JPS58168270A - 半導体装置のパツケ−ジ - Google Patents

半導体装置のパツケ−ジ

Info

Publication number
JPS58168270A
JPS58168270A JP57052404A JP5240482A JPS58168270A JP S58168270 A JPS58168270 A JP S58168270A JP 57052404 A JP57052404 A JP 57052404A JP 5240482 A JP5240482 A JP 5240482A JP S58168270 A JPS58168270 A JP S58168270A
Authority
JP
Japan
Prior art keywords
legs
package
semiconductor device
side end
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57052404A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634948B2 (enExample
Inventor
Kazuhiro Sakashita
和広 坂下
Isao Okura
大倉　五佐雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57052404A priority Critical patent/JPS58168270A/ja
Publication of JPS58168270A publication Critical patent/JPS58168270A/ja
Publication of JPS634948B2 publication Critical patent/JPS634948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/429—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57052404A 1982-03-29 1982-03-29 半導体装置のパツケ−ジ Granted JPS58168270A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57052404A JPS58168270A (ja) 1982-03-29 1982-03-29 半導体装置のパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57052404A JPS58168270A (ja) 1982-03-29 1982-03-29 半導体装置のパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58168270A true JPS58168270A (ja) 1983-10-04
JPS634948B2 JPS634948B2 (enExample) 1988-02-01

Family

ID=12913846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57052404A Granted JPS58168270A (ja) 1982-03-29 1982-03-29 半導体装置のパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58168270A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018110143A (ja) * 2016-12-28 2018-07-12 三菱電機株式会社 半導体装置、電力変換装置、リードフレーム、および半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018110143A (ja) * 2016-12-28 2018-07-12 三菱電機株式会社 半導体装置、電力変換装置、リードフレーム、および半導体装置の製造方法

Also Published As

Publication number Publication date
JPS634948B2 (enExample) 1988-02-01

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