JPS58215057A - バンプ形成装置 - Google Patents

バンプ形成装置

Info

Publication number
JPS58215057A
JPS58215057A JP9767482A JP9767482A JPS58215057A JP S58215057 A JPS58215057 A JP S58215057A JP 9767482 A JP9767482 A JP 9767482A JP 9767482 A JP9767482 A JP 9767482A JP S58215057 A JPS58215057 A JP S58215057A
Authority
JP
Japan
Prior art keywords
bump
forming device
guide
wafer
bump forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9767482A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649733B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kenji Matsuura
松浦　憲二
Seiichi Ishii
清一 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9767482A priority Critical patent/JPS58215057A/ja
Publication of JPS58215057A publication Critical patent/JPS58215057A/ja
Publication of JPS649733B2 publication Critical patent/JPS649733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Bonding (AREA)
JP9767482A 1982-06-09 1982-06-09 バンプ形成装置 Granted JPS58215057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9767482A JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9767482A JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Publications (2)

Publication Number Publication Date
JPS58215057A true JPS58215057A (ja) 1983-12-14
JPS649733B2 JPS649733B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-02-20

Family

ID=14198559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9767482A Granted JPS58215057A (ja) 1982-06-09 1982-06-09 バンプ形成装置

Country Status (1)

Country Link
JP (1) JPS58215057A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5090119A (en) * 1987-12-08 1992-02-25 Matsushita Electric Industrial Co., Ltd. Method of forming an electrical contact bump
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure

Also Published As

Publication number Publication date
JPS649733B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-02-20

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