JPS6339378B2 - - Google Patents

Info

Publication number
JPS6339378B2
JPS6339378B2 JP57084823A JP8482382A JPS6339378B2 JP S6339378 B2 JPS6339378 B2 JP S6339378B2 JP 57084823 A JP57084823 A JP 57084823A JP 8482382 A JP8482382 A JP 8482382A JP S6339378 B2 JPS6339378 B2 JP S6339378B2
Authority
JP
Japan
Prior art keywords
silicon wafer
spline shaft
workpiece
grinding
support stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57084823A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58202758A (ja
Inventor
Isamu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57084823A priority Critical patent/JPS58202758A/ja
Publication of JPS58202758A publication Critical patent/JPS58202758A/ja
Publication of JPS6339378B2 publication Critical patent/JPS6339378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P90/128
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H10P52/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP57084823A 1982-05-21 1982-05-21 研削装置 Granted JPS58202758A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57084823A JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57084823A JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Publications (2)

Publication Number Publication Date
JPS58202758A JPS58202758A (ja) 1983-11-26
JPS6339378B2 true JPS6339378B2 (enExample) 1988-08-04

Family

ID=13841466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084823A Granted JPS58202758A (ja) 1982-05-21 1982-05-21 研削装置

Country Status (1)

Country Link
JP (1) JPS58202758A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH671116A5 (enExample) * 1986-10-13 1989-07-31 Bbc Brown Boveri & Cie
CN112589572A (zh) * 2020-12-10 2021-04-02 金利 一种高跟鞋鞋跟加工处理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501112U (enExample) * 1972-02-14 1975-01-08

Also Published As

Publication number Publication date
JPS58202758A (ja) 1983-11-26

Similar Documents

Publication Publication Date Title
KR102507675B1 (ko) 웨이퍼의 가공 방법
JPH0516070A (ja) ダイヤモンド研削砥石と、これのツルーイング法と、ツルーイング装置と、研削仕上げされた磁気ヘツド
JPH09103954A (ja) ポリシング装置
JP2008084976A (ja) ウエーハの研削加工方法
WO1999067054A1 (en) Wafer edge polishing method and apparatus
JP7413103B2 (ja) ウェーハの研削方法
CN110634737B (zh) 磨削磨具的修锐方法和修锐用晶片
JPS6339378B2 (enExample)
JPH11347953A (ja) ウェーハ面取り砥石
JPS62264858A (ja) 平面研削方法
JPS61146471A (ja) ドレツシング装置
JPH08336741A (ja) 表面研削方法
JP2008130808A (ja) 研削加工方法
JP3261897B2 (ja) ホーニングヘッドの成形加工方法及び成形加工装置
JP2613081B2 (ja) ウエハ外周部の鏡面研磨方法
JPH06328361A (ja) 研削盤における砥石磨耗補正装置
JPS62213954A (ja) 硬脆材の外周面研削方法およびその装置
JPS59232758A (ja) 球面加工装置
JPH11347901A (ja) ツルーイング工具及びツルーイング工具付きウェーハ面取り装置
JPH0531669A (ja) 研削装置
JP7736533B2 (ja) 硬質ウェーハの研削方法
JPH0740209A (ja) 心なし研削盤の円筒状ワークの研削方法及びワーク保持装置
JPH02185359A (ja) 研削方法及びその装置
JPH04201178A (ja) ポリッシング装置とそのポリッシング方法
JPH0637026B2 (ja) 半導体素子の周面加工装置