JPS5817018A - Apparatus for transferring wafer - Google Patents

Apparatus for transferring wafer

Info

Publication number
JPS5817018A
JPS5817018A JP11000181A JP11000181A JPS5817018A JP S5817018 A JPS5817018 A JP S5817018A JP 11000181 A JP11000181 A JP 11000181A JP 11000181 A JP11000181 A JP 11000181A JP S5817018 A JPS5817018 A JP S5817018A
Authority
JP
Japan
Prior art keywords
track
permanent magnet
traveling vehicle
electromagnet
electromagnets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11000181A
Other languages
Japanese (ja)
Inventor
Michiyuki Harada
宙幸 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP11000181A priority Critical patent/JPS5817018A/en
Publication of JPS5817018A publication Critical patent/JPS5817018A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00Non-mechanical conveyors not otherwise provided for
    • B65G54/02Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715Changing the direction of the conveying path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Non-Mechanical Conveyors (AREA)

Abstract

PURPOSE:To perform clean transfer without generating dust, by allowing a travelling car for transferring a cassette containing semiconductor wafers to float above a track so that the travelling car can run in a state out of contact with the floor. CONSTITUTION:Since when the travelling car body 7 is put on a track body 3, floating permanent magnets 2a, 2b of the track body 3 and floating permanent magnets 9a-9d are arranged such that their poles of the same polarity are faced to each other, the travelling car body 7 floats above the track body 3 due to the repulsion between the magnets. To drive the travelling car body 7, the electric current to an electromagnet 1 above which a permanent magnet 10 is positioned is cut, and one of electromagnets 1 that are on both sides of the permanent magnet 10, that is, one positioned on the side to which the travelling car body 7 is required to be moved, is magnetized to attract the permanent magnet 10, while the other is magnetized to repulse the permanent magnet 10, so that the travelling car body 7 is moved toward the former electromagnet 1. Thus by successively changing the direction of porality of the electromagnets 1, the travelling car body 7 is moved continuously.

Description

【発明の詳細な説明】 本発明は半導体集積回路製造ラインO自動化に必l!な
製造装置間のウェハ移送を自動的に行う装置K1mする
ものて、さらに詳しくいえば、半導体ウェハを収納する
カセットを積載する走行車と、こO走行車が走行する軌
道とを構成要素に含むウェハ移送装置に関す為%Oであ
る・ 最近、半導体集積開路製造装置O自動化は著しく進展し
、カセット・ツウ・カセット(0−0)式自動化が一般
的になって自た・ そして、これらの装置においては、中導体ウエ八をカセ
ットに収納して製造装置に装置すると、自動的にウェハ
が処理され、カセットが戻されるように構成されてbる
。従って、個々の製造装置から製造装置へ製造1椙順序
にしたがって、半導体クエへを収納するカセットを移送
し製造装置へ装填する手段があれば、半導体集積回路製
造ラインとしての自動化が可能となる・ しかして、この種のウェハ移送装置としては、エアート
ラック式つェハ一枚移送方式が広く知られて−るが、こ
れki製造装置がすべて一枚処理の自動化になるものと
して考えられ友ものであシ、複数枚のウェハを一括して
処理する0−a式自動製造装鐙を多数含む製造ラインの
ウェハ移送には不適当である。
[Detailed Description of the Invention] The present invention is essential for automating semiconductor integrated circuit manufacturing lines! The device K1m automatically transfers wafers between manufacturing devices, and more specifically, it includes a traveling vehicle loaded with cassettes for storing semiconductor wafers, and a track on which the traveling vehicle runs. %O for wafer transfer equipment.Recently, automation of semiconductor integrated circuit manufacturing equipment has made significant progress, and cassette-to-cassette (0-0) type automation has become common. The apparatus is configured such that when medium conductor wafers are placed in a cassette and placed in a manufacturing apparatus, the wafers are automatically processed and the cassette is returned. Therefore, if there is a means to transfer cassettes containing semiconductor chips from each manufacturing device to the manufacturing device according to the manufacturing process order and load them into the manufacturing device, automation of the semiconductor integrated circuit manufacturing line becomes possible. As this type of wafer transfer device, the air track type single wafer transfer method is widely known, but this type of wafer transfer system is widely known, but this type of wafer transfer system is considered to be suitable for all wafer manufacturing equipment that can be automated for single wafer processing. However, it is not suitable for transferring wafers in a production line that includes a large number of 0-A automatic production stirrups that process a plurality of wafers at once.

また、半導体ウニ^を収納したカセッシを軌道。In addition, a cassette containing a semiconductor sea urchin ^ is placed in orbit.

