JPS58176960A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58176960A
JPS58176960A JP57059084A JP5908482A JPS58176960A JP S58176960 A JPS58176960 A JP S58176960A JP 57059084 A JP57059084 A JP 57059084A JP 5908482 A JP5908482 A JP 5908482A JP S58176960 A JPS58176960 A JP S58176960A
Authority
JP
Japan
Prior art keywords
lead
brazing
leads
ceramic substrate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57059084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634947B2 (enExample
Inventor
Katsuhiko Suzuki
勝彦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57059084A priority Critical patent/JPS58176960A/ja
Publication of JPS58176960A publication Critical patent/JPS58176960A/ja
Publication of JPS634947B2 publication Critical patent/JPS634947B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57059084A 1982-04-09 1982-04-09 半導体装置の製造方法 Granted JPS58176960A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57059084A JPS58176960A (ja) 1982-04-09 1982-04-09 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57059084A JPS58176960A (ja) 1982-04-09 1982-04-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58176960A true JPS58176960A (ja) 1983-10-17
JPS634947B2 JPS634947B2 (enExample) 1988-02-01

Family

ID=13103118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57059084A Granted JPS58176960A (ja) 1982-04-09 1982-04-09 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58176960A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305541A (ja) * 1987-06-05 1988-12-13 Olympus Optical Co Ltd 半導体パッケ−ジのリ−ド取付方法
JPS63310143A (ja) * 1987-06-12 1988-12-19 Ibiden Co Ltd 黒鉛製治具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857579A (enExample) * 1971-11-18 1973-08-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857579A (enExample) * 1971-11-18 1973-08-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305541A (ja) * 1987-06-05 1988-12-13 Olympus Optical Co Ltd 半導体パッケ−ジのリ−ド取付方法
JPS63310143A (ja) * 1987-06-12 1988-12-19 Ibiden Co Ltd 黒鉛製治具

Also Published As

Publication number Publication date
JPS634947B2 (enExample) 1988-02-01

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