JPS5826528Y2 - ハンドウタイソウチノセイゾウソウチ - Google Patents

ハンドウタイソウチノセイゾウソウチ

Info

Publication number
JPS5826528Y2
JPS5826528Y2 JP1975121144U JP12114475U JPS5826528Y2 JP S5826528 Y2 JPS5826528 Y2 JP S5826528Y2 JP 1975121144 U JP1975121144 U JP 1975121144U JP 12114475 U JP12114475 U JP 12114475U JP S5826528 Y2 JPS5826528 Y2 JP S5826528Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding
ultrasonic
jig
seizou
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975121144U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5234672U (online.php
Inventor
育久 西村
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1975121144U priority Critical patent/JPS5826528Y2/ja
Publication of JPS5234672U publication Critical patent/JPS5234672U/ja
Application granted granted Critical
Publication of JPS5826528Y2 publication Critical patent/JPS5826528Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1975121144U 1975-09-01 1975-09-01 ハンドウタイソウチノセイゾウソウチ Expired JPS5826528Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975121144U JPS5826528Y2 (ja) 1975-09-01 1975-09-01 ハンドウタイソウチノセイゾウソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975121144U JPS5826528Y2 (ja) 1975-09-01 1975-09-01 ハンドウタイソウチノセイゾウソウチ

Publications (2)

Publication Number Publication Date
JPS5234672U JPS5234672U (online.php) 1977-03-11
JPS5826528Y2 true JPS5826528Y2 (ja) 1983-06-08

Family

ID=28601853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975121144U Expired JPS5826528Y2 (ja) 1975-09-01 1975-09-01 ハンドウタイソウチノセイゾウソウチ

Country Status (1)

Country Link
JP (1) JPS5826528Y2 (online.php)

Also Published As

Publication number Publication date
JPS5234672U (online.php) 1977-03-11

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