ある込は床に貼り九!−力に沿って走行する走行車によ
り害遇するカセット移送方式が提案されているが、この
方式Kかいては、容送中に発生するダストによるウニ八
汚染が問題であり、このため、半導体ウェハを収納した
カセットな密閉ケースに入れるなどの防塵対策が必要で
あると共に、カセットをその密閉ケースよ)出し入れす
る機構が必要である等の問題があった。
Paste it on the floor! - A cassette transfer method has been proposed that is disadvantageous due to the traveling vehicle traveling along the force, but this method has the problem of contamination by dust generated during transportation. There are problems such as the need for dustproof measures such as placing the wafer in a cassette-like sealed case, and the need for a mechanism to take the cassette in and out of the sealed case.

本発明は以上0*<鑑み、このような問題を解決すると
共に、かかる欠点を除去すべくなされたもので、その目
的は半導体ウェハを収納し九カセットを移送する走行車
を軌道より浮上させ、床面と非接触の状態で走行できる
ようKL、塵が発生することがないりシーンなウェハ移
送装置を提供する仁とにある。
In view of the above, the present invention has been made to solve such problems and eliminate such drawbacks.The purpose of the present invention is to levitate a traveling vehicle that stores semiconductor wafers and transports nine cassettes from a track, KL is able to run without contacting the floor, and JIN provides a wafer transfer device that does not generate dust and is versatile.

以下、図示する実施例によってそ0構成尋を詳細に説明
する。
Hereinafter, the configuration will be explained in detail with reference to illustrated embodiments.

第111は本発明によるウェハ移送装置に用する軌道の
一実施例を示す説明図で、(−は平面図を示したもので
あり、(b)は断面図を示し、(e)は側面図を示した
ものである*WJにおいて、1は駆動用0複数の電磁石
、意*、1には浮上用永久磁石、1は軌動本体(軌道)
、4は軌道本体3を覆うカバー、5.6は駆動用電磁石
1のリ−)e線である。
No. 111 is an explanatory diagram showing an embodiment of the track used in the wafer transfer device according to the present invention, (- indicates a plan view, (b) indicates a sectional view, and (e) indicates a side view. *In WJ, 1 is a driving electromagnet, 1 is a permanent magnet for levitation, and 1 is an orbital body (orbit).
, 4 is a cover that covers the track body 3, and 5.6 is a lead wire of the driving electromagnet 1.

第2Wiは本発明に用いる走行車〇一実施例を示す説明
図で、(−は平面図を示した一〇であ#、(b)は側面
図を示したものである0図にシbて、1は正方形の走行
車本体(走行車)% Iaellb#i中導体ウニ^を
収納すつカセットを搭載する力竜ノド載台、9 a a
 # b e # m a m−は走行車本体7KN方
形に配置され九浮上用永久磁石、1・は駆動用永久磁石
である。
2nd Wi is an explanatory diagram showing an embodiment of the traveling vehicle used in the present invention (- is 10 which shows a plan view, and (b) is a symbol 0 which shows a side view. 1 is a square running vehicle body (traveling vehicle) % Iaelb#i Rikiryu throat mounting stand that is equipped with a cassette that stores the medium conductor sea urchin ^, 9 a a
# b e # m a m - is a permanent magnet for nine levitations arranged in a 7KN square of the main body of the traveling vehicle, and 1 is a permanent magnet for driving.

つぎにこの第2図に示す実施例0作用を第1図を参照し
て[lJIする・まず、1111図に示す軌道本体8に
1I12Wiの捷行草本体1を乗せたとき、軌動本体3
の浮上用永久磁石2a4にと走行車本体7の浮上用永久
磁石9畠〜9dが互に同じ極、例えば)f4Kが袈する
ように構成しであるので、それら磁石間の反撥力によ)
走行車本体7は軌道本体3上に浮上する。このとき、軌
道本体3の浮上用永久磁石2aと永久磁石25間の距離
を、正方形に配着された走行車本体7の浮上用永久磁石
9aと永久磁石9@の距離に比べ大きくしておくと、走
行車本体7の中心が軌道本体3の中心からずれた場合、
中心に戻すカが作用するため安定に浮上する。
Next, the effect of the embodiment 0 shown in FIG. 2 will be described with reference to FIG.
Since the levitation permanent magnets 2a4 and the levitation permanent magnets 9-9d of the traveling vehicle body 7 are constructed so that the same polarity, for example) f4K, is applied to the levitation permanent magnet 2a4 of the vehicle body 7, the repulsion between these magnets causes
The traveling vehicle body 7 floats above the track body 3. At this time, the distance between the levitation permanent magnet 2a of the track body 3 and the permanent magnet 25 is made larger than the distance between the levitation permanent magnet 9a and the permanent magnet 9@ of the traveling vehicle body 7, which are arranged in a square shape. If the center of the traveling vehicle body 7 deviates from the center of the track body 3,
It floats stably because of the force that brings it back to the center.

