JPS58170833U - 半導体集積回路 - Google Patents
半導体集積回路Info
- Publication number
- JPS58170833U JPS58170833U JP1982066486U JP6648682U JPS58170833U JP S58170833 U JPS58170833 U JP S58170833U JP 1982066486 U JP1982066486 U JP 1982066486U JP 6648682 U JP6648682 U JP 6648682U JP S58170833 U JPS58170833 U JP S58170833U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- arranged close
- bonding pads
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/5445—
-
- H10W72/5449—
-
- H10W72/5473—
-
- H10W72/932—
-
- H10W90/756—
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982066486U JPS58170833U (ja) | 1982-05-07 | 1982-05-07 | 半導体集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982066486U JPS58170833U (ja) | 1982-05-07 | 1982-05-07 | 半導体集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58170833U true JPS58170833U (ja) | 1983-11-15 |
| JPS6348122Y2 JPS6348122Y2 (cg-RX-API-DMAC10.html) | 1988-12-12 |
Family
ID=30076354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982066486U Granted JPS58170833U (ja) | 1982-05-07 | 1982-05-07 | 半導体集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170833U (cg-RX-API-DMAC10.html) |
-
1982
- 1982-05-07 JP JP1982066486U patent/JPS58170833U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348122Y2 (cg-RX-API-DMAC10.html) | 1988-12-12 |
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