JPS5823440A - Device for manufacture of semiconductor - Google Patents

Abstract

PURPOSE:To obtain a developing device by the photo etching technique for a semiconductor which can smoothly and surely suck waste solutions and quickly exhaust them out of the device. CONSTITUTION:A developer or a rinsing solution spouts from nozzles 6 in a spray form and strikes the surface of a wafer. Thereat, the wafer trotates to improve the homogeneity of the development. The developer and the rinsing solution wherewith a treatment is finished are sucked from the clearance between external walls 7 and internal walls 11 of the upper cup and exhausted out of the device through an exhaust outlet 10. Since the internal walls 11 have numerous holes on the internal wall, the waste solution shaken off in a treatment is easily caught in from any position of the wall without concentration at a place. Therefore, it turns nothing that a waste solution blocks clearances and reduces suction forces as conventional and a catch-in efficiency improves.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to semiconductor manufacturing equipment, and is particularly used for photolithography of semiconductor devices and photolithography masks. The present invention relates to semiconductor manufacturing equipment.

Conventionally, in the photo-etching process, the upper cup and lower cup are brought into close contact with each other, and in the equipment in which the wax and mask are processed, the upper cup wall surface is doubled. , it is not possible to suck up the used waste liquid only from one direction, such as the lower part. According to this method.

A large amount of the used waste liquid that was sealed off by the rotation was concentrated in the direction of the suction port, which was considered to be one of the causes of the re-adhesion of the waste liquid, which caused insufficient suction power. In addition, if the device is used for a long time, the photosensitive resin contained in the waste liquid will solidify and block the suction port, resulting in a significant decrease in suction power, which may cause a serious shortage of sodium hydroxide. It had become.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for manufacturing semiconductor devices that exhibit defects by smoothly and reliably sucking up used waste liquid and quickly exhausting it to the outside of the apparatus.

In order to reliably suck in used waste liquid, the semiconductor manufacturing equipment of this invention has numerous holes in the inner wall of the double cup. It is characterized by the ability to suck out waste liquid.

According to the semiconductor manufacturing apparatus of the present invention, there is no longer a case where the waste liquid blocks the suction port, which was the case in the past, and the suction port can
Since it has a structure that can withstand long-term use, it has no influence on the product and greatly contributes to improving the yield.

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a structural diagram of a semiconductor manufacturing apparatus for explaining an embodiment of the present invention. The process when the apparatus of this embodiment processes a product is as follows. Incidentally, in order to simplify the explanation, the explanation will be made according to the method used when manufacturing a semiconductor device.

First, when a semiconductor substrate (hereinafter referred to as a wafer) l placed in one position enters the developing device, the one rotation shaft 2 is rotated to fix the wafer. Next, the lower cup 3 or upper cup 4 moves to create a sealed space.

FIG. 2 shows a device of conventional construction in a sealed state. When the nozzle 6 is sealed, a developing solution or a rinsing solution is sprayed in a mist form and hits the wafer surface. At this time, the wafer is rotated to improve uniformity of development.

The developer solution and lysate solution that has been processed are placed on the outer wall 7 of the upper cap.
．． It is sucked in through the gap 9 in the inner wall 8 and exhausted to the outside of the device through the exhaust port 10. At this time, a large amount of current GL liquid and rinsing liquid are concentrated in the gap 9, and the gap 9t1 is filled with them, resulting in a significant decrease in suction power and 1 no longer fulfilling its original role. Furthermore, since the waste liquid contains a considerable amount of photosensitive resin, if used for a long time, it will solidify and accumulate in the gap 9, resulting in a significant reduction in the area of the suction port.

This will lead to a decrease in suction power, but if used for a longer period of time, the suction port will be completely blocked and the waste liquid will not be exhausted at all, leading to serious defects in the developing process.

Therefore, a sectional view of an apparatus according to an embodiment of the present invention is shown in FIG.

The inner wall 11 shown in Fig. 3 is different from the conventional one because it has numerous holes, so the waste liquid that is covered during processing can be easily collected from any position on the wall surface. - There is no possibility that waste liquid will be concentrated in one place. Therefore, there is no possibility that the waste liquid would block the gaps that existed in the past and reduce the suction power.

Capture efficiency is dramatically improved. Furthermore, even if the device is used for a long period of time, there are countless inlets for waste liquid on all sides, so even if the waste liquid solidifies, the effect of solidification is almost gone, and the life of the device is shortened compared to before. It stretches to the point where it doesn't become a problem.

As described above, if the device according to the present invention is used,
The defect rate of products during the development process is significant.

Therefore, it greatly contributes to improving the product yield.

Used when manufacturing semiconductor devices in the above embodiments.
Although the explanation has been given along with the description, it goes without saying that this device can be applied to other devices used in the so-called developing process of photographic etching technology.

[Brief explanation of the drawing]

Figure 1 is a structural diagram of semiconductor manufacturing equipment (developing equipment).
...Wafer, 2... Rotating shaft, 3...
...Lower cup, 4...Upper cup, 5...
...It's an exhaust hose. Figure 2 is a cross-sectional view of the conventional device in a sealed state.
6... Development processing nozzle, -7... Upper cup outer wall, 8... Upper cup inner wall, 9...
... Gap between inner wall and outer wall, 10 ... Exhaust port. FIG. 3 is a sectional view including the inner wall of the embodiment of the present invention.
...Inner wall according to the example.

Claims (1)

[Claims] During the current process of photoetching technology in the semiconductor manufacturing process. The upper and lower cups are sealed to form a closed space. While rotating the wafers one by one inside the closed space. 1. A semiconductor manufacturing apparatus that performs a hardening process, characterized in that the upper cup has a double wall surface, and numerous holes are formed in the inner wall of the wrinkled wall surface.