JPS58182437U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58182437U
JPS58182437U JP7999782U JP7999782U JPS58182437U JP S58182437 U JPS58182437 U JP S58182437U JP 7999782 U JP7999782 U JP 7999782U JP 7999782 U JP7999782 U JP 7999782U JP S58182437 U JPS58182437 U JP S58182437U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
internal lead
lead
auxiliary plate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7999782U
Other languages
English (en)
Japanese (ja)
Other versions
JPS635253Y2 (enrdf_load_stackoverflow
Inventor
昭弘 窪田
強 青木
小野　道夫
修 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7999782U priority Critical patent/JPS58182437U/ja
Publication of JPS58182437U publication Critical patent/JPS58182437U/ja
Application granted granted Critical
Publication of JPS635253Y2 publication Critical patent/JPS635253Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7999782U 1982-05-31 1982-05-31 半導体装置 Granted JPS58182437U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7999782U JPS58182437U (ja) 1982-05-31 1982-05-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7999782U JPS58182437U (ja) 1982-05-31 1982-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58182437U true JPS58182437U (ja) 1983-12-05
JPS635253Y2 JPS635253Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30089156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7999782U Granted JPS58182437U (ja) 1982-05-31 1982-05-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS58182437U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS635253Y2 (enrdf_load_stackoverflow) 1988-02-12

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