このように、軌道3と走行車IK浮上用O永久磁石を亙
に反撥力が作用するように配置し、走行車7を軌道3よ
)浮上せしめるように構成されてhる。
In this way, the track 3 and the permanent magnet for floating the vehicle IK are arranged so that a repulsive force acts across them, and the vehicle 7 is levitated above the track 3.

つぎに、走行車10駆動について説明する・まず、駆動
用永久磁石10は第五図に示す駆動用電磁石1に比べそ
の直径が太き−とし、ある電磁石1の真上に位置し停止
しているとする。そして、この状態を保つには永久磁石
10が位置する電磁石1に永久磁石10と引き合う方向
に磁化するように電流を流し、その両側の電磁石1には
反撥する方向に電流を流せばよ−0 この状態から走行車本体7を駆動するには、永久磁石1
0が位置する電磁石1の電流を切り、その両側の2個の
電磁石1のうち走行車本体7を進めえb@O電磁石1を
永久磁石10と引き金り方向に磁化し、屓対儒O電磁石
1は永久磁石10と反撥するように磁化すると、走行車
本体7は引き合う方向に磁化された電磁石1に向って動
くので。
Next, the driving of the traveling vehicle 10 will be explained. First, the driving permanent magnet 10 has a larger diameter than the driving electromagnet 1 shown in FIG. 5, and is positioned directly above a certain electromagnet 1 and stopped. Suppose there is. In order to maintain this state, a current should be passed through the electromagnet 1 where the permanent magnet 10 is located so as to magnetize it in the direction of attracting the permanent magnet 10, and a current should be passed through the electromagnets 1 on both sides in the direction of repulsion. To drive the traveling vehicle body 7 from this state, the permanent magnet 1
Turn off the current in the electromagnet 1 where 0 is located, and move the vehicle main body 7 of the two electromagnets 1 on both sides of it. Magnetize the electromagnet 1 and the permanent magnet 10 in the triggering direction, 1 is magnetized to repel the permanent magnet 10, the vehicle body 7 moves toward the magnetized electromagnet 1 in the direction of attraction.

次にその電磁石1の電流を切り、その両側の2個O電磁
石1について各々上記の如く磁化する。
Next, the current to the electromagnet 1 is cut off, and the two O electromagnets 1 on both sides are magnetized as described above.

このように%頴次、電磁石1の磁化の方向を切り替えて
ゆくと、走行車本体フは連続して動すてゆく、そして、
ζO切り替えのタイZングを少しづつ早めると、走行車
1はだんだん速く動くようになり、逆に遅くすると減速
できる。そして、カセット載台(カセット部)lIm、
$1+はカセットが載る部分だけ切り込まれてhるので
、走行車本体70加減速に対し力竜ツシを安定に保持す
ることができる。
As the direction of magnetization of the electromagnet 1 is switched in this way, the main body of the vehicle moves continuously, and
If the timing of ζO switching is accelerated little by little, the traveling vehicle 1 will gradually move faster, and if it is slowed down, it can be decelerated. Then, the cassette mounting stand (cassette part) lIm,
Since the $1+ is cut in only the part where the cassette is placed, it is possible to stably hold the lever against the acceleration and deceleration of the vehicle main body 70.

前述したところから明らかなように、軌道3に複数の電
磁石1を、走行車1に浮上用とは別な永久磁石10を、
それら相互間の磁力作用によりそO走行車7を目的とす
る方向に駆動し得るように配置し、上記複数の電磁石1
より走行車7の駆動に必要な電磁石を選択して、その選
択された電磁石1に電流を印加し、走行車1を駆動し、
あるいは停止せしめるように構成されている。
As is clear from the above, a plurality of electromagnets 1 are provided on the track 3, and a permanent magnet 10 other than the one for levitation is provided on the traveling vehicle 1.
The plurality of electromagnets 1 are arranged so that the traveling vehicle 7 can be driven in a desired direction by the magnetic force between them.
Selecting an electromagnet necessary for driving the traveling vehicle 7, applying a current to the selected electromagnet 1 to drive the traveling vehicle 1,
Alternatively, it is configured to be stopped.

