DE68902904D1 - QUALITY CONTROL IN WIRE BINDING. - Google Patents

QUALITY CONTROL IN WIRE BINDING.

Info

Publication number
DE68902904D1
DE68902904D1 DE8989311229T DE68902904T DE68902904D1 DE 68902904 D1 DE68902904 D1 DE 68902904D1 DE 8989311229 T DE8989311229 T DE 8989311229T DE 68902904 T DE68902904 T DE 68902904T DE 68902904 D1 DE68902904 D1 DE 68902904D1
Authority
DE
Germany
Prior art keywords
wire
bonding
drawn
automatic
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE8989311229T
Other languages
German (de)
Other versions
DE68902904T2 (en
Inventor
Bernd Goebel
Andreas Ziemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F&K Delvotec Bondtechnik GmbH
Original Assignee
Newfrey LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10646748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68902904(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Newfrey LLC filed Critical Newfrey LLC
Publication of DE68902904D1 publication Critical patent/DE68902904D1/en
Application granted granted Critical
Publication of DE68902904T2 publication Critical patent/DE68902904T2/en
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

An automatic wire bonding apparatus, for wedge-bonding using aluminium wire, comprises a bonding head comprising a bonding tool mounted on an ultrasonic transducer, a bonding tip of the tool being arranged, in the operation of the machine, to press aluminium wire against the contact surface of an electronic or electrical component, the wire being drawn from a suitable wire supply, and a wire clamp by which the wire drawn from the wire supply may be clamped, the wire clamp being movable backward and forward generally in the direction in which the wire is fed appropriately to position the free end of wire drawn from the spool after completion of a bonding operation. The automatic wire-bonding apparatus further comprises means for monitoring, during bonding, the quality of the bond formed between the wire and the surface to which it is to be bonded, by identifying those bonds which do not fall within predetermined maximum and minimum values for deformation of the wire due to ultrasonic excitation. By using the automatic wire bonding apparatus described, the time during which ultrasonic energy is transmitted to the bond is minimised, thus maximising the throughput of the machine, and wastage due to unsatisfactory bond formation is reduced.
DE8989311229T 1988-11-11 1989-10-31 QUALITY CONTROL IN WIRE BINDING. Revoked DE68902904T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888826488A GB8826488D0 (en) 1988-11-11 1988-11-11 Quality control for wire bonding

Publications (2)

Publication Number Publication Date
DE68902904D1 true DE68902904D1 (en) 1992-10-22
DE68902904T2 DE68902904T2 (en) 1993-03-11

Family

ID=10646748

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989311229T Revoked DE68902904T2 (en) 1988-11-11 1989-10-31 QUALITY CONTROL IN WIRE BINDING.

Country Status (5)

Country Link
US (1) US4984730A (en)
EP (1) EP0368533B1 (en)
JP (1) JPH02187286A (en)
DE (1) DE68902904T2 (en)
GB (1) GB8826488D0 (en)

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DE4447073C1 (en) * 1994-12-29 1996-07-18 Bosch Gmbh Robert Method for testing connections made by ultrasonic wire bonding
WO1999019107A1 (en) * 1997-10-13 1999-04-22 Hesse & Knipps Gmbh Quality control method
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition
US6425514B1 (en) 1999-11-10 2002-07-30 Asm Technology Singapore Pte Ltd Force sensing apparatus
US6568581B2 (en) * 2001-03-15 2003-05-27 Asm Technology Singapore Pte. Ltd. Detection of wire bonding failures
US6644533B2 (en) 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
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EP1343201A1 (en) 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH Method and apparatus for manufacture and quality control of a wire bond
US20040060639A1 (en) * 2002-08-13 2004-04-01 Dawn White Method of apparatus for ensuring uniform build quality during object consolidation
DE102004022509A1 (en) * 2004-01-07 2005-08-25 Stapla Ultraschall-Technik Gmbh Consolidating and sealing a tube between a sonotrode and the anvil of an ultrasonic welder where the sonotrode is activated and displaced relative to a counter electrode useful for automatic consolidation and sealing of tubes
JP4625892B2 (en) * 2004-06-11 2011-02-02 日産自動車株式会社 Ultrasonic bonding method and apparatus
DE102005012992B4 (en) * 2005-03-21 2014-01-02 Infineon Technologies Ag Method, bonding device and system for bonding a semiconductor element
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
EP1897648B1 (en) 2006-09-05 2010-06-30 Technische Universität Berlin Method and device for controlling the generation of ultrasonic wire bonds
DE102007054626A1 (en) 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Method and apparatus for ultrasonic bonding
DE102008017495B8 (en) * 2008-04-04 2015-01-15 Rolls-Royce Deutschland Ltd & Co Kg Method of making or repairing integrally bladed rotors
DE102008020624A1 (en) * 2008-04-24 2009-10-29 Rolls-Royce Deutschland Ltd & Co Kg Process for the production of turbine or compressor rotors for gas turbine engines
KR101620351B1 (en) * 2012-01-30 2016-05-12 삼성전자주식회사 Wire bonding method of electric element
US9876487B2 (en) 2013-09-27 2018-01-23 International Business Machines Corporation Contactless readable programmable transponder to monitor chip join
JP6575161B2 (en) * 2015-06-16 2019-09-18 富士電機株式会社 Pass / fail judgment device, wire bonder device, and pass / fail judgment method
DE102017101736A1 (en) * 2017-01-30 2018-08-02 F&K Delvotec Bondtechnik Gmbh Method of making wire bonds and device for carrying out the method
US10658328B2 (en) * 2017-11-09 2020-05-19 Asm Technology Singapore Pte Ltd Detection of foreign particles during wire bonding
JP6905778B2 (en) * 2018-08-06 2021-07-21 株式会社新川 Bonding head

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Also Published As

Publication number Publication date
GB8826488D0 (en) 1988-12-14
JPH02187286A (en) 1990-07-23
US4984730A (en) 1991-01-15
DE68902904T2 (en) 1993-03-11
EP0368533A3 (en) 1990-06-13
EP0368533B1 (en) 1992-09-16
EP0368533A2 (en) 1990-05-16

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Owner name: F & K DELVOTEC BONDTECHNIK GMBH, 82041 OBERHACHING

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