JPS58184849U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58184849U JPS58184849U JP8111482U JP8111482U JPS58184849U JP S58184849 U JPS58184849 U JP S58184849U JP 8111482 U JP8111482 U JP 8111482U JP 8111482 U JP8111482 U JP 8111482U JP S58184849 U JPS58184849 U JP S58184849U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor equipment
- bent
- main surface
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置を示し、ａは側面図、ｂは裏
面平面図であり、第２図は本考案の一実施例による半導
体装置を示し、ａは側面図、ｂは裏面平面図を示す。
１．１′・・・・・・封止樹脂、２，２′・・・・・・
リード。FIG. 1 shows a conventional semiconductor device, in which a is a side view and b is a back plan view, and FIG. 2 is a semiconductor device according to an embodiment of the present invention, a is a side view and b is a back plan view. shows. 1.1'...Sealing resin, 2,2'...
Lead.
Claims (1)
ドは途中で折り曲げられて各リードの先端近傍部分が前
記封止容器の前記−主面とほぼ平行になっており、かつ
奇数番１のリードと偶数番目のリードとがそれぞれ反対
向に折り曲げられていることを特徴とすや半導体装置。A plurality of leads are led out from one main surface of the sealed container, and each lead is bent in the middle so that a portion near the tip of each lead is almost parallel to the main surface of the sealed container, and an odd numbered A semiconductor device characterized in that a first lead and even-numbered leads are bent in opposite directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8111482U JPS58184849U (en) | 1982-06-01 | 1982-06-01 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8111482U JPS58184849U (en) | 1982-06-01 | 1982-06-01 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58184849U true JPS58184849U (en) | 1983-12-08 |
Family
ID=30090242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8111482U Pending JPS58184849U (en) | 1982-06-01 | 1982-06-01 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6379361A (en) * | 1986-09-24 | 1988-04-09 | Hitachi Vlsi Eng Corp | Upright installation type semiconductor device |
-
1982
- 1982-06-01 JP JP8111482U patent/JPS58184849U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6379361A (en) * | 1986-09-24 | 1988-04-09 | Hitachi Vlsi Eng Corp | Upright installation type semiconductor device |
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