JPS58166930A - 中和されたイオン・ビ−ムを発生させる装置 - Google Patents
中和されたイオン・ビ−ムを発生させる装置Info
- Publication number
- JPS58166930A JPS58166930A JP57222199A JP22219982A JPS58166930A JP S58166930 A JPS58166930 A JP S58166930A JP 57222199 A JP57222199 A JP 57222199A JP 22219982 A JP22219982 A JP 22219982A JP S58166930 A JPS58166930 A JP S58166930A
- Authority
- JP
- Japan
- Prior art keywords
- electrons
- ion
- ion beam
- grid
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010884 ion-beam technique Methods 0.000 title claims description 40
- 150000002500 ions Chemical class 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 14
- 238000006386 neutralization reaction Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000003472 neutralizing effect Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000003574 free electron Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010420 art technique Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/08—Ion sources; Ion guns using arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/355,067 US4419203A (en) | 1982-03-05 | 1982-03-05 | Apparatus and method for neutralizing ion beams |
| US355067 | 1994-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166930A true JPS58166930A (ja) | 1983-10-03 |
| JPS6367744B2 JPS6367744B2 (enExample) | 1988-12-27 |
Family
ID=23396109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57222199A Granted JPS58166930A (ja) | 1982-03-05 | 1982-12-20 | 中和されたイオン・ビ−ムを発生させる装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4419203A (enExample) |
| EP (1) | EP0093831B1 (enExample) |
| JP (1) | JPS58166930A (enExample) |
| DE (1) | DE3377602D1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5988820A (ja) * | 1982-11-15 | 1984-05-22 | Ulvac Corp | シ−トプラズマを利用した化合物半導体薄膜製造装置 |
| JPS61248346A (ja) * | 1985-04-24 | 1986-11-05 | マイクリオン・コーポレイション | 集束イオンビーム処理装置 |
| JPH01105331A (ja) * | 1987-04-15 | 1989-04-21 | Sanyo Electric Co Ltd | 薄膜形成方法 |
| US5089710A (en) * | 1989-09-04 | 1992-02-18 | Tokyo Electron Limited | Ion implantation equipment |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168652A (ja) * | 1983-03-16 | 1984-09-22 | Hitachi Ltd | 素子修正方法及びその装置 |
| US4664769A (en) * | 1985-10-28 | 1987-05-12 | International Business Machines Corporation | Photoelectric enhanced plasma glow discharge system and method including radiation means |
| JPH0610348B2 (ja) * | 1986-07-28 | 1994-02-09 | 三菱電機株式会社 | イオン注入装置 |
| JPH01220350A (ja) * | 1988-02-26 | 1989-09-04 | Hitachi Ltd | 帯電抑制方法及びその装置を用いた粒子線照射装置 |
| US4925542A (en) * | 1988-12-08 | 1990-05-15 | Trw Inc. | Plasma plating apparatus and method |
| EP0390692A3 (en) * | 1989-03-29 | 1991-10-02 | Terumo Kabushiki Kaisha | Method of forming thin film, apparatus for forming thin film and sensor |
| US4985657A (en) * | 1989-04-11 | 1991-01-15 | Lk Technologies, Inc. | High flux ion gun apparatus and method for enhancing ion flux therefrom |
| JPH0724240B2 (ja) * | 1991-03-05 | 1995-03-15 | 株式会社荏原製作所 | 高速原子線源 |
| US5466929A (en) * | 1992-02-21 | 1995-11-14 | Hitachi, Ltd. | Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus |
| US5300891A (en) * | 1992-05-01 | 1994-04-05 | Genus, Inc. | Ion accelerator |
| US5357116A (en) * | 1992-11-23 | 1994-10-18 | Schlumberger Technologies, Inc. | Focused ion beam processing with charge control |
| WO1995027570A1 (en) * | 1994-04-08 | 1995-10-19 | Ray Mark A | Selective plasma deposition |
| US5468955A (en) * | 1994-12-20 | 1995-11-21 | International Business Machines Corporation | Neutral beam apparatus for in-situ production of reactants and kinetic energy transfer |
| US6184532B1 (en) | 1997-12-01 | 2001-02-06 | Ebara Corporation | Ion source |
| US6271529B1 (en) | 1997-12-01 | 2001-08-07 | Ebara Corporation | Ion implantation with charge neutralization |
| US6329650B1 (en) * | 1997-12-01 | 2001-12-11 | Ebara Corporation | Space charge neutralization of an ion beam |
| US6359286B1 (en) * | 1998-07-10 | 2002-03-19 | Applied Materials, Inc. | Method and apparatus for neutralizing space charge in an ion beam |
| JP3414380B2 (ja) * | 2000-11-14 | 2003-06-09 | 日新電機株式会社 | イオンビーム照射方法ならびに関連の方法および装置 |
| CN104498898B (zh) | 2008-08-04 | 2017-10-24 | 北美Agc平板玻璃公司 | 通过等离子体增强的化学气相沉积形成涂层的方法 |
| CN103816871A (zh) * | 2014-02-28 | 2014-05-28 | 吴从兵 | 采用低能粒子改性粉煤灰的方法 |
| JP6508746B2 (ja) | 2014-12-05 | 2019-05-08 | エージーシー フラット グラス ノース アメリカ,インコーポレイテッドAgc Flat Glass North America,Inc. | マクロ粒子低減コーティングを利用したプラズマ源ならびにマクロ粒子低減コーティングを用いたプラズマ源を薄膜コーティングおよび表面改質に使用する方法 |
