JPS58195439U - Speculum setting jig for polished wafers - Google Patents
Speculum setting jig for polished wafersInfo
- Publication number
- JPS58195439U JPS58195439U JP9356982U JP9356982U JPS58195439U JP S58195439 U JPS58195439 U JP S58195439U JP 9356982 U JP9356982 U JP 9356982U JP 9356982 U JP9356982 U JP 9356982U JP S58195439 U JPS58195439 U JP S58195439U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- jig
- polished wafers
- area
- speculum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Microscoopes, Condenser (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のセット方法を示す断面図、第２図は本考
案の一例を示す断面図、第３図は本考案の一例を示す平
面図、第４図は呆考案の一例を示す平面図である。
１：被検査ウェハー、２，３：受は治具、５，５′ ：
ウエハー受は部。Fig. 1 is a cross-sectional view showing a conventional setting method, Fig. 2 is a cross-sectional view showing an example of the present invention, Fig. 3 is a plan view showing an example of the present invention, and Fig. 4 is a plan view showing an example of the dumb device. It is a diagram. 1: Wafer to be inspected, 2, 3: Holder is jig, 5, 5':
The wafer receiver is the part.
Claims (1)
ーの外形よりも小なる内縁部とから形成されるウェハー
外周部は部を設けたことを特徴とする研磨ウェハーの検
鏡セット治具。 ２ 実用新案登録請求の範囲第１項記載のセット治具に
おいて、上記受は部が、ウェハー面積の３０％以下の面
積に相当する外周部の全周面を支承する如く構成したこ
とを特徴と子る研磨ウェハーの検鏡セット治具。 ３ 実用新案登録請求の範囲第１項記載のセット治具に
おいて、上記受は部が、ウェハー面積の３０％以下の面
積に相当する外周面部分のうちの数ケ所のみで受ける如
く構成しであることを特徴とする研磨ウェハーの検鏡セ
ット治具。 ４ 実用新案登録請求の範囲第２項、または第３項記載
の治具において、上記受は部がウェハーの厚さより小さ
い深さ位置にあることを特徴とする研磨ウェハーの検鏡
セット治具。[Claims for Utility Model Registration] 1. A polished wafer characterized in that the wafer outer periphery is formed by a wafer outer periphery having an outer diameter larger than the wafer outer diameter and an inner edge smaller than the wafer outer diameter. speculum set jig. 2. The setting jig according to claim 1 of the utility model registration claim, characterized in that the receiving part is configured to support the entire circumferential surface of the outer peripheral part corresponding to an area of 30% or less of the wafer area. Microscope set jig for polished wafers. 3. In the setting jig described in claim 1 of the utility model registration claim, the receiving portion is configured to be received at only a few locations on the outer peripheral surface portion corresponding to an area of 30% or less of the wafer area. A speculum set jig for polished wafers. 4. A speculum set jig for polished wafers, wherein the jig according to claim 2 or 3, wherein the receiver is located at a depth smaller than the thickness of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9356982U JPS58195439U (en) | 1982-06-22 | 1982-06-22 | Speculum setting jig for polished wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9356982U JPS58195439U (en) | 1982-06-22 | 1982-06-22 | Speculum setting jig for polished wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58195439U true JPS58195439U (en) | 1983-12-26 |
Family
ID=30224461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9356982U Pending JPS58195439U (en) | 1982-06-22 | 1982-06-22 | Speculum setting jig for polished wafers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195439U (en) |
-
1982
- 1982-06-22 JP JP9356982U patent/JPS58195439U/en active Pending
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