JPH04177823A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To prevent the break or crack of a wafer by providing an image input part for detecting the edge chip of a wafer inside an application treatment cup, and finding out the edge chip before rotational application and stopping the wafer from rotating. CONSTITUTION:The wafer 1 is held by vacuum with a spin chuck 6, and a chemical is dropped on the wafer 1 in a cup, and the wafer 1 is spin-coated by a spin motor 7. Prior to this spin-coating, an image processor 3 detects the existence of the edge chip with the data inputted from an image input part 2, and sends the detection signal to an operation part 4, and further sends the data made in the operation part 4 to the CPU 5, and controls the operation of the processor not to spin-coat the wafer which has an edge chip. Hereby, the break or the cracks of the wafer can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and more particularly to a photoresist coating apparatus for semiconductor substrates (hereinafter referred to as wafers) and a developing apparatus after exposure.

[Conventional technology]

Conventionally, this type of semiconductor manufacturing equipment has not been equipped with a function to detect the presence or absence of edge chips (cracks or chips in the periphery of the wafer) on the wafer transferred onto the spin chuck. Instead, the wafer was vacuum-adsorbed onto a spin chuck, and a chemical solution was dropped onto it for spin coating.

[Problem to be solved by the invention]

The conventional semiconductor manufacturing apparatus described above has a problem in that when a wafer with edge chips is subjected to rotation processing, the wafer is likely to break or crack.

[Means to solve the problem]

The semiconductor manufacturing apparatus of the present invention includes an image input section for detecting edge chips of the wafer in the coating processing cup,
It has a function of detecting an edge chip based on a signal from an input section, sending this detection signal to a calculation section, sending data created by the calculation section to a CPU section, and controlling the device.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic diagram of an embodiment of the present invention. The wafer 1 is vacuum-adsorbed by a spin chuck 6, a chemical solution is dropped into a cup, and a spin coating process is performed by a spin motor 7. Before this spin coating process, the image processing section 3 detects the presence or absence of an edge chip using the data input from the image input section 2, sends a detection signal to the calculation section 4, and further sends the data created by the calculation section 4 to the CPU section 5. The operation of the processing equipment is controlled so that wafers with edge chips are not rotated.

〔Effect of the invention〕

As explained above, the present invention has the effect of preventing the wafer from rotating by detecting edge chips before the spin coating process, thereby preventing cracks and cracks in the wafer.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Wafer, 2... Image input section, 3... Image processing section, 4... Arithmetic section, 5. CPU section, 6... Spin chuck, 7... Spin motor.

Claims (1)

[Claims] In a semiconductor manufacturing apparatus that vacuum-chucks a semiconductor substrate, drips a chemical solution, and performs a spin coating process, a wafer image input unit installed in a processing cup, an image processing unit and a calculation unit installed outside the processing cup, A semiconductor manufacturing device comprising: a CPU section that controls the device using data from a calculation section.