33図は本発明の動作説明に供する回転機構付交差路の
一実施例を示すm明図である。この第3IllK′sP
bて第五図と同一符号のものは暢轟部分を示し、t−1
,1−2,?、1−17は軌道3の交差路に配置された
駆動用電磁石、11は軌道3に設けた多数のノズルで、
このノズル11よ〕空気などO気体を噴出し、走行車フ
C第2因参照)を浮上せしめるように構成されてbる。
FIG. 33 is a clear view showing an embodiment of an intersection with a rotation mechanism for explaining the operation of the present invention. This third IllK'sP
b The same reference numerals as in Figure 5 indicate the roaring part, t-1
,1-2,? , 1-17 is a driving electromagnet arranged at the intersection of the track 3, 11 is a large number of nozzles provided on the track 3,
This nozzle 11 is configured to eject O gas such as air to cause the traveling vehicle (see second factor C) to float.

つぎにこの第!IIIK示す実施例の作用を第1図およ
び第2#!Jを参照して説明する。
Next is this part! IIIK The operation of the embodiment shown in FIGS. 1 and 2 #! This will be explained with reference to J.

まず、交差路に進んで暑た走行車本体7(第2図参照)
を上記l!羽の如くして充分減速し、中央O電磁石1−
1 OJ:に駆動用永久磁石10(第意図参照)がき九
とき、電磁石1−1を永久磁石1・と引き合う方向に磁
化し、隣接する4個の電磁石1−2 、1−3 、1−
4 、1−5の各々をすべて反撥するように磁化すると
、走行車本体7は交差路の中央に停止する。このとき、
多数のノズル11からは空気などの気体が噴出している
ので、浮上用永久磁石21および永久磁石2−が交差路
になくても、走行車本体7は浮上を続ける。また、駆動
用永久磁石1・と浮上用永久磁石9m(または9b、ま
えは9C1または9d)との中心関距閣に比べ、電磁石
1−6から電磁石1−17の各中心が電磁石1−1を中
心として形成する円の半径を小さくしておき、走行車本
体7が交差路の中央に停止したときに電磁石1−7.1
−8.1−10.1−11.1−13.1−14,1−
16.1−17の各々を永久磁石9m、9b、9c、!
91と引き合うように出出すると、例えば、永久磁石9
aは電磁石1−7と電磁石1−8の中間に、永久磁石9
には電磁石1−10と電磁石1−11の中間に、永久磁
石9Cは電磁石1−13と電磁石1−14の中間に、永
久磁石911は電磁石1−16と電磁石1−17の中間
に各々停止する。そして、走行車本体7を回転させるに
は、例えば、電磁石1−8 、1−11 、1−14 
First, the vehicle body 7, which was hot after proceeding to the intersection (see Figure 2)
The above l! The center O electromagnet 1-
1 OJ: When the driving permanent magnet 10 (see the first intention) is applied, the electromagnet 1-1 is magnetized in a direction that attracts the permanent magnet 1, and the four adjacent electromagnets 1-2, 1-3, 1-
4, 1-5 are all magnetized so as to be repelled, the vehicle body 7 stops at the center of the intersection. At this time,
Since gas such as air is ejected from the many nozzles 11, the vehicle main body 7 continues to levitate even if the levitation permanent magnet 21 and the permanent magnet 2- are not at the intersection. Also, compared to the central point between the driving permanent magnet 1 and the levitation permanent magnet 9m (or 9b, previously 9C1 or 9d), the centers of the electromagnets 1-6 to 1-17 are closer to the electromagnet 1-1. The radius of the circle formed with .
-8.1-10.1-11.1-13.1-14,1-
16. Each of 1-17 is attached to a permanent magnet 9m, 9b, 9c,!
91, for example, the permanent magnet 9
A is a permanent magnet 9 between electromagnets 1-7 and 1-8.
, permanent magnet 9C is stopped between electromagnet 1-10 and electromagnet 1-11, permanent magnet 9C is stopped between electromagnet 1-13 and electromagnet 1-14, and permanent magnet 911 is stopped between electromagnet 1-16 and electromagnet 1-17. do. In order to rotate the traveling vehicle body 7, for example, electromagnets 1-8, 1-11, 1-14
.

1−17を永久磁石”m9b*9省、9dと各々互に引
き合う方向に磁化すると、永久磁石9m、9belie
、91が各々電磁石1−8.1−11.1−14゜1−
17の位置にくるように走行車本体7は回転する。りぎ
に、電磁石1−9.1−12.1−15 。
When magnetizing 1-17 with permanent magnets "m9b*9" and 9d in the direction of mutual attraction, permanent magnets 9m and 9belie
, 91 are electromagnets 1-8.1-11.1-14゜1-
The vehicle main body 7 rotates so that it comes to the position 17. Right, electromagnet 1-9.1-12.1-15.

