JPS58197290A - 部分メツキ装置におけるフレ−ム支承部材 - Google Patents
部分メツキ装置におけるフレ−ム支承部材Info
- Publication number
- JPS58197290A JPS58197290A JP7953582A JP7953582A JPS58197290A JP S58197290 A JPS58197290 A JP S58197290A JP 7953582 A JP7953582 A JP 7953582A JP 7953582 A JP7953582 A JP 7953582A JP S58197290 A JPS58197290 A JP S58197290A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plate
- support member
- frame
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 96
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000000059 patterning Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7953582A JPS58197290A (ja) | 1982-05-11 | 1982-05-11 | 部分メツキ装置におけるフレ−ム支承部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7953582A JPS58197290A (ja) | 1982-05-11 | 1982-05-11 | 部分メツキ装置におけるフレ−ム支承部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58197290A true JPS58197290A (ja) | 1983-11-16 |
| JPS6114233B2 JPS6114233B2 (enrdf_load_stackoverflow) | 1986-04-17 |
Family
ID=13692684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7953582A Granted JPS58197290A (ja) | 1982-05-11 | 1982-05-11 | 部分メツキ装置におけるフレ−ム支承部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58197290A (enrdf_load_stackoverflow) |
-
1982
- 1982-05-11 JP JP7953582A patent/JPS58197290A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6114233B2 (enrdf_load_stackoverflow) | 1986-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4287029A (en) | Plating process | |
| TW404156B (en) | Process for selective application of solder to circuit packages | |
| US6669833B2 (en) | Process and apparatus for electroplating microscopic features uniformly across a large substrate | |
| JPS63192894A (ja) | プレート状加工物用電気めつき装置 | |
| JPS58197290A (ja) | 部分メツキ装置におけるフレ−ム支承部材 | |
| US4376683A (en) | Method and device for the partial galvanization of surfaces which are conducting or have been made conducting | |
| JPS5827993A (ja) | 微小部分メツキ方法及びその装置 | |
| JP4156086B2 (ja) | 電着処理装置 | |
| JPH05209298A (ja) | プリント配線板用電気めっき装置 | |
| US6017438A (en) | Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor | |
| JPS5855590A (ja) | 部分メツキ装置における受部材 | |
| DE10258094B4 (de) | Verfahren zur Ausbildung von 3-D Strukturen auf Wafern | |
| JPH0248433Y2 (enrdf_load_stackoverflow) | ||
| JPS596918B2 (ja) | 部分メッキ装置 | |
| US4409071A (en) | Masking for selective electroplating jet method | |
| JP2570489B2 (ja) | 噴流式めっき装置 | |
| JPH07211723A (ja) | 半導体装置の製造方法 | |
| JP2007023345A (ja) | 半導体ウエハのめっき装置 | |
| JPS61270889A (ja) | めつき装置 | |
| JP3275487B2 (ja) | めっき装置およびめっき方法 | |
| KR100313685B1 (ko) | 분사류충돌판제작방법 | |
| EP0055316B1 (en) | A plating apparatus | |
| JP3221519B2 (ja) | めっき装置 | |
| JPH02205696A (ja) | 半導体ウエハのめっき装置 | |
| JPH10172974A (ja) | 半導体ウエハのめっき方法及びその装置 |