JPS5823938B2 - 集積回路の試験方法 - Google Patents

集積回路の試験方法

Info

Publication number
JPS5823938B2
JPS5823938B2 JP51033678A JP3367876A JPS5823938B2 JP S5823938 B2 JPS5823938 B2 JP S5823938B2 JP 51033678 A JP51033678 A JP 51033678A JP 3367876 A JP3367876 A JP 3367876A JP S5823938 B2 JPS5823938 B2 JP S5823938B2
Authority
JP
Japan
Prior art keywords
input
circuit
electron beam
test
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51033678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS525272A (en
Inventor
レオン・エルーエイチ・ウー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS525272A publication Critical patent/JPS525272A/ja
Publication of JPS5823938B2 publication Critical patent/JPS5823938B2/ja
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/305Contactless testing using electron beams

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP51033678A 1975-06-30 1976-03-29 集積回路の試験方法 Expired JPS5823938B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/591,991 US3969670A (en) 1975-06-30 1975-06-30 Electron beam testing of integrated circuits

Publications (2)

Publication Number Publication Date
JPS525272A JPS525272A (en) 1977-01-14
JPS5823938B2 true JPS5823938B2 (ja) 1983-05-18

Family

ID=24368802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51033678A Expired JPS5823938B2 (ja) 1975-06-30 1976-03-29 集積回路の試験方法

Country Status (3)

Country Link
US (1) US3969670A (US20090163788A1-20090625-C00002.png)
JP (1) JPS5823938B2 (US20090163788A1-20090625-C00002.png)
FR (1) FR2316728A1 (US20090163788A1-20090625-C00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083150U (ja) * 1983-11-15 1985-06-08 四国中央木材協同組合 足場板等の木口割れ止め構造

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2831787C2 (de) * 1978-07-19 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Mit Hilfe eines Elektronen- oder Laserstrahls prüfbare integrierte Schaltungsanordnung
US4808915A (en) * 1981-10-30 1989-02-28 Honeywell Bull, Inc. Assembly of electronic components testable by a reciprocal quiescent testing technique
US4556840A (en) * 1981-10-30 1985-12-03 Honeywell Information Systems Inc. Method for testing electronic assemblies
US4711024A (en) * 1981-10-30 1987-12-08 Honeywell Information Systems Inc. Method for making testable electronic assemblies
US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
NL8700933A (nl) * 1987-04-21 1988-11-16 Philips Nv Testmethode voor lcd-elementen.
US4779041A (en) * 1987-05-20 1988-10-18 Hewlett-Packard Company Integrated circuit transfer test device system
US4779043A (en) * 1987-08-26 1988-10-18 Hewlett-Packard Company Reversed IC test device and method
US4853628A (en) * 1987-09-10 1989-08-01 Gazelle Microcircuits, Inc. Apparatus for measuring circuit parameters of a packaged semiconductor device
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
JP3151203B2 (ja) * 1988-11-23 2001-04-03 テキサス インスツルメンツ インコーポレイテツド 集積回路の自己検査装置
US5072175A (en) * 1990-09-10 1991-12-10 Compaq Computer Corporation Integrated circuit having improved continuity testability and a system incorporating the same
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5389556A (en) * 1992-07-02 1995-02-14 Lsi Logic Corporation Individually powering-up unsingulated dies on a wafer
US5648661A (en) * 1992-07-02 1997-07-15 Lsi Logic Corporation Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies
US5532174A (en) * 1994-04-22 1996-07-02 Lsi Logic Corporation Wafer level integrated circuit testing with a sacrificial metal layer
US5817533A (en) * 1996-07-29 1998-10-06 Fujitsu Limited High-yield methods of fabricating large substrate capacitors
US5972725A (en) * 1997-12-11 1999-10-26 Advanced Micro Devices, Inc. Device analysis for face down chip
JP4207307B2 (ja) * 1999-04-26 2009-01-14 日新イオン機器株式会社 チャージアップ測定装置
US20030099016A1 (en) * 2001-11-27 2003-05-29 International Business Machines Corporation Fiber optic transceiver array for implementing testing
US6985674B2 (en) * 2001-11-27 2006-01-10 International Business Machines Corporation Fiber optic transceiver array and fiber optic transceiver channel for short wave fiber optic communications

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3351716A (en) * 1962-08-06 1967-11-07 Victor Company Of Japan Magnetic erasing circuitry
JPS4823385A (US20090163788A1-20090625-C00002.png) * 1971-07-28 1973-03-26
US3879613A (en) * 1971-12-13 1975-04-22 Philips Corp Methods of manufacturing semiconductor devices
CA948705A (en) * 1972-07-28 1974-06-04 Robert C. Cook Method for making an integrated circuit apparatus
US3796947A (en) * 1973-02-27 1974-03-12 Bell Telephone Labor Inc Electron beam testing of film integrated circuits
US3787720A (en) * 1973-03-28 1974-01-22 Hughes Aircraft Co Semiconductor vidicon and process for fabricating same
US3861023A (en) * 1973-04-30 1975-01-21 Hughes Aircraft Co Fully repairable integrated circuit interconnections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083150U (ja) * 1983-11-15 1985-06-08 四国中央木材協同組合 足場板等の木口割れ止め構造

Also Published As

Publication number Publication date
US3969670A (en) 1976-07-13
FR2316728B1 (US20090163788A1-20090625-C00002.png) 1979-04-06
JPS525272A (en) 1977-01-14
FR2316728A1 (fr) 1977-01-28

Similar Documents

Publication Publication Date Title
JPS5823938B2 (ja) 集積回路の試験方法
JP2628359B2 (ja) ヒューズ状態検出回路
US4053833A (en) Contactless test method for integrated circuits
US4255756A (en) Substrate bias generator
US4984054A (en) Electric fuse for a redundancy circuit
US5594328A (en) Passive probe employing cluster of charge monitors for determining simultaneous charging characteristics of wafer environment inside IC process equipment
US7848828B2 (en) Method and apparatus for managing manufacturing equipment, method for manufacturing device thereby
EP0092985B1 (en) Dynamic memory device
US5764569A (en) Test structure and method to characterize charge gain in a non-volatile memory
US6870375B2 (en) System and method for measuring a capacitance associated with an integrated circuit
US7345500B2 (en) Method and system for device characterization with array and decoder
US5329228A (en) Test chip for semiconductor fault analysis
US5329139A (en) Semiconductor integrated circuit device analyzable by using laser beam inducing current
KR20050088186A (ko) 반도체 소자 생성 방법, 반도체 기판 및 반도체 장치
US4908525A (en) Cut-only CMOS switch for discretionary connect and disconnect
JPH0734450B2 (ja) 集積回路の欠陥許容電力分配ネットワークおよびその方法
US6927594B2 (en) Evaluation device for evaluating semiconductor device
KR900002008B1 (ko) 이중 다결정구조를 갖는 스태틱 메모리셀
US6809540B2 (en) Integrated circuit test structure
EP0020113A1 (en) Semiconductor device
EP0527337A1 (en) Semiconductor integrated circuit
Dayanand et al. Defect localization enhancement using light induced CI-AFP
JPH10242395A (ja) 半導体集積回路
JPH04312942A (ja) Obic電流検出方法
Scheuerlein et al. Shared word line DRAM cell