X, Y table. At this time, the next first bonding part 7 1
The predetermined wire length l (first
The bonding margin) protrudes from the distal end surface 4 of the wedge 1 while remaining continuous with the bonded wire of the second bonding portion 8. Note that in this embodiment, Δ z1 and Δ y1 are selected so that they are raised obliquely along the wire 2 with an inclination of 60°.
...Point b in Figure 1 and point B in Figure 2.

クランプ５を閉とする。…第１図ｃ、第２図で
はＣ点、第３図ではウエツジ１Ｃ、ワイヤ２Ｃ。 Clamp 5 is closed. ...Point c in Figure 1, point C in Figure 2, wedge 1C and wire 2C in Figure 3.

次いでウエツジ１をクランプ５とともに真下又
は前方下方へ下降させる（第１図ｂにおいてウエ
ツジ１を斜めに上昇させた場合は真下でも前方下
方でもよいが、ウエツジ１を真上に上昇させた場
合は前方下方に限られる）。この実施例ではΔz1と
絶対量が同じΔz2、第２ボンデイング部８からの
ワイヤ立ち上がり基部１３とウエツジ１のガイド
孔出口部１４との水平距離が長さｌより大なるよ
うにかつ先端面４が第２ボンデイング部８から外
れるように選んだΔy2だけ、矢印１０のように斜
めに下降させている。すると、ウエツジ１はワイ
ヤ２をワイヤ２の先端から所定長ｌだけ手前の第
１ボンデイングしろ基部９をガイド孔出口部１４
で曲げながら下降し、ワイヤ立ち上がり基部１３
とガイド孔出口部１４との直線距離が長さｌを越
えるとワイヤ２はワイヤ立ち上がり基部１３で切
断される。…第１図ｄ、第２図ではＤ点、第３図
ではウエツジ１Ｄ、ワイヤ２Ｄ。 Next, the wedge 1 is lowered along with the clamp 5 directly below or forwardly downward (in the case where the wedge 1 is raised diagonally in Fig. 1b, it may be directly below or forwardly downward; however, when the wedge 1 is raised directly upwards, it may be lowered forwardly). (limited to the lower part). In this embodiment, the absolute amount Δ z2 is the same as Δ z1 , the horizontal distance between the wire rising base 13 from the second bonding part 8 and the guide hole exit part 14 of the wedge 1 is greater than the length l, and the distal end surface is 4 is moved diagonally downward as indicated by the arrow 10 by Δy2 , which is selected so that the bonding portion 4 is removed from the second bonding portion 8. Then, the wedge 1 connects the wire 2 by a predetermined length l from the tip of the wire 2, and connects the first bonding base 9 to the guide hole outlet 14.
Lower the wire while bending at the base 13.
When the straight distance between the guide hole exit portion 14 and the guide hole exit portion 14 exceeds the length l, the wire 2 is cut at the wire rising base portion 13. ...Point d in Figure 1, point D in Figure 2, wedge 1D and wire 2D in Figure 3.

さらにウエツジ１及びクランプ５の一体下降を
続けてワイヤ先端を先端面４で基板６に押し付け
ると、ワイヤ２は第１ボンデイングしろ基部９で
確実に折れ曲り、ウエツジ１の先端面４に沿つて
所定長ｌの第１ボンデイングしろが折曲形成され
る。…第１図ｅ、第２図ではＥ点、第３図ではウ
エツジ１Ｅ、ワイヤ２Ｅ。 Further, when the wedge 1 and the clamp 5 continue to be lowered together and the tip of the wire is pressed against the substrate 6 with the tip surface 4, the wire 2 is surely bent at the base 9 of the first bonding margin, and the wire 2 is bent at a predetermined position along the tip surface 4 of the wedge 1. A first bonding margin of length l is formed by bending. ...Point e in Figure 1, point E in Figure 2, wedge 1E and wire 2E in Figure 3.

このままの状態でウエツジ１をｘ，ｙ，ｚ移動
せしめ、次にボンデイングを行う第１ボンデイン
グ部７1の直上部に位置を合せる。基板６は第１
ボンデイング部７1と第２ボンデイング部８1を結
ぶ線がＹ方向即ちウエツジ１の前後方向に一致す
る如くθ回動させられている。…第１図ｆ、第２
図ではＦ点。 In this state, the wedge 1 is moved in x, y, and z until it is positioned directly above the first bonding section 71 that will be bonded next. The substrate 6 is the first
The line connecting the bonding part 7 1 and the second bonding part 8 1 is rotated by θ so that it coincides with the Y direction, that is, the front-rear direction of the wedge 1 . ...Figure 1f, 2nd
In the figure, it is point F.

