JPS58195443U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58195443U JPS58195443U JP9502582U JP9502582U JPS58195443U JP S58195443 U JPS58195443 U JP S58195443U JP 9502582 U JP9502582 U JP 9502582U JP 9502582 U JP9502582 U JP 9502582U JP S58195443 U JPS58195443 U JP S58195443U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor
- package
- semiconductor device
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置を示す斜視図、第２図は第１
図の側面図、第３図はこの考案に係る半導体装置の一実
施例を示す側面図である。
図において、各図中同一部分もしくは相当部分には同一
符号もしくは同一符号にダッシュを付しており、図にお
いて、１′はパッケージ、１０１ ′は側面、２は
リード、３は蓋である。Figure 1 is a perspective view of a conventional semiconductor device, and Figure 2 is a perspective view of a conventional semiconductor device.
FIG. 3 is a side view showing an embodiment of the semiconductor device according to the invention. In the figures, the same parts or equivalent parts in each figure are denoted by the same reference numerals or dashes. In the figures, 1' is a package, 101' is a side surface, 2 is a lead, and 3 is a lid.
Claims (2)
ケージ、及び前記半導体に接続され末広がりになるよう
前記パッケージの側面に沿って設けられたリードを備え
た半導体装置。(1) A semiconductor device comprising a package enclosing a semiconductor and having a tapered side surface, and a lead connected to the semiconductor and provided along the side surface of the package so as to widen toward the end.
求の範囲第（１）項記載の半導体装置。(2) The semiconductor device according to claim (1), wherein the package is made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9502582U JPS58195443U (en) | 1982-06-22 | 1982-06-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9502582U JPS58195443U (en) | 1982-06-22 | 1982-06-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58195443U true JPS58195443U (en) | 1983-12-26 |
Family
ID=30227139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9502582U Pending JPS58195443U (en) | 1982-06-22 | 1982-06-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195443U (en) |
-
1982
- 1982-06-22 JP JP9502582U patent/JPS58195443U/en active Pending
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