JPS58215289A - ダイボンデイング用はんだ - Google Patents

ダイボンデイング用はんだ

Info

Publication number
JPS58215289A
JPS58215289A JP9876582A JP9876582A JPS58215289A JP S58215289 A JPS58215289 A JP S58215289A JP 9876582 A JP9876582 A JP 9876582A JP 9876582 A JP9876582 A JP 9876582A JP S58215289 A JPS58215289 A JP S58215289A
Authority
JP
Japan
Prior art keywords
solder
tin
composition
silver
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9876582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03158B2 (cg-RX-API-DMAC10.html
Inventor
Hiroyuki Baba
博之 馬場
Chikao Takebayashi
竹林　親男
Tetsuo Masuda
増田　哲夫
Osamu Kodan
小段　修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9876582A priority Critical patent/JPS58215289A/ja
Publication of JPS58215289A publication Critical patent/JPS58215289A/ja
Publication of JPH03158B2 publication Critical patent/JPH03158B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP9876582A 1982-06-09 1982-06-09 ダイボンデイング用はんだ Granted JPS58215289A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9876582A JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9876582A JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Publications (2)

Publication Number Publication Date
JPS58215289A true JPS58215289A (ja) 1983-12-14
JPH03158B2 JPH03158B2 (cg-RX-API-DMAC10.html) 1991-01-07

Family

ID=14228490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9876582A Granted JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Country Status (1)

Country Link
JP (1) JPS58215289A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2584861A1 (fr) * 1985-07-11 1987-01-16 Nat Semiconductor Corp Procede de fixation de pastilles semi-conductrices et produit resultant
JPS6272496A (ja) * 1985-09-26 1987-04-03 Matsuo Handa Kk はんだ合金
CN116038052A (zh) * 2022-12-07 2023-05-02 四川特锐祥科技股份有限公司 一种锡银铅铜高温锡膏及电子元器件芯片的焊接方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2584861A1 (fr) * 1985-07-11 1987-01-16 Nat Semiconductor Corp Procede de fixation de pastilles semi-conductrices et produit resultant
JPS6272496A (ja) * 1985-09-26 1987-04-03 Matsuo Handa Kk はんだ合金
CN116038052A (zh) * 2022-12-07 2023-05-02 四川特锐祥科技股份有限公司 一种锡银铅铜高温锡膏及电子元器件芯片的焊接方法

Also Published As

Publication number Publication date
JPH03158B2 (cg-RX-API-DMAC10.html) 1991-01-07

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