JPS5818365U - Printed circuit board for surface mounting - Google Patents
Printed circuit board for surface mountingInfo
- Publication number
- JPS5818365U JPS5818365U JP11198681U JP11198681U JPS5818365U JP S5818365 U JPS5818365 U JP S5818365U JP 11198681 U JP11198681 U JP 11198681U JP 11198681 U JP11198681 U JP 11198681U JP S5818365 U JPS5818365 U JP S5818365U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- surface mounting
- circuit board
- board
- semiconductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は形状の異なるトランジスタの各側を示す外観図
、第２図は形状の異なる回路部品の各側を示す外観図、
第３図は本考案の一実施例を示す平面図、第４図ないし
第６図はそれぞれ形状の異なるトランジスタの搭載方法
を示す平面図である。
１−Ｆ型Ｔｒ、 ２−Ｄ型ＴｒＮ ３−Ｍ型Ｔｒ１８−
Ｍ型Ｔｒ取付はパターンランド、９・・・Ｆ型、Ｄ型Ｔ
ｒ取付はパターンランド、１４．１５・・・Ｆ型Ｔｒ仮
止め用接着剤塗布条件、１６．１７・・・Ｄ型Ｔｒ仮止
め用接着剤塗布条件、１８．１９・・・Ｍ型Ｔｒ仮止め
用接着剤塗布条件。Fig. 1 is an external view showing each side of transistors with different shapes, Fig. 2 is an external view showing each side of circuit components with different shapes,
FIG. 3 is a plan view showing an embodiment of the present invention, and FIGS. 4 to 6 are plan views showing methods of mounting transistors of different shapes. 1-F type Tr, 2-D type TrN 3-M type Tr18-
M type Tr installation is pattern land, 9...F type, D type T
r mounting on pattern land, 14.15...Adhesive application conditions for F type Tr temporary fixing, 16.17...Adhesive application conditions for D type Tr temporary fixing, 18.19...M type Tr temporary fixing. Application conditions for adhesive.
Claims (1)
載して使用できるように、基板上に汎用性のパターンラ
ンドを印刷形成してなり、半導体搭載時には半導体板止
め用の接着剤の塗布条件を変えることにより、半導体の
不要なパターンランドをレジストすることを特徴とする
面付用プリント基板。In printed circuit boards for surface mounting, general-purpose pattern lands are printed on the board so that semiconductors of different shapes can be mounted and used, and when mounting semiconductors, the conditions for applying the adhesive for fixing the semiconductor board are changed. A printed circuit board for surface mounting characterized by resisting unnecessary pattern lands on a semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11198681U JPS5818365U (en) | 1981-07-28 | 1981-07-28 | Printed circuit board for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11198681U JPS5818365U (en) | 1981-07-28 | 1981-07-28 | Printed circuit board for surface mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5818365U true JPS5818365U (en) | 1983-02-04 |
Family
ID=29906327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11198681U Pending JPS5818365U (en) | 1981-07-28 | 1981-07-28 | Printed circuit board for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818365U (en) |
-
1981
- 1981-07-28 JP JP11198681U patent/JPS5818365U/en active Pending
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