1−6を永久磁石#aelk、49sJdと互に引き金
うよ5に磁化すれば、走行車本体1はこれら電磁石O位
置まで固転する。
When magnets 1-6 are magnetized to 5 so as to trigger each other with permanent magnets #aelk and 49sJd, the vehicle body 1 is fixedly rotated to the O position of these electromagnets.

toようkして、走行車本体1は交差路中央にかいて回
転畜せることがで自る。
As a result, the vehicle body 1 can be rotated to the center of the intersection.

−z*Ks例えば、永久磁石@ @ * @ b a 
* @a * aが各々電磁石1−10.1−13.1
−16,1−70互に引自舎つ良状態で、さらに、電磁
石1−11.1−14.1−17.1−1とt引暑合う
ようkすると、永久磁石1ajbe―電、94は各々電
磁石1−10と電磁石1−110閾、電磁石1−13と
電磁石11−140f!、電磁石1−16と電磁石1−
17の間および電磁石l−7と電磁石1−8の間に停止
すゐ。
-z*Ks For example, permanent magnet @ @ * @ b a
* @a * a is each electromagnet 1-10.1-13.1
-16, 1-70 are in good condition when they are drawn together, and when they are further heated so that they are aligned with the electromagnet 1-11.1-14.1-17.1-1, the permanent magnet 1ajbe-Electric, 94 are respectively electromagnet 1-10 and electromagnet 1-110 threshold, electromagnet 1-13 and electromagnet 11-140f! , electromagnet 1-16 and electromagnet 1-
17 and between electromagnet 1-7 and electromagnet 1-8.

このようにして、9 d”、1801”、27G”、3
61の回転位置KEIIK走行車本体1を固転させるこ
とができる。
In this way, 9 d", 1801", 27G", 3
Rotation position KEIIK of 61 The traveling vehicle main body 1 can be fixedly rotated.

そして、この交差路より走行車本体1を目的とする方向
に動かすには前述の第1図、菖2図で説明した如く、駆
動用電磁石1および電磁石!−1゜1−11−3.1−
4.1−5.1−11.1−9.1−12.1−111
0磁化を制御して行う。
In order to move the vehicle main body 1 in the desired direction from this intersection, as explained in FIG. 1 and FIG. 2, the driving electromagnet 1 and electromagnet! -1゜1-11-3.1-
4.1-5.1-11.1-9.1-12.1-111
This is done by controlling zero magnetization.

前述したところから明らかなように、軌道3に設は九多
数のノズル11よシ空気等の気体を噴出し、走行車7を
浮上せしめるように構成すると共に、その軌道3に複数
の電磁石1.1−1〜1−17を、また、走行車IK駆
動用永久磁石10を、それらの相互間の磁力作用により
その走行車7を目的とする方向に駆動し得るように配置
し、その複数の電磁石1−1−1−17よ勤走行車70
駆動に必要な電磁石を選択して、その選択された電磁石
に電流を印加し、走行車1を駆動し、あるiは停止せし
めるように構成されている。
As is clear from the foregoing, nine nozzles 11 are installed on the track 3 to eject gas such as air to make the vehicle 7 levitate, and a plurality of electromagnets 1 are installed on the track 3. .1-1 to 1-17, and a plurality of permanent magnets 10 for driving the vehicle IK are arranged so that the vehicle 7 can be driven in a desired direction by the magnetic force between them. Electromagnet 1-1-1-17 and working vehicle 70
It is configured to select an electromagnet necessary for driving, apply a current to the selected electromagnet, drive the traveling vehicle 1, and stop a certain i.

第4図は本発明によるウェハ移送装置を製造装置へ適用
しえ場合の一実施例を示す説明図である。
FIG. 4 is an explanatory diagram showing an embodiment in which the wafer transfer device according to the present invention can be applied to a manufacturing device.

この第4図におhて第isaおよび第2図と同一符号の
ものは相轟部分を示し、12m、12に鉱上下および左
右に動くアームs f8aetskは開閉可能なハンド
、1番は処理すべき半導体ウエノ1を収納したカセット
、IIIは空力セット、1・は0−0式自動製造装置、
17はウニ^処理部、1111Fiローダ、1−は7ノ
ローダである・なシ、@a、@bはカセット載台てあ為
In Fig. 4, the parts with the same numbers as h isa and Fig. 2 indicate the phase parts; A cassette containing semiconductor Ueno 1, III is an aerodynamic set, 1 is a 0-0 type automatic manufacturing device,
17 is the sea urchin processing unit, 1111Fi loader, 1- is the 7 loader, and @a and @b are the cassette mounts.

