JPS58222107A - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物Info
- Publication number
- JPS58222107A JPS58222107A JP10506482A JP10506482A JPS58222107A JP S58222107 A JPS58222107 A JP S58222107A JP 10506482 A JP10506482 A JP 10506482A JP 10506482 A JP10506482 A JP 10506482A JP S58222107 A JPS58222107 A JP S58222107A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cyanate
- epoxy resin
- epoxy
- masking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10506482A JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10506482A JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58222107A true JPS58222107A (ja) | 1983-12-23 |
| JPS6228970B2 JPS6228970B2 (enrdf_load_stackoverflow) | 1987-06-23 |
Family
ID=14397525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10506482A Granted JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58222107A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160021A (en) * | 1979-05-30 | 1980-12-12 | Mitsubishi Electric Corp | Thermosetting resin composition |
-
1982
- 1982-06-16 JP JP10506482A patent/JPS58222107A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160021A (en) * | 1979-05-30 | 1980-12-12 | Mitsubishi Electric Corp | Thermosetting resin composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6228970B2 (enrdf_load_stackoverflow) | 1987-06-23 |
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