JPS58168265A - 金属被膜の形成方法 - Google Patents

金属被膜の形成方法

Info

Publication number
JPS58168265A
JPS58168265A JP57218482A JP21848282A JPS58168265A JP S58168265 A JPS58168265 A JP S58168265A JP 57218482 A JP57218482 A JP 57218482A JP 21848282 A JP21848282 A JP 21848282A JP S58168265 A JPS58168265 A JP S58168265A
Authority
JP
Japan
Prior art keywords
substrate
metal
coating
pattern
mlc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57218482A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6332266B2 (enExample
Inventor
アナンダ・ホサケア・クマ−ル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS58168265A publication Critical patent/JPS58168265A/ja
Publication of JPS6332266B2 publication Critical patent/JPS6332266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP57218482A 1982-03-18 1982-12-15 金属被膜の形成方法 Granted JPS58168265A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US359445 1982-03-18
US06/359,445 US4501768A (en) 1982-03-18 1982-03-18 Thin film floating zone metal coating technique

Publications (2)

Publication Number Publication Date
JPS58168265A true JPS58168265A (ja) 1983-10-04
JPS6332266B2 JPS6332266B2 (enExample) 1988-06-29

Family

ID=23413816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57218482A Granted JPS58168265A (ja) 1982-03-18 1982-12-15 金属被膜の形成方法

Country Status (2)

Country Link
US (1) US4501768A (enExample)
JP (1) JPS58168265A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12347998B2 (en) 2020-06-05 2025-07-01 Nichia Corporation Method of manufacturing metal-coated member, metal-coated member, wavelength conversion member, and light emitting device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate
US4829020A (en) * 1987-10-23 1989-05-09 The United States Of America As Represented By The United States Department Of Energy Substrate solder barriers for semiconductor epilayer growth
US5460859A (en) * 1992-03-23 1995-10-24 Xerox Corporation Method and system for dip coating an article having large open areas or a multiplicity of apertures
US6127268A (en) * 1997-06-11 2000-10-03 Micronas Intermetall Gmbh Process for fabricating a semiconductor device with a patterned metal layer
US6604420B2 (en) 2001-12-26 2003-08-12 Caterpillar Inc Nondestructive adhesion testing by ultrasonic cavitation
US6981408B1 (en) * 2003-03-19 2006-01-03 Madanshetty Sameer I Thin-film adhesion testing method and apparatus
US20070141375A1 (en) * 2005-12-20 2007-06-21 Budinger David E Braze cladding for direct metal laser sintered materials

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736167A (en) * 1971-04-01 1973-05-29 Coors Porcelain Co Electroless nickel plating process
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12347998B2 (en) 2020-06-05 2025-07-01 Nichia Corporation Method of manufacturing metal-coated member, metal-coated member, wavelength conversion member, and light emitting device

Also Published As

Publication number Publication date
JPS6332266B2 (enExample) 1988-06-29
US4501768A (en) 1985-02-26

Similar Documents

Publication Publication Date Title
JPS6317337B2 (enExample)
US4442137A (en) Maskless coating of metallurgical features of a dielectric substrate
TW300373B (enExample)
JPH0249385A (ja) 電気的接続部材及びその製造方法
JPS63113917A (ja) デ−タ記録ディスク・ファイルのためのスライダ−サスペンション組立体
JP2528625B2 (ja) 基板上の導線を修理する方法及び修理された構造物
JPS6354738A (ja) ハンダ付け法
US5678287A (en) Uses of uniaxially electrically conductive articles
JPH0410238B2 (enExample)
US20020076910A1 (en) High density electronic interconnection
US5787578A (en) Method of selectively depositing a metallic layer on a ceramic substrate
JPS63110697A (ja) 多層金属構造体
JPS59101897A (ja) めつきされた金属層の余分な領域を除去するための方法
JPH10270498A (ja) 電子装置の製造方法
JPS58168265A (ja) 金属被膜の形成方法
TWI330876B (en) Method for forming multi-layer bumps on a substrate
US5122929A (en) Method of achieving selective inhibition and control of adhesion in thick-film conductors
WO1989007339A1 (en) Uses of uniaxially electrically conductive articles
EP0089604B1 (en) Method for selectively coating metallurgical patterns on dielectric substrates
US4959751A (en) Ceramic hybrid integrated circuit having surface mount device solder stress reduction
JP2008227055A (ja) 回路基板
EP0355965A2 (en) A method of achieving selective inhibition and control of adhesion in thick-film conductors
JPH03218644A (ja) 回路基板の接続構造
Brofman et al. Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors
JPH01307237A (ja) 薄い可撓性基板構造体