りtKeOj14rIAK示す夾麹例の動作を説明する
。走行車本体1(第!WilI参照)のカセット載台I
aK4G履すべ自早導体會エバを収納したカセット1番
を積み込み、移送して11九走行車本体1は、まず、−
−ダ1畠aよ)カセット載台sbに空力竜ッ)1!Iの
積み込みが行える位置に停止し、アーAljla とハ
yr18mによ〕ローダ1@K”Toゐ空カセツ)II
をカセット載台11bKIIみ込む。つぎに、走行車本
体1を処理ナベき半導体ウェハを収納し九カセット14
をローダ1sに装填できる位置まで移動させ、アーム1
2mとハンド131mを用iてローダIIK!i項する
。これと同様にして、空力セット1sをアーム12にと
ハンド13bを用いてγノローダ1参に装填すると%0
−c式自動製造装置1・には鵡履ナベ自半導体ウェハを
収納し九力竜ット14と処理の終った半導体ウェハを収
納する空27竜ツ)1Bが各々ローダ1畠およびアンロ
ー#−111に$填できたので、ウェハ錫層を行うむと
ができる。
The operation of the mixed malt example shown in tKeOj14rIAK will be explained. Cassette mounting stand I of the traveling vehicle body 1 (see No.! WilI)
Load the cassette No. 1 containing the aK4G self-conductor assembly Eva, transport it, and move the vehicle body 1 to -
- Da 1 Hatake a) Aerodynamic dragon on the cassette stand sb) 1! The loader 1 was stopped at a position where it could be loaded, and the loader 1@K"Toi empty cassette) II
into the cassette mounting stand 11bKII. Next, the traveling vehicle body 1 is processed and the semiconductor wafers are stored in nine cassettes 14.
Move the arm 1 to a position where it can be loaded onto the loader 1s, and
Loader IIK using 2m and hand 131m! Do the i term. In the same way, if you load the aerodynamic set 1s onto the arm 12 and the hand 13b into the γ-no-loader 1, the %0
-The C-type automatic manufacturing equipment 1 has a loader 1 and an unloader 14 for storing the semiconductor wafers and an empty 27 for storing the semiconductor wafers that have been processed. Now that we have $111, we can do the wafer tin layer.

そして、クヱ^処雇が終ると、アンローダIIよ111
I&110終ったクエ八〇人2九カセットをカセット載
台11aKアーム1!b、ハy)’13b  Kl〉積
与込み、走行車本体1は次O#!&環を行う製造装置へ
移動する。
And, when the job is finished, Unloader II, 111
I & 110 finished quest 80 people 29 cassettes on cassette stand 11aK arm 1! b, y) '13b Kl> Loading included, traveling vehicle body 1 is next O#! & Move to the manufacturing equipment that performs the ring.

このようにして、半導体集積回路の連続自動化ライyを
実現す為ことができる。
In this way, continuous automation of semiconductor integrated circuits can be realized.

以上本発−を走行車本体1にカセット載台8m。A cassette mounting platform of 8 m is mounted on the main body 1 of the vehicle.

8kが2個O場舎を例にとって説明したが、本発明はこ
れに@定されるものではなく、走行車本体IKカセット
載台が1個O走行車本体1によるウェハ移送も可能てあ
ゐφ まえ、上紀夷膣例に訃−では、走行車本体7が正方形の
場合を例にとりて説明したが、本発明はこれに限定され
るものではなく、長方形1円形などでも本妬−は実施す
ることができる。また、軌道を−げ九−場合には、軌道
O外部01点を中心とする同心りの円弧をS成すゐよう
に、永久磁石2&、211訃よび電磁石1を配置すれば
できる。
Although the explanation has been given using an example of a factory with two 8Ks, the present invention is not limited to this, and it is also possible to transfer wafers using the traveling vehicle main body 1 with one IK cassette loading platform. φ Earlier, in the above example, the case where the traveling vehicle body 7 is square was explained as an example, but the present invention is not limited to this. It can be implemented. In addition, when the orbit is extended, it can be done by arranging the permanent magnets 2 and 211 and the electromagnet 1 so as to form concentric circular arcs centered on a point 01 outside the orbit O.