次に、ウエツジ１を真下に下降せしめてウエツ
ジ１の先端面４と第１ボンデイング部７1との間
に所定長ｌの第１ボンデイングしろを挟圧し、ウ
エツジ１により超音波を印加してワイヤボンデイ
ングを行う。 Next, the wedge 1 is lowered straight down, a first bonding margin of a predetermined length l is pressed between the distal end surface 4 of the wedge 1 and the first bonding part 71 , and ultrasonic waves are applied by the wedge 1 to wire the wedge. Perform bonding.

第１図ｃから第１図ｅ即ち、第２図Ｃ〜Ｅのウ
エツジ１の移動を第３図に拡大して示す。このよ
うにウエツジ１Ｃの状態からウエツジ１Ｅの状態
に移動させるには、例えば破線矢印のように前方
下方に円弧状にウエツジ１を下降せしめてもよい
し、ウエツジ１を実線矢印のように前方下方に斜
めに直線的に下降せしめてもよい。 The movement of the wedge 1 in FIGS. 1c to 1e, that is, in FIGS. 2C to E, is shown in an enlarged manner in FIG. In order to move the wedge 1C from the wedge 1C state to the wedge 1E state, for example, the wedge 1 may be lowered forward and downward in an arc shape as shown by the broken line arrow, or the wedge 1 may be moved forward and downward as shown by the solid line arrow. It may be lowered diagonally and linearly.

以上述べた実施例ではウエツジ１とクランプ５
とを一体的に移動させる例であつたがウエツジ１
とクランプ５とが相対的に移動可能な装置におい
ては一体移動させなくとも可能である。例えばク
ランプ５を閉じた状態〔第１図ｃ〕でクランプ５
を基板６に対して静止させウエツジ１を第１図
ｄ，ｅの如く移動させることもできる。 In the embodiment described above, wedge 1 and clamp 5
Wedge 1 was an example of moving the
In a device in which the clamp 5 and the clamp 5 are movable relative to each other, it is possible to do so without moving them integrally. For example, when the clamp 5 is closed [Fig. 1c],
It is also possible to keep the wedge 1 stationary relative to the substrate 6 and move the wedge 1 as shown in FIGS. 1d and 1e.

いずれにしても、ウエツジ１を相対的に真下に
又は前方下方へ斜めに下降せしめて、ワイヤ２を
ワイヤ立ち上がり基部１３でカツトするとともに
第１ボンデイングしろ基部９で折曲して第１ボン
デイングしろを折曲形成すればよく、例えばＹ，
Ｚ方向移動装置が基板６の方に設けられている場
合では基板６を移動させることもできる。 In any case, the wedge 1 is lowered relatively straight down or diagonally forward and downward, and the wire 2 is cut at the wire rising base 13 and bent at the first bonding base 9 to form the first bonding margin. It may be formed by bending, for example, Y,
If the Z-direction moving device is provided on the substrate 6, the substrate 6 can also be moved.

〔発明の効果〕〔Effect of the invention〕

本発明は第２ボンデイング部からワイヤを連続
させたままで先ずウエツジを相対的に上昇させる
ことにより第２ボンデイング部とウエツジとの間
のワイヤに長さをｌとし、その後ウエツジのワイ
ヤに対する後退を阻止した状態でウエツジを相対
的に真下に又は前方下方に斜めに下降せしめるこ
とによりワイヤの切断と折曲を殆ど同時に行うの
で、ワイヤの繰り出し量のバラツキ、折曲点のズ
レ、折曲形成した第１ボンデイングしろの横方向
への曲りなどが生じるおそれがなく、また動作も
少なく、ワイヤ繰り出し機構も不要である。 In the present invention, the wire between the second bonding part and the wedge is made to have a length l by first relatively raising the wedge while keeping the wire continuous from the second bonding part, and then preventing the wedge from retreating with respect to the wire. In this state, the wire is cut and bent almost simultaneously by lowering the wedge relatively straight down or forward and downward. There is no risk of lateral bending of one bonding allowance, the movement is small, and a wire feeding mechanism is not required.

