JPS58194240A - Target cooling device for ion implanting device - Google Patents

Abstract

PURPOSE:To cool a target ever so effectively, by making up a cooling passage inside a disk being free of rotation and movement, while cooling an ion implanting target in the disk's installing part through a medium that travels in the cooling passage. CONSTITUTION:A target chamber 9 is installed in front of the main body 7 of an ion implanting device while an implantation chamber is installed inside the target chamber 9 as well. A circular disk 33 is supported at the upside of a shaft 29 and rotated and rextilinearly moved by dint of motors 21 and 22. Each installing part 34 for plural ion implanting targets is formed up at regular intervals on the peripheral part of the disk 33 and thereby each ion implanting target 36 is installed in the installing part 34 rspectively. In addition, a cooling passage 37 is made up along the inner part of a paired groove 35 inside the installing part 34 and a cooling outward passage 38 and a cooling inward passage 39 are interconnected to this cooling passage 37. Each of these passages 38 and 39 is interconnected to an outward passage 31 and an inward passage 32 of the shaft 29 whereby a cooling medium is well circulated through. Doing like this, not only the target 36 is effectively cooled but a highly energetic ion can be implanted.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a target cooling device for an ion implanter, in which a cooling passage is formed inside a rotatable and movable disk, and a medium moving through the cooling passage is used to cool the mounting portion of the disk. The ion implantation target is cooled, the target is effectively cooled, ions can be implanted with a large current and high energy beam, and high quality devices can be obtained.

In general, two high current ion implanters use a mechanical scanning force method that injects a high current ion beam in the form of a spot, and implants ions by rotating and linearly moving a disk equipped with multiple ion implantation targets. 'There is. As a result, there is no need to scan the large current ion beam itself, so many electromagnets for applying magnetic fields are completely unnecessary, and the device can be made smaller and lighter. By the way, in this type of ion implanter, each target receives a large amount of thermal energy due to ion implantation, so it is necessary to cool each target effectively, but it is not easy to cool targets on a mechanically scanned disk. .

Therefore, in the target cooling device of the conventional ion implanter, as shown in FIGS.
) A disk-shaped disk (3) is supported on a shaft (2) which is also linearly moved by a moving mechanism (not shown), and a plurality of copper blocks are mounted on the outer periphery of the disk (3). Heat sinks (4) made up of It is held in pressure contact with the heat sink (4) by a leaf spring (6). The thermal energy received by each wafer (5 wins) due to ion implantation is released to the corresponding heat sink (4), and each sea urchin (5) is cooled by an inertial cooling force method.

However, according to the conventional target cooling device, the disk (3) and earth heat sink (4) can only cool according to the volume of the disk (3), and the cooling capacity is extremely low. Implantation has the disadvantage that the wafer (5) cannot be effectively cooled and high-quality devices cannot be obtained, and this type of ion implantation apparatus has the disadvantage that the power that can be implanted is limited. Since each wafer (5) on the disk (3) is held by a leaf spring (6) on the heat tank (4), the wafer (5) cannot be automatically loaded onto the disk (3). If there is a wafer (
If the wafer (5) is simply placed on the heat sink (4) to enable its automatic loading, the problem arises that the contact between the wafer (5) and the heat sink (4) is insufficient, resulting in poor cooling performance.

This invention was made with the above points in mind,
forming a plurality of mounting portions for ion implantation targets around a rotatable and movable disk glue; forming a cooling passageway connecting the central axis of the disk and each of the mounting portions within the disk; The target cooling device for the ion implantation apparatus is characterized in that the targets in each of the mounting portions are cooled by a medium moving through the cooling passage.

Therefore, each target attached to the plurality of attachment parts of the disk is cooled by the medium moving through the cooling passage, so even though each target receives a large amount of thermal energy due to ion implantation, its temperature increases. is held low.

In addition to making it possible to process the target at a low temperature and obtaining high-quality devices, it also makes it possible to implement ion implantation using a high-current, high-energy beam, and to perform ion implantation in a short time.

Next, this invention will be explained in detail with reference to FIG. 3 and the following drawings showing one embodiment thereof.

In these drawings, (7) is the casing-like device of a large current ion implantation device, and has a high voltage section inside.