以上説明し良ように、本発明では、走行車を浮上せしめ
る手段を備えて−るので、走行車は軌道に接することな
く走行することができ、走行により〆ストが発生するこ
とがなく、クリ−/なウェハ移送が**″C龜為と共に
、処理ウェハはカセットに収納して移送するので、ロフ
ト管理がカセット単位で行え、また、種々の装置トラブ
ルに対してもウェハが破損することがない等多くの利点
を有する。
As explained above, in the present invention, since the vehicle is provided with a means for levitating the vehicle, the vehicle can travel without coming into contact with the track, and there is no occurrence of a deadlock due to travel. -/Wafer transfer is possible with the **''C feature. Processed wafers are stored in cassettes and transferred, so loft management can be performed on a cassette-by-cassette basis, and wafers are prevented from being damaged due to various equipment troubles. It has many advantages.

このように、本発明によれば、従来のこの種の装置に比
して多大O効果があり、半導体集積回路展造ツインの自
動化に必要な製造装置間Oウェハ移送装置としては独自
のものである。
As described above, the present invention has a greater O effect than conventional devices of this type, and is unique as an inter-manufacturing device O-wafer transfer device necessary for automation of semiconductor integrated circuit manufacturing twins. be.

t  iiamo簡単な説明 j11図は本発−によるウェハ移送装置KM%Aる軌道
〇一実施例を示す説明図、#I2図は本発I!jlIK
j1%/%ゐ滝行車O−実施例を示すlK@閣、ga園
は本発−owh作説明に供する交差路〇一実施例を示す
説―図、第41Iは本発明を製造装置へ適用した場合の
ウェハ移送装置の一実施例を示す説明図である・ 1.1−1〜1〜17・・・・駆動用電磁石、2*、2
b・・・・浮上用永久磁石、3・・・・軌道本体、7・
・・・走行車本体、9ax9d・・・・浮上用永久磁石
、10・・・・駆動用永久磁石、11・・・・ノズル、
14・・・嗜カセット。
tiiamoSimple explanationJ11 is an explanatory diagram showing an example of the orbit of the wafer transfer device KM%A according to the present invention, and #I2 is an explanatory diagram showing the example of the trajectory of the wafer transfer device KM%A according to the present invention. jlIK
j1%/%ゐWaterfall train O-Example showing the embodiment lK@kaku, ga garden is from this work-owh Crossroads for explanation ゐExplanation showing the embodiment-Figure, 41I is application of the present invention to manufacturing equipment 1.1-1 to 1 to 17...Driving electromagnet, 2*, 2
b... Permanent magnet for levitation, 3... Orbit body, 7...
...Traveling vehicle body, 9ax9d...Permanent magnet for levitation, 10...Permanent magnet for drive, 11...Nozzle,
14... Addiction cassette.

特許出願人 日本電信電話公社Patent applicant: Nippon Telegraph and Telephone Corporation

Claims (2)

【特許請求の範囲】[Claims] (1)宇導体つエノ1を収納するカセットを積載する走
行車と、この走行車が走行する軌道とを構成要素に含む
ウェハ移送装置において、前記軌道と前記走行車に浮上
用の永久磁石を互に反撥力が作用するように設置し、該
走行車を該軌道より浮上せしめる手段と、前記軌道に複
数の電磁石を、前記走行車に浮上用とは別な駆動用の永
久磁石を、それら相互間の磁力作用によシ紋走行車を目
的とすゐ方向に駆動し得るように配置し、帥紀複数の電
磁石より該走行車の駆動に必要な電磁石を選択して、そ
の選択された電磁石に電流を印加し、該走行車を駆動し
、あるいは停止せしめる手段とを偏見えことを特徴とす
るウェハ移送装置。
(1) In a wafer transfer device that includes a traveling vehicle loaded with a cassette that stores Udeta Tsueno 1 and a track on which the traveling vehicle travels, a permanent magnet for levitation is provided on the track and the traveling vehicle. A means for levitating the traveling vehicle from the track by installing a means for repelling each other, a plurality of electromagnets on the track, and a permanent magnet for driving other than levitation on the traveling vehicle; The striped vehicle is arranged so that it can be driven in the desired direction by mutual magnetic force, and the driver selects the electromagnet necessary for driving the vehicle from a plurality of electromagnets, and A wafer transfer device characterized in that a means for applying a current to an electromagnet to drive or stop the traveling vehicle is shown separately.
(2)#、導体ウェハを収納するカセットを積載する走
行車と、この走行車が走行する軌導とを構成要素に含む
ウェハ移送装置において、前記軌道に設は九複歇Oノズ
ルよ)空気等の気体を噴出し前記走行車を浮上せしめ1
手段と、前記軌道に複数O電磁石を、前記走行車に駆動
MO永久磁石を、それら暢亙聞O磁力作jllKよ!I
#走行車を目的とする方向に駆動し得るように配置し、
前記複数の電磁石よp該滝行軍の駆動に必要な電磁石を
選択して、そO選択され九電磁石に電流を印加し、皺走
行車を駆動し、あるいは停止せしめる手段とを備えたこ
とを特徴とするウェハ移送装置。
(2) In a wafer transfer device that includes a traveling vehicle loaded with cassettes for storing conductor wafers and a track along which the traveling vehicle travels, the track is equipped with nine double O-nozzles (9) air The vehicle is made to float by ejecting a gas such as 1
Means, a plurality of O electromagnets on the track, a driving MO permanent magnet on the traveling vehicle, and the magnetic force is activated by them! I
# Arrange the vehicle so that it can be driven in the desired direction,
It is characterized by comprising means for selecting the electromagnets necessary for driving the waterfall march from the plurality of electromagnets and applying a current to the nine selected electromagnets to drive or stop the wrinkling vehicle. Wafer transfer equipment.
JP11000181A 1981-07-16 1981-07-16 Apparatus for transferring wafer Pending JPS5817018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11000181A JPS5817018A (en) 1981-07-16 1981-07-16 Apparatus for transferring wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11000181A JPS5817018A (en) 1981-07-16 1981-07-16 Apparatus for transferring wafer

