JPS58114069U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58114069U
JPS58114069U JP1037382U JP1037382U JPS58114069U JP S58114069 U JPS58114069 U JP S58114069U JP 1037382 U JP1037382 U JP 1037382U JP 1037382 U JP1037382 U JP 1037382U JP S58114069 U JPS58114069 U JP S58114069U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
resist
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1037382U
Other languages
Japanese (ja)
Inventor
南 寿人
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP1037382U priority Critical patent/JPS58114069U/en
Publication of JPS58114069U publication Critical patent/JPS58114069U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の両面印刷配線板の構造断面図、第2図は
従来の部品を線による記号で記した部品印刷を示す図、
第3図と第4図は本考案の印刷配     ′線板の構
造断面図と平面図である。 1・、・・・・・電子部品、2・・・・・・レジスト印
刷、3・・・・・・印刷配線、4・・・・・・基板、7
・・・・・・部品印刷のためのインク。
Figure 1 is a cross-sectional view of the structure of a conventional double-sided printed wiring board, Figure 2 is a diagram showing conventional component printing in which components are marked with line symbols,
3 and 4 are a structural sectional view and a plan view of the printed circuit board of the present invention. 1...Electronic components, 2...Resist printing, 3...Printed wiring, 4...Substrate, 7
...Ink for printing parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に印刷配線を配設し、この印刷配線の上刃′)ら前
記基板面にレジスト印刷をし、さらに前記基板面側に配
設する電子部品の配設箇所に前記レジスト印刷の上に前
記電子部品の平面形状と略同−若しくは大きめに部品印
刷のためのインクが塗布されていることを特徴とする印
刷配線板。
A printed wiring is arranged on a board, a resist is printed on the board surface from the upper edge of the printed wiring, and the resist is printed on the resist printing at the location where electronic components to be arranged on the board surface side are to be arranged. 1. A printed wiring board characterized in that ink for printing components is applied to a planar shape that is substantially the same as or larger than the planar shape of an electronic component.
JP1037382U 1982-01-27 1982-01-27 printed wiring board Pending JPS58114069U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1037382U JPS58114069U (en) 1982-01-27 1982-01-27 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1037382U JPS58114069U (en) 1982-01-27 1982-01-27 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58114069U true JPS58114069U (en) 1983-08-04

Family

ID=30023024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1037382U Pending JPS58114069U (en) 1982-01-27 1982-01-27 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58114069U (en)

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