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ〜ｆは動作説明図、第２図はタイムチ
ヤート、第３図は動作の主要部の拡大説明図、第
４図ａ，ｂはそれぞれ従来用いられているウエツ
ジの説明図である。 １，１１……ウエツジ、２……ワイヤ、３，３
１……ガイド孔、４，４１……先端面、５……ク
ランプ、６……基板、７，７1……第１ボンデイ
ング部、８，８1……第２ボンデイング部、９…
…第１ボンデイングしろ基部、１０，１２……矢
印、１３……ワイヤ立ち上がり基部、１４……ガ
イド孔出口部。 Figures 1 a to f are explanatory diagrams of the operation, Figure 2 is a time chart, Figure 3 is an enlarged explanatory diagram of the main parts of the operation, and Figures 4 a and b are explanatory diagrams of conventionally used wedges. . 1, 11... Wedge, 2... Wire, 3, 3
DESCRIPTION OF SYMBOLS 1... Guide hole, 4, 41... Tip surface, 5... Clamp, 6... Substrate, 7, 7 1 ... First bonding part, 8, 8 1 ... Second bonding part, 9...
...First bonding clearance base, 10, 12...Arrow, 13...Wire rising base, 14...Guide hole exit portion.

Claims (1)

【特許請求の範囲】[Claims] １ ボンデイングウエツジを用いて基板上でワイ
ヤボンデイングを行うワイヤボンデイング方法に
おいて、第２ボンデイング部の超音波印加の終了
後ボンデイングウエツジを次の第１ボンデイング
に要するワイヤの長さｌと同じ距離だけ前方上方
に斜めに又は真上に上昇させてボンデイングウエ
ツジをワイヤに対して後退せしめて第２ボンデイ
ング部から連続しているワイヤのその立ち上がり
基部からボンデイングウエツジまでのワイヤの長
さをｌとし、次いでボンデイングウエツジのワイ
ヤに対する後退を阻止した状態でボンデイングウ
エツジを相対的に真下に又は前方下方に斜めに下
降せしめてワイヤを前記第２ボンデイング部から
の立ち上がり基部で切断しかつ先端部の長さｌの
ワイヤを前記基板又は基板に固着した部材に圧接
してボンデイングウエツジ先端面に沿わしめ、そ
の後、ボンデイングウエツジを次の第１ボンデイ
ング部に移動せしめることを特徴とするワイヤボ
ンデイング方法。1 In a wire bonding method in which wire bonding is performed on a substrate using a bonding wedge, after the application of ultrasonic waves to the second bonding part is finished, the bonding wedge is moved by a distance equal to the length l of the wire required for the next first bonding. The length of the wire from the rising base of the wire that is continuous from the second bonding part to the bonding wedge is set as l by raising the bonding wedge forward and upward diagonally or directly upward to move the bonding wedge backward relative to the wire. Then, with the bonding wedge prevented from retreating relative to the wire, the bonding wedge is lowered diagonally downwardly or forwardly to cut the wire at the base rising from the second bonding part, and cut the wire at the base rising from the second bonding part. A wire bonding method characterized in that a wire having a length l is pressure-contacted to the substrate or a member fixed to the substrate so as to run along the tip end surface of the bonding wedge, and then the bonding wedge is moved to the next first bonding part. .
JP63194616A 1988-08-05 1988-08-05 Wire bonding Granted JPH0244743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63194616A JPH0244743A (en) 1988-08-05 1988-08-05 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63194616A JPH0244743A (en) 1988-08-05 1988-08-05 Wire bonding

Publications (2)

Publication Number Publication Date
JPH0244743A JPH0244743A (en) 1990-02-14
JPH05860B2 true JPH05860B2 (en) 1993-01-06

Family

ID=16327499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63194616A Granted JPH0244743A (en) 1988-08-05 1988-08-05 Wire bonding

Country Status (1)

Country Link
JP (1) JPH0244743A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method
JPS5889833A (en) * 1981-11-25 1983-05-28 Shinkawa Ltd Wire bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method
JPS5889833A (en) * 1981-11-25 1983-05-28 Shinkawa Ltd Wire bonding method

Also Published As

Publication number Publication date
JPH0244743A (en) 1990-02-14

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