Equipped with vacuum pump etc. (8) is the device body (7
01 is formed inside the right side of the target chamber (9). This is an ion implantation chamber that is constantly maintained in a high vacuum, and is connected to the beam line of the ion beam from the high pressure section via the ion injection port (11). uz is a chamber main body formed in a substantially cylindrical shape with an opening on the front side on the left side of the target chamber (9), and a vacuum exhaust port u3 communicating with a vacuum pump on the rear side.
is playing a role. (141 is a circular chamber lid provided on the front side of the chamber main body az via a hinge (15) so that it can be opened and closed back and forth, and the end station (8
) Cylinders such as air cylinders and hydraulic cylinders (161) installed on the top are opened and closed, and when the chamber lid (141) is opened, it is held almost horizontally by the holder (17). (181 is the chamber body (121) and the chamber lid opening Φ, the wing 0 is a passageway with a long and narrow cross section that communicates the ion implantation chamber QQ and the chamber chamber (18), and (20) opens and closes the passageway (19) by rotational movement. The pulp has a semicircular cross section.

c21) and @ are a rotation motor and a movement stepping motor supported on the outer surface of the chamber lid Q41 and having respective rotating shafts introduced inside the chamber lid Q41, and constitute a disk drive mechanism to be described later.

(231 and (to) are a rotation drive shaft and a movement drive shaft provided in the left and right directions on the inside of the chamber lid l and rotated by the rotation motor 1211 and the stepping motor, respectively.) are inside the chamber lid (141). This is a moving body supported movably in the left and right force directions by a pair of guide rails (for example, nuclear force guide rails (supports) j) installed in the left and right force directions. As shown in FIG.
The rotation of causes the moving body (to) to move linearly left and right. (
Company) is rotatably installed inside the moving body ■ and has a rotational drive shaft C23.
The screw wheel, ρ9), which is rotated by the drive shaft (c) as soon as + is inserted, is a shaft that is rotatably supported by the moving body (to) and becomes the central axis of the disk, which will be described later. A gear □□□ that meshes with the screw wheel 128) is integrally provided, and the shaft I29) is rotated by the rotation of the rotary drive shaft 128). g31+ and (3) are the outward and return paths for the cooling medium formed in the axial direction inside the shaft.

1; 13) is a disk-shaped disk supported at the upper end of the shaft, and is rotated and linearly moved by a rotation motor Qυ and a stepping motor (〃). It is a mounting part for a plurality of ion implantation targets formed at equal intervals, and each has a pair of grooves cut out by external forces, which serve as belt insertion holes of a handling device described later. 13 refers to each attachment part (34) of the disk (33), a circular wafer 1 that serves as an ion implantation target attached to the soil, and Jun refers to each attachment part (34).
Pairs of grooves (cooling passages formed in a meandering shape inside the disk (351), respectively, 1381 and (39) are formed radially inside the disk (33) and cooling passages (one end of the three and a cooling return passage communicating with the other end, and the cooling passage (38) is connected to the shaft 12.
9), the cooling return passage (39) is connected to the return passage (34).
The cooling medium such as water supplied to the outgoing path t31 of the shaft rotation flows into each cooling path (37) through each cooling outgoing path (381), and After the Ueno-136 is cooled, it passes through each cooling return path (39) and is returned to the return path of the axis I29). (4
0) is a horseshoe-shaped holder that presses the sea urchin...-t, W) on each mounting part (goods) to the corresponding mounting part (34), and the base of the holder (40) has a disk +33) passing through it. A pin (4I) is provided, and a spring (44) is interposed between the end of the pin (141) and the lower surface of the disk (bleached), and the spring force of this spring (42) holds the wafers one space apart. Ru.

(It is a moving point rotary joint composed of a shaft body (44) that is integrated at the lower end of the shaft body and a cylinder that is airtightly and rotatably provided on its outer periphery. )
Three annular grooves with a semicircular cross section that match each other are formed on the outer circumferential surface of the cylinder and the inner circumferential surface of the cylindrical body (46G).
) are formed, and double-topped passages (461)), (46
0) is connected to the outgoing path 1) and the return path (321). (4η is the shaft body (48) and the shaft body +48). It is a midpoint rotary joint constructed by the following, and three annular passages (5oa), (5ob), (5oc) are formed between the shaft body and the cylindrical body (49) in the same way as above. and three passages (51a), (51
b).

(51C) are annular passages (50a) and (50b), respectively.
, (500). (52) is the shaft body (53
) and a cylindrical body (54) airtightly and rotatably provided on the outer periphery of the shaft Ill (58).
) is a fixed point rotary joint supported on the inner surface of the chamber lid (141), and the shaft body (53) and the cylinder body (
54) and three annular passages (56a,).

(56b), (56C) are formed, and three passages (57a), (57b), (57c) in the shaft (53) communicate with the annular passages (56a), (561)), (560), respectively. has been done. (58a), (58b), (580)
are the respective cylinders of the moving point rotary joint (43) and the intermediate point rotary joint [45], +49+
An annular passage (46a) connects the two.

