KR200259942Y1 - A Drain Cup Assembly For A Single Semiconductor Wafer Clean Processor Type - Google Patents

Abstract

The present invention relates to a chemical liquid drainage cup for single wafer type semiconductor wafer cleaning, the chemical liquid inlet 21 through which the chemical liquid is introduced, the chemical liquid drain tube 24 through which the chemical liquid is discharged, and the introduced chemical liquid are collected into the chemical liquid drain tube 24. A chemical liquid plate 23 that can flow, an exhaust port 26 through which the vaporized chemical liquid is discharged, and a chemical liquid exhaust pipe 25 are formed and formed as an integral structure of two or more multistage stacking forms, each of the chemical liquid drain pipe 24 and the chemical liquid. Since the chemical liquid or vaporized chemical liquid is discharged through the exhaust pipe 25, there is an effect of preventing mutual contamination even when using different chemical liquids.

Description

A-Drain Cup Assembly For A Single Semiconductor Wafer Clean Processor Type

The present invention relates to a chemical liquid drainage cup for cleaning single wafer semiconductors and a photoresist developing device, and more particularly, to manufacture semiconductor wafers, thin film liquid crystal display (LCD) substrates, and the like. In the process, chemicals, photoresists, developer and pure water used for cleaning the wafers before or after the deposition process or after the Asher process are used to collect and discharge the developer and pure water. A chemical liquid drainage cup for cleaning single wafer semiconductor wafers.

Generally, in the semiconductor manufacturing process, deposition, etching, coating of photo-resist, developing, removing asher, and cleaning of an insulating film and a metal material are repeated several times. You will create an array of fine patterning.

In addition, in the application and development of the photosensitive agent, a liquid chemical is sprayed onto the wafer to apply a photoresist film and develop. In the wet cleaning process, a chemical chemical or deionized water is used. It is sprayed onto the wafer to remove foreign substances generated in each process.

In the conventional single wafer type semiconductor wafer cleaning apparatus used in the semiconductor manufacturing process, as shown in FIG. 3, the wafer 117 is fixed by a spin chuck 111 capable of processing a single wafer 117. While rotating the wafer 117 by the chuck driving motor 113, the chemical liquid or pure water flows through the upper injection nozzle 114, and the chemical liquid or pure water flows to the front surface of the wafer 117 by the rotational force of the wafer 117. It is spread and washed.

In addition, the wafer cleaning liquid drainage cup 112 for wafer cleaning in the form of wrapping the wafer 117 used in such a single wafer type semiconductor wafer cleaning apparatus, as shown in FIG. 4, has a chemical liquid in the chemical drainage cup 112. The discharged chemical liquid drain pipe 124 and the chemical liquid exhaust pipe 125 for discharging the vaporized chemical liquid are formed at both ends, and the injected chemical liquid rotates the wafer 117 to form the wafer 117 along the surface of the wafer 117. Flow into the end is introduced into the chemical liquid draining cup 112, the introduced chemical is discharged through the chemical liquid draining pipe 124 is structured so that it can be collected in the external recovery tank 143 connected to the waste draining pipe 133.

Meanwhile, the conventional chemical liquid draining cup 112 may be reused by being sent to the buffer tank 142 through the chemical liquid draining tube 124 when only a single type of chemical liquid or pure water is used, but when using two or more types of chemical liquid draining tubes. The recovery tank 143 is connected to 124 and cannot be reused.

In addition, since the conventional chemical liquid drain cup 112 uses the same exhaust pipe for all chemical liquids without a separate exhaust pipe 125 between the chemical liquids, the exhaust gases between the vaporized chemical liquids may be mixed with each other, thereby causing problems of reaction. In case of using more than one kind of chemical liquid, the chemical liquid discharge path from the chemical liquid draining cup 112 to the valve 146 of the chemical liquid draining pipe 124 is the same, and the reaction between the chemical liquids in the chemical liquid draining pipe 124 and the chemical liquid used immediately before. There was a problem that the contamination of the chemical liquid collected in the recovery tank 143 can be easily contaminated with the wafer 117.

The present invention is to solve the problems as described above, each of the chemical liquid drain cup is placed in two or more stages in the longitudinal direction, each located in a separate liquid liquid drain cup for each type of chemical liquid used in the continuous cleaning operation with the chemical liquid or pure water The purpose of the present invention is to provide a chemical drainage cup that can prevent mutual contamination even if different chemicals are used by discharging the chemical or vaporized chemical through the chemical drainage pipe and the chemical drainage pipe.