Publications (1)

Publication Number Publication Date
JPS5817018A true JPS5817018A (en) 1983-02-01

Family

ID=14524576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11000181A Pending JPS5817018A (en) 1981-07-16 1981-07-16 Apparatus for transferring wafer

Country Status (1)

Country Link
JP (1) JPS5817018A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230921A (en) * 1983-06-13 1984-12-25 Tatsuo Tsubouchi Article floating and moving device
JPS60107451A (en) * 1983-11-17 1985-06-12 株式会社東芝 Transporter
JPS6194925A (en) * 1984-10-12 1986-05-13 Mitsubishi Chem Ind Ltd Conveying apparatus
JPS61177106A (en) * 1985-01-29 1986-08-08 Seiko Seiki Co Ltd Conveying apparatus
JPS61217434A (en) * 1985-03-20 1986-09-27 Mitsubishi Chem Ind Ltd Conveying device
US5213658A (en) * 1990-10-26 1993-05-25 Mitsubishi Denki Kabushiki Kaisha Plasma processing method
US5228940A (en) * 1990-10-03 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Fine pattern forming apparatus
US5246532A (en) * 1990-10-26 1993-09-21 Mitsubishi Denki Kabushiki Kaisha Plasma processing apparatus
WO1994001354A1 (en) * 1992-07-07 1994-01-20 Ebara Corporation Magnetically levitated carrying apparatus
CN103420165A (en) * 2013-08-06 2013-12-04 中国电子科技集团公司第四十八研究所 Substrate conveying device
EP3746384A4 (en) * 2018-01-31 2021-10-20 Laitram, LLC Hygienic magnetic tray and conveyor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230921A (en) * 1983-06-13 1984-12-25 Tatsuo Tsubouchi Article floating and moving device
JPS60107451A (en) * 1983-11-17 1985-06-12 株式会社東芝 Transporter
JPH0578492B2 (en) * 1984-10-12 1993-10-28 Mitsubishi Chem Ind
JPS6194925A (en) * 1984-10-12 1986-05-13 Mitsubishi Chem Ind Ltd Conveying apparatus
JPS61177106A (en) * 1985-01-29 1986-08-08 Seiko Seiki Co Ltd Conveying apparatus
JPH0581489B2 (en) * 1985-03-20 1993-11-15 Mitsubishi Chem Ind
JPS61217434A (en) * 1985-03-20 1986-09-27 Mitsubishi Chem Ind Ltd Conveying device
US5228940A (en) * 1990-10-03 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Fine pattern forming apparatus
US5292401A (en) * 1990-10-03 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Method of forming a fine pattern
US5246532A (en) * 1990-10-26 1993-09-21 Mitsubishi Denki Kabushiki Kaisha Plasma processing apparatus
US5213658A (en) * 1990-10-26 1993-05-25 Mitsubishi Denki Kabushiki Kaisha Plasma processing method
WO1994001354A1 (en) * 1992-07-07 1994-01-20 Ebara Corporation Magnetically levitated carrying apparatus
CN103420165A (en) * 2013-08-06 2013-12-04 中国电子科技集团公司第四十八研究所 Substrate conveying device
EP3746384A4 (en) * 2018-01-31 2021-10-20 Laitram, LLC Hygienic magnetic tray and conveyor

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