JPS58174577A - スパツタ方法及び装置 - Google Patents

スパツタ方法及び装置

Info

Publication number
JPS58174577A
JPS58174577A JP5660082A JP5660082A JPS58174577A JP S58174577 A JPS58174577 A JP S58174577A JP 5660082 A JP5660082 A JP 5660082A JP 5660082 A JP5660082 A JP 5660082A JP S58174577 A JPS58174577 A JP S58174577A
Authority
JP
Japan
Prior art keywords
wafer
receiver
target
revolving
gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5660082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6153426B2 (enExample
Inventor
Yoshihisa Ishida
義久 石田
Norio Kanai
金井　謙雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5660082A priority Critical patent/JPS58174577A/ja
Publication of JPS58174577A publication Critical patent/JPS58174577A/ja
Publication of JPS6153426B2 publication Critical patent/JPS6153426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP5660082A 1982-04-07 1982-04-07 スパツタ方法及び装置 Granted JPS58174577A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5660082A JPS58174577A (ja) 1982-04-07 1982-04-07 スパツタ方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5660082A JPS58174577A (ja) 1982-04-07 1982-04-07 スパツタ方法及び装置

Publications (2)

Publication Number Publication Date
JPS58174577A true JPS58174577A (ja) 1983-10-13
JPS6153426B2 JPS6153426B2 (enExample) 1986-11-18

Family

ID=13031703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5660082A Granted JPS58174577A (ja) 1982-04-07 1982-04-07 スパツタ方法及び装置

Country Status (1)

Country Link
JP (1) JPS58174577A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149376A (ja) * 1986-12-15 1988-06-22 Toshiba Corp スパツタリング装置
US20220162737A1 (en) * 2020-11-25 2022-05-26 Oem Group, Llc Systems and methods for in-situ etching prior to physical vapor deposition in the same chamber

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106282951B (zh) * 2016-08-30 2018-07-06 河南科技大学 一种磁控溅射镀膜机用的基片固定夹具及使用方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IEEE TRANSACTIONS ON MAGNETICS=1980 *
IEEE TRANSACTIONS ON MAGNETICS=1981 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149376A (ja) * 1986-12-15 1988-06-22 Toshiba Corp スパツタリング装置
US20220162737A1 (en) * 2020-11-25 2022-05-26 Oem Group, Llc Systems and methods for in-situ etching prior to physical vapor deposition in the same chamber

Also Published As

Publication number Publication date
JPS6153426B2 (enExample) 1986-11-18

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