1 is a cross-sectional structure of the single-leaf type cleaning device equipped with a chemical liquid drain cup of the present invention.

Figure 2 is an overall device configuration of the liquid liquid exhaust pipe and the liquid liquid drain pipe connected to the liquid liquid draining cup of the single-leaf type washing apparatus according to the present invention.

Figure 3 is a schematic cross-sectional structure of the conventional liquid liquid drainage cup used to be mounted to the single wafer cleaning apparatus.

Figure 4 is a schematic view of the overall device configuration of the liquid liquid exhaust pipe and the liquid liquid drain pipe connected to the chemical liquid drainage cup of the conventional single-leaf type washing apparatus.

Explanation of symbols on the main parts of the drawings

11: Spin Chuck 12: Drain Cup Assembly

13: Chuck drive motor 14: Upper injection nozzle

15: lower injection nozzle 16: cup support

17: wafer 21: chemical liquid inlet

22: inner wall of the cup 23: chemical liquid plate

24: chemical liquid drainage pipe 25: chemical liquid drainage pipe

26: exhaust port 27: airflow prevention material

31: internal drain pan 32: external drain pan

33: waste drain pipe 41: supply tank

42: buffer tank 43: recovery tank

44: waste tank 45: pump

46: valve 47: filter

48: exhaust box

The present invention for achieving the above object, the chemical liquid inlet through which the chemical liquid is introduced, the chemical liquid drainage pipe through which the chemical liquid is discharged, the chemical liquid plate which can flow into the chemical liquid drainage tube where the introduced chemical liquid is collected, and the exhaust port through which the vaporized chemical liquid is discharged And drug exhaust pipe

It is characterized in that formed as an integral structure of two or more multi-stacked form.

In particular, the chemical liquid plate is characterized in that the lower portion than the chemical liquid inlet and higher than the chemical liquid drainage tube, the portion in contact with the chemical liquid drainage tube is formed to be the lowest and toward the opposite direction.

In addition, at least one airflow preventing material is formed between the chemical liquid plate and the exhaust port.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 shows a cross-sectional structure of the single wafer cleaning device used in the liquid drainage cup of the multi-stage laminated structure mounted on the spin chuck 11, Figure 2 is a chemical liquid drainage cup of the single wafer cleaning apparatus according to the present invention The overall configuration of the apparatus in which the chemical liquid drainage pipe 25 and the chemical liquid drainage pipe 24 are connected and disposed, the wafer 17 is fixed by a spin chuck 11 capable of processing a single wafer 17, The chuck drive motor 13 is positioned below the spin chuck 11 so as to rotate the wafer 17, and an upper injection nozzle to flow chemical liquid or pure water to the upper and lower surfaces of the wafer 17. 14 and the lower injection nozzle 15 are spaced apart on the upper and lower surfaces of the wafer 17.

In addition, the chemical liquid drainage cup 12 is formed to be supported around the wafer 17 by the cup support 16 so that the chemical liquid or the pure water can be drained, and the chemical liquid or pure water may be introduced into the chemical liquid drainage cup 12. The chemical liquid inlet 21 is formed, and the chemical liquid inlet 21 on which the chemical liquid is drained into the chemical liquid inlet 21 on one side of the chemical liquid drain cup 12 and the chemical liquid inlet 21 on the other side of the chemical liquid drain cup 12. The chemical liquid exhaust pipe 25 through which the chemical liquid vaporized inward is exhausted is formed separately.

Then, between the chemical liquid inlet 21 and the chemical liquid exhaust pipe 25, the chemical liquid flows from the ceiling of the chemical liquid drainage cup 12 to the chemical liquid exhaust pipe 12 so as not to be immediately sucked into the chemical liquid exhaust pipe 25 by the strong exhaust pressure. Cup inner wall 12 is connected to, and the cup inner wall 12 is preferably formed to be inclined so as to prevent a phenomenon that the incoming chemical liquid bumps back to the wafer 17.

In addition, the portion contacted with the chemical liquid drainage tube 24 is formed in a slanted structure that is lower and becomes higher toward the other side so that the chemical liquid introduced into the chemical liquid plate 23 can be effectively collected into the chemical liquid drainage tube 24.

An exhaust port 26 having a constant height is formed between the chemical liquid plate 23 and the cup inner wall 22, and the chemical liquid plate 23 and the exhaust port 26 are irrespective of the position of the chemical liquid exhaust pipe 25. One or more airflow preventing materials 27 are formed so that even exhaust airflow is formed throughout the exhaust port 26.