(46b), (460) and annular passages (50a), (50
b), a vacuum exhaust pipe, an outgoing cooling pipe, and a far cooling pipe that communicate with (500), respectively.

(59a), (59b), and (590) are passages (5 ha) connecting the shafts t48) and (53) of the intermediate point rotary joint and the fixed point rotary joint (52);
(5xb), (51c) and passage (+7a), (57b)
, (57c), and an evacuation pipe and an outgoing cooling pipe that communicate with each other.

The far side cooling pipes (60a), (60b), (600) are connected to the cylindrical body (54) of the fixed point rotary joint (52) and are connected to the annular passages (56a), (56), respectively.
b), (56c) are connected to the main evacuation pipe, the cooling medium supply pipe 2 and the recovery pipe, which are each led out from the chamber lid σ gradient, and when the main evacuation pipe (60a) is connected to the vacuum pump, ° Supply pipe (60b), recovery pipe (60
0) is connected to the heat exchanger and circulation pump. (
61) is each rotary join H431° (4η, (
This is an O-ring seal for the movable parts such as 52), and prevents water leakage in the movable parts.

(62) is a wafer (viewing)/handling device installed on the end station (8), and its operation table (
63) is supported so as to be movable back and forth and up and down, and a pair of bells (64) which can be freely inserted into the grooves and 351 of the disk (33) for mounting the disk (33) are provided at the tip of the operation table (63), and the operation Ueno-carrier (
65) is installed, and this type of handling equipment (
62) are provided, one for collection and one for attachment. When retrieving or attaching Ueno-3 (support), the holder (40) of the attachment part (34) of the disk (33) is controlled by the operating table (63) to resist the spring force of its spring (tilt). The wafer (36) is floated to facilitate movement of the wafer (36).

Next, the operation of the embodiment will be explained.

First, unimplanted wafers are mounted on each mounting portion 134) of the disk (33), and as shown in FIG.
j8). Then, the chamber chamber aε is evacuated through its vacuum exhaust port (13), and the ion implantation chamber (
After evacuating to a high vacuum equivalent to 1, the valve 120]
is rotated to communicate the chamber volume and the ion injection chamber Oq via a passage (1 spring).Next, the 1 rotation motor c
71) is driven, rotation drive shaft rotation), screw wheel color, gear (3
As the disk +33) is rotated via the shaft (b) and the disk (b), a cooling medium circulation pump (not shown) is driven, and the cooling medium is circulated through each cooling path 137) of the disk (33).

That is, the cooling medium from the cooling medium supply pipe (60b) flows through the annular passage (56) of the fixed point rotary joint (52).
11)・Passage (57b) of shaft body (53)・Outgoing cooling pipe (
59b) ・Intermediate point rotary joint) (471 shaft body (state passage (511)) ・Annular passage (50b) ・Outward 1411 cooling pipe (58b) ・Moving point rotary joint (431 annular passage (46b) - It flows into the cooling passage (37) of each mounting part c34) through the outgoing path (passing through the 3rd column, each cooling column passage 138) of the shaft (29), and the cooling passage (37) of the mounting part (34)
After cooling the wafer (36) on the wafer (36), the wafer (36) on the wafer (36) is returned to the return path of the spindle (2) via each cooling return path (39). Furthermore, the return path (the connecting cooling medium is annular passage (460), far side cooling pipe (580), annular passage (500), passage (51C)
・Far side cooling pipe (590) ・Passage (57G) ・Annular passage (
56e) and is returned to the heat exchanger via the cooling medium recovery pipe (600). Here, each rotary joint (52) is sealed with an O-ring seal (61) to prevent water leakage at its movable part, but in the unlikely event that the O-ring seal (61) Even if water leaks, the leakage water is sucked out from each annular passage (46a), (50a), (56a) by being evacuated from the main evacuation pipe (60a).

Water leakage into the vacuum chamber α8) is reliably prevented.

Next, the moving stepping motor (2) is driven.

A moving body (26) within the moving drive shaft and through the female fin.
is moved to the right by the guide (25), and the disk (33), which is rotating once, is moved linearly to the right. At this time, the moving point rotary joint (43) moves with the movement of the shaft (29), but each rotary joint +431.
(47], (52), shaft body (44), +4
8), (m and cylinder (Ki, 149), (54
) Since each rotary joint (g), (4η, (52)) is rotated airtightly, the middle point rotary joint (koshi) is fixed point rotary joint (52) Rotate and move relative to
There is no problem with the circulation of the cooling medium. Furthermore, the disk (33
) moves to the right, the disc (33) moves to the passage (19
) and into the ion implantation chamber 4.
As shown in the figure, when about half of the disk (33) is introduced into the ion implantation chamber, both motors 121+
.

