JPS6088553U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6088553U JPS6088553U JP18034783U JP18034783U JPS6088553U JP S6088553 U JPS6088553 U JP S6088553U JP 18034783 U JP18034783 U JP 18034783U JP 18034783 U JP18034783 U JP 18034783U JP S6088553 U JPS6088553 U JP S6088553U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- view
- recorded
- semiconductor device
- electronic filing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来形式のＤＩＰ型半導体装置で、ａは正面図
、ｂは側面図、第２図はその斜視図である。第３図は本
考案の代表的一実施例で、ａは正面図、ｂは側面図、第
４図はその斜視図である。
第５図、第６図、第７図は本考案の第２、第３、第４の
実施例をそれぞれ表わす。
１．３・・・・・・従来形式の封止形状、ｌａ、ｌａ’
・・・・・・装置封止部端面、ｌｂ、ｌｂ’・・・・・
・装置封止部上下面、２．４−−−−−−リード、３ａ
、３ａ’、３．ｂ、６ａ′・・・・・・封止部とテープ
の接着部、５．′６・・・・・・テープ、５ａ・・・・
・・テープ接着部。
／Ｌ ／ρ′FIG. 1 shows a conventional DIP type semiconductor device, in which a is a front view, b is a side view, and FIG. 2 is a perspective view thereof. FIG. 3 shows a typical embodiment of the present invention, in which a is a front view, b is a side view, and FIG. 4 is a perspective view. FIGS. 5, 6 and 7 show the second, third and fourth embodiments of the present invention, respectively. 1.3... Conventional sealing shape, la, la'
・・・・・・Device sealing part end face, lb, lb'...
・Device sealing part upper and lower surfaces, 2.4--Lead, 3a
, 3a', 3. b, 6a'... Sealing part and adhesive part of tape, 5. '6...Tape, 5a...
・Tape adhesive part. /L /ρ'
Claims (1)
半導体装置。A semiconductor device characterized by having tape adhered to the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18034783U JPS6088553U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18034783U JPS6088553U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6088553U true JPS6088553U (en) | 1985-06-18 |
Family
ID=30391061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18034783U Pending JPS6088553U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088553U (en) |
-
1983
- 1983-11-22 JP JP18034783U patent/JPS6088553U/en active Pending
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