In addition, an internal drain pan 31 and an external drain pan 32 are configured above and below the chuck driving motor 13 to drain the chemical liquid flowing into and out of the lower side of the wafer 17. A waste drainage tube 33 is formed below the outer drain pan 32 so that the chemical liquid flowing from the outside of the inner drain pan 31 and the wafer 17 is discharged to the outside, and the outer drain pan 32 is located on the side of the outer drain pan 32. The chemical liquid exhaust pipe 25 is connected to the vaporized chemical liquid to the outside.

Particularly, in the preferred embodiment of the present invention, each one of the chemical liquid drainage tube 24 and the chemical liquid drainage pipe 25 is illustrated, but two or more chemical liquid drainage pipes 24 and the exhaust pipe 25 are used according to the discharge amount and the displacement of the chemical liquid. Of course, Figure 2 also shows an exemplary chemical liquid circulation path using the chemical liquid drainage cup of the present invention.

That is, the chemical liquid of the buffer tank 42 supplied from the supply tank 41 is sent to the upper injection nozzle 14 above the wafer 17 by the pump 45 and spreads over the wafer 17 while constantly rotating. The wafer 17 flows from the center of the wafer 17 toward the outer side of the wafer 17, and the chemical liquid out of the wafer 17 surrounds the outside of the wafer 17. ) Enters the chemical liquid inlet 11 and flows through the inclined chemical liquid plate 23 to the chemical liquid drainage tube 24 to be collected in a recovery tank 43 connected to the chemical liquid drainage tube 24.

In addition, the chemical liquid cup of the present invention is formed in a structure capable of simultaneously cleaning both sides of the wafer 17, the majority of the chemical liquid injected by the lower injection nozzle 15 in the lower portion of the wafer 17 is outside the wafer 17 In the case of the chemical liquid which can be recovered by the chemical liquid draining cup 12 and which falls inside and outside the wafer 17, the internal drain pan 31, the external drain pan 32, and the waste drain tube 33 are separated. It is sent to the waste tank 44 through.

In addition, the chemical liquid collected in the recovery tank 43 is removed impurities through the filter 47 is sent to the supply tank 41 by the pump 45, the reused chemical liquid sent to the supply tank 41 is a buffer tank It is sent to 42 and reused through a circulation path, in which the temperature, concentration and storage amount are controlled by a control device (not shown) in the supply tank 41.

Meanwhile, in the preferred embodiment of the present invention, the chemical liquid drainage cup for semiconductor wafer cleaning is described as a reference, but the chemical liquid, pure water, etc. are sprayed onto a general flat substrate to be applied to all kinds of chemical liquid drainage cups. .

As described above, according to the liquid-liquid draining cup for single wafer semiconductor wafer cleaning according to the present invention, a plurality of chemical draining cups are formed as an integral structure of two or more multi-stage stacking shapes in the longitudinal direction, so that the continuous cleaning operation with chemical or pure water is performed. Chemical liquids or vaporized chemical liquids are discharged through the respective drainage pipes and the liquid liquid exhaust pipes located in separate liquid liquid draining cups according to the types of chemical liquids used, and mutual contamination can be prevented even when different chemical liquids are used. Through the gathering in each recovery tank, it is possible to reduce the contamination of the chemicals reused and to increase the reuse rate, thereby reducing the device maintenance cost in the semiconductor wafer manufacturing process.

Claims (3)

The chemical liquid inlet 21 into which the chemical liquid is introduced, the chemical liquid drainage tube 24 through which the chemical liquid is discharged, the chemical liquid plate 23 through which the introduced chemical liquid can flow into the chemical liquid drainage tube 24, and the vaporized chemical liquid is discharged. A chemical liquid drainage cup for cleaning single wafer semiconductor wafers, comprising an exhaust port 26 and a chemical liquid exhaust pipe 25 formed as an integral structure of two or more multi-stage stacking forms. The method according to claim 1, wherein the chemical liquid plate 23 is lower than the chemical inlet 21 and higher than the chemical liquid drainage tube 24, and the portion contacting the chemical liquid drainage tube 24 is the lowest and is formed to increase in the opposite direction. Chemical liquid drainage cup for single wafer semiconductor wafer cleaning. The chemical liquid drainage cup according to claim 1, wherein at least one airflow preventing material is formed between the chemical liquid plate (23) and the exhaust port (26).