(22), the disk (83) is finely moved from side to side while rotating at high speed, and the ion injection port 111 is moved in the form of a spot.
) into the ion implantation chamber, ions are implanted into each wafer space on the disk 133).
The thermal energy received by 3G) is recovered by the circulation of the cooling medium into disk 133), and each Ueno-136 is subjected to low temperature treatment.

Next, when the aforementioned ion implantation is completed, the stepping motor 122 moves the disk (33) into the chamber (
18], the pulp case is closed, and the chamber chamber (
181 is returned to atmospheric pressure. And champal lid (1
41 is rotated forward to hold the disk (33) horizontally, the disk (33) is articulately rotated by the rotation motor (21), and the above-mentioned handling device (62) handles the implanted wafer ( Collection of wafers and unimplanted wafers 1
36. is installed.

Therefore, according to the embodiment, the cooling column passage 138) and the cooling return passage (39) are formed in the disk l33) that performs mechanical scanning, and the cooling medium supplied inside the shaft is transferred to each mounting portion (34). Since it can circulate through the cooling path (37) of the mounting part (34), it can effectively cool the sea urchins (36) and remove the thermal energy received by the wafer (361).Moreover, the wafer 136 can Because it is tightly attached to the mounting part (3 candle surface) by the holder) 40),
Its cooling capacity is extremely high, making it possible to obtain high-quality devices.This also makes it possible to implement ion implantation using a large current and high energy beam, which allows ion implantation to be completed in a short time. It is possible to take advantage of the characteristics of Furthermore, the disk (size axis CI!9)
The cooling medium is supplied to the 3 rotary joints) 1
431, (4η, (52)), it is easy to supply the cooling medium to the moving disk.
Moreover, each rotary joint +431. +471.
(52) an annular passageway (46a) of vacuum extraction;
Since (50a) and (56a) are provided, water leakage can be reliably prevented and it is safe.

In addition, since the handling device (62) for collecting and mounting the wafer 1S is provided with a pair of grooves (bells (64) that can be freely inserted into the mounting section 134), the holder (40) can be inserted into the mounting section (34). The wafer +3 (E) can be transported from the belt (64) K by lifting the belt (64) K, and the collection and mounting of the wafer [361] can be automated, thereby saving labor and increasing throughput. It is.

In addition, in the above embodiment, each mounting portion of the disk 133)
Although the cooling paths 6'7) of 34) are connected in parallel, they may be connected in series or in series-parallel.

Further, in the above embodiment, the disk (Ueno-136) was cooled by circulating a cooling medium such as water within the park, but the present invention is not limited to this.
'134) are formed in a radial manner, a heat pipe is embedded in each of the cooling passages, the evaporating part of the heat pipe is arranged in the mounting part (34), and the condensing part of the heat pipe is introduced into the shaft. The heat of the wafer (36) may be collected in the shaft via a heat pipe, and the heat of the roaring heat pipe may be transferred to the circulating cooling medium through the shaft, thereby effectively cooling the wafer.

[Brief explanation of drawings]

1 and 2 show a target cooling device of a conventional ion implanter, FIG. 1 is a front view, FIG. 2 is a partial plan view, and FIG. 3 is an overall side view, FIGS. 4 and 5 are a front view and cutaway plan view of a portion of the target chamber, and FIG. 6 is an expanded view of the main part of the disk cooling system. The sectional view, FIG. 7, is a plan view of a portion of the disk.・ (2g)...Axis, (Sakaki...Disc, 13 Shu...
Mounting part, +36. i...Wafer, 13)...Cooling path,...Cooling column passage, +39)...Cooling return path. Agent Patent Attorney Keita Fujita

Claims (1)

[Claims] ■ A plurality of attachment parts for ion implantation targets are formed on the outer periphery of a rotatable and movable disk. Ion implantation characterized in that a cooling passage connecting the central axis of the disk and each of the mounting parts is formed inside the disk, and a target in each of the mounting parts is cooled by a medium moving in the cooling passage. Equipment target cooling device. (8) The cooling passage for the disk is constituted by an outgoing path to each mounting part and a return path from each mounting part, and a cooling medium is circulated in the outgoing path and the return path. A target cooling device for the ion implantation device described in 2. ■ A plurality of cooling passages for the disk are formed in a radial pattern, and a heat pipe having an evaporation part arranged in the mounting part is embedded in each of the cooling passages, so that the central axis of the disk can absorb the heat of the heat pipe. 2. A target cooling device for an ion implantation apparatus according to claim 1, wherein the target cooling device is configured to transmit the temperature to a circulating cooling medium.