JPS5826524Y2 - ハンドウタイワイヤボンダソウチ - Google Patents

ハンドウタイワイヤボンダソウチ

Info

Publication number
JPS5826524Y2
JPS5826524Y2 JP1975166827U JP16682775U JPS5826524Y2 JP S5826524 Y2 JPS5826524 Y2 JP S5826524Y2 JP 1975166827 U JP1975166827 U JP 1975166827U JP 16682775 U JP16682775 U JP 16682775U JP S5826524 Y2 JPS5826524 Y2 JP S5826524Y2
Authority
JP
Japan
Prior art keywords
capillary
wire bonder
detection device
touch
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975166827U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5279863U (enrdf_load_stackoverflow
Inventor
聖一 英
達雄 斉藤
正泰 長島
明夫 田沢
弘義 藤原
広治 飯塚
貞夫 野一色
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1975166827U priority Critical patent/JPS5826524Y2/ja
Publication of JPS5279863U publication Critical patent/JPS5279863U/ja
Application granted granted Critical
Publication of JPS5826524Y2 publication Critical patent/JPS5826524Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1975166827U 1975-12-12 1975-12-12 ハンドウタイワイヤボンダソウチ Expired JPS5826524Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975166827U JPS5826524Y2 (ja) 1975-12-12 1975-12-12 ハンドウタイワイヤボンダソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975166827U JPS5826524Y2 (ja) 1975-12-12 1975-12-12 ハンドウタイワイヤボンダソウチ

Publications (2)

Publication Number Publication Date
JPS5279863U JPS5279863U (enrdf_load_stackoverflow) 1977-06-14
JPS5826524Y2 true JPS5826524Y2 (ja) 1983-06-08

Family

ID=28645481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975166827U Expired JPS5826524Y2 (ja) 1975-12-12 1975-12-12 ハンドウタイワイヤボンダソウチ

Country Status (1)

Country Link
JP (1) JPS5826524Y2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
JPS62247538A (ja) * 1987-01-09 1987-10-28 Hitachi Ltd ワイヤボンデイング装置
JPH03114239A (ja) * 1990-08-13 1991-05-15 Marine Instr Co Ltd ボンディング面接触検出装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529976B2 (enrdf_load_stackoverflow) * 1973-10-29 1977-03-19
JPS5730563B2 (enrdf_load_stackoverflow) * 1973-10-31 1982-06-29
JPS5258465A (en) * 1975-11-10 1977-05-13 Mitsubishi Electric Corp Wire bonding device

Also Published As

Publication number Publication date
JPS5279863U (enrdf_load_stackoverflow) 1977-06-14

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