JPS58202758A - 研削装置 - Google Patents

研削装置

Info

Publication number
JPS58202758A
JPS58202758A JP57084823A JP8482382A JPS58202758A JP S58202758 A JPS58202758 A JP S58202758A JP 57084823 A JP57084823 A JP 57084823A JP 8482382 A JP8482382 A JP 8482382A JP S58202758 A JPS58202758 A JP S58202758A
Authority
JP
Japan
Prior art keywords
grindstone
abrasive material
wafer
rotary abrasive
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57084823A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6339378B2 (enExample
Inventor
Isamu Shimizu
勇 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57084823A priority Critical patent/JPS58202758A/ja
Publication of JPS58202758A publication Critical patent/JPS58202758A/ja
Publication of JPS6339378B2 publication Critical patent/JPS6339378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP57084823A 1982-05-21 1982-05-21 研削装置 Granted JPS58202758A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57084823A JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57084823A JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Publications (2)

Publication Number Publication Date
JPS58202758A true JPS58202758A (ja) 1983-11-26
JPS6339378B2 JPS6339378B2 (enExample) 1988-08-04

Family

ID=13841466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084823A Granted JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Country Status (1)

Country Link
JP (1) JPS58202758A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793102A (en) * 1986-10-13 1988-12-27 Bbc Brown Boveri Ag Method of producing a beveled peripheral profile on a semiconductor disc
CN112589572A (zh) * 2020-12-10 2021-04-02 金利 一种高跟鞋鞋跟加工处理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501112U (enExample) * 1972-02-14 1975-01-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501112U (enExample) * 1972-02-14 1975-01-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793102A (en) * 1986-10-13 1988-12-27 Bbc Brown Boveri Ag Method of producing a beveled peripheral profile on a semiconductor disc
CN112589572A (zh) * 2020-12-10 2021-04-02 金利 一种高跟鞋鞋跟加工处理装置

Also Published As

Publication number Publication date
JPS6339378B2 (enExample) 1988-08-04

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