JPS58194240A - イオン注入装置のタ−ゲツト冷却装置 - Google Patents
イオン注入装置のタ−ゲツト冷却装置Info
- Publication number
- JPS58194240A JPS58194240A JP57078714A JP7871482A JPS58194240A JP S58194240 A JPS58194240 A JP S58194240A JP 57078714 A JP57078714 A JP 57078714A JP 7871482 A JP7871482 A JP 7871482A JP S58194240 A JPS58194240 A JP S58194240A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- disk
- passage
- target
- ion implantation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 63
- 238000005468 ion implantation Methods 0.000 title claims description 27
- 239000002826 coolant Substances 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000002513 implantation Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 29
- 150000002500 ions Chemical class 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 241000257465 Echinoidea Species 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 241001062872 Cleyera japonica Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57078714A JPS58194240A (ja) | 1982-05-10 | 1982-05-10 | イオン注入装置のタ−ゲツト冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57078714A JPS58194240A (ja) | 1982-05-10 | 1982-05-10 | イオン注入装置のタ−ゲツト冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58194240A true JPS58194240A (ja) | 1983-11-12 |
JPS6322409B2 JPS6322409B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-11 |
Family
ID=13669534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57078714A Granted JPS58194240A (ja) | 1982-05-10 | 1982-05-10 | イオン注入装置のタ−ゲツト冷却装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58194240A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003036679A3 (en) * | 2001-10-25 | 2004-02-26 | Axcelis Tech Inc | Wafer pedestal tilt mechanism and cooling system |
WO2008067213A3 (en) * | 2006-11-27 | 2008-09-12 | Varian Semiconductor Equipment | Techniques for low temperature ion implantation |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50109596A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-02-06 | 1975-08-28 | ||
JPS56145642A (en) * | 1980-04-11 | 1981-11-12 | Hitachi Ltd | Reciprocal mechanism for intra-vacuum chamber body of revolution |
-
1982
- 1982-05-10 JP JP57078714A patent/JPS58194240A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50109596A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-02-06 | 1975-08-28 | ||
JPS56145642A (en) * | 1980-04-11 | 1981-11-12 | Hitachi Ltd | Reciprocal mechanism for intra-vacuum chamber body of revolution |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003036679A3 (en) * | 2001-10-25 | 2004-02-26 | Axcelis Tech Inc | Wafer pedestal tilt mechanism and cooling system |
WO2008067213A3 (en) * | 2006-11-27 | 2008-09-12 | Varian Semiconductor Equipment | Techniques for low temperature ion implantation |
US7528392B2 (en) | 2006-11-27 | 2009-05-05 | Varian Semiconductor Equipment Associates, Inc. | Techniques for low-temperature ion implantation |
CN101563751B (zh) | 2006-11-27 | 2011-11-02 | 瓦里安半导体设备公司 | 低温离子植入技术 |
Also Published As
Publication number | Publication date |
---|---|
JPS6322409B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-11 |
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