| ES2883288T3 (es) | 2014-12-05 | 2021-12-07 | Agc Glass Europe Sa | Fuente de plasma de cátodo hueco |
| US9721764B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Method of producing plasma by multiple-phase alternating or pulsed electrical current |
| US9721765B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Plasma device driven by multiple-phase alternating or pulsed electrical current |
| US10573499B2 (en) | 2015-12-18 | 2020-02-25 | Agc Flat Glass North America, Inc. | Method of extracting and accelerating ions |
| BR112018012413A2 (pt) * | 2015-12-18 | 2018-12-18 | Agc Flat Glass Na Inc | fonte de íons de catodo oco e método de extração e aceleração de íons |
| US10242846B2 (en) | 2015-12-18 | 2019-03-26 | Agc Flat Glass North America, Inc. | Hollow cathode ion source |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3050652A (en) * | 1960-08-12 | 1962-08-21 | Gen Electric | Methods and apparatus for developing forces with ion beams |
| US3156090A (en) * | 1961-09-18 | 1964-11-10 | Harold R Kaufman | Ion rocket |
| US3308621A (en) * | 1963-12-30 | 1967-03-14 | United Aircraft Corp | Oscillating-electron ion engine |
| US3354644A (en) * | 1965-06-08 | 1967-11-28 | Electro Optical Systems Inc | Liquid protection of electrodes |
| US3523210A (en) * | 1966-05-20 | 1970-08-04 | Xerox Corp | Gas discharge neutralizer including a charged particle source |
| US3408283A (en) * | 1966-09-15 | 1968-10-29 | Kennecott Copper Corp | High current duoplasmatron having an apertured anode positioned in the low pressure region |
| US3387176A (en) * | 1967-01-05 | 1968-06-04 | Hughes Aircraft Co | Apparatus for passing charged particles through a field free region and neutralizingsaid particles during transit |
| US3515932A (en) * | 1967-04-27 | 1970-06-02 | Hughes Aircraft Co | Hollow cathode plasma generator |
| US3523211A (en) * | 1968-12-12 | 1970-08-04 | Kazuo Oishi | Condenser-discharge ignition system with a silicon control rectifier |
| US3697793A (en) * | 1970-02-09 | 1972-10-10 | Hughes Aircraft Co | Ion beam deflection system |
| US3913320A (en) * | 1974-11-13 | 1975-10-21 | Ion Tech Inc | Electron-bombardment ion sources |
| US3956666A (en) * | 1975-01-27 | 1976-05-11 | Ion Tech, Inc. | Electron-bombardment ion sources |
| JPS5275341A (en) * | 1975-12-19 | 1977-06-24 | Rikagaku Kenkyusho | Method of producing echelette grating |
| JPS5288900A (en) * | 1976-01-19 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Ion beam machine tool |
| US4088926A (en) * | 1976-05-10 | 1978-05-09 | Nasa | Plasma cleaning device |
| US4313791A (en) * | 1977-05-06 | 1982-02-02 | The Babcock & Wilcox Company | Method for locating defective nuclear fuel elements |
| US4151589A (en) * | 1978-02-03 | 1979-04-24 | Leeds & Northrup Company | Decoupled cascade control system |
| US4172020A (en) * | 1978-05-24 | 1979-10-23 | Gould Inc. | Method and apparatus for monitoring and controlling sputter deposition processes |
| US4201654A (en) * | 1978-10-06 | 1980-05-06 | The United States Of America As Represented By The Secretary Of The Air Force | Anode assisted sputter etch and deposition apparatus |
| US4250009A (en) * | 1979-05-18 | 1981-02-10 | International Business Machines Corporation | Energetic particle beam deposition system |
| US4264813A (en) * | 1979-06-29 | 1981-04-28 | International Business Machines Corportion | High intensity ion source using ionic conductors |
| EP0040081B1 (en) * | 1980-05-12 | 1984-09-12 | Fujitsu Limited | Method and apparatus for plasma etching |
| US4309267A (en) * | 1980-07-21 | 1982-01-05 | Bell Telephone Laboratories, Incorporated | Reactive sputter etching apparatus |
-
1982
- 1982-03-05 US US06/355,067 patent/US4419203A/en not_active Expired - Lifetime
- 1982-12-20 JP JP57222199A patent/JPS58166930A/ja active Granted
-
1983
- 1983-01-26 DE DE8383100688T patent/DE3377602D1/de not_active Expired
- 1983-01-26 EP EP83100688A patent/EP0093831B1/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5988820A (ja) * | 1982-11-15 | 1984-05-22 | Ulvac Corp | シ−トプラズマを利用した化合物半導体薄膜製造装置 |
| JPS61248346A (ja) * | 1985-04-24 | 1986-11-05 | マイクリオン・コーポレイション | 集束イオンビーム処理装置 |
| JPH01105331A (ja) * | 1987-04-15 | 1989-04-21 | Sanyo Electric Co Ltd | 薄膜形成方法 |
| US5089710A (en) * | 1989-09-04 | 1992-02-18 | Tokyo Electron Limited | Ion implantation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0093831B1 (en) | 1988-08-03 |
| EP0093831A2 (en) | 1983-11-16 |
| EP0093831A3 (en) | 1984-10-03 |
| DE3377602D1 (en) | 1988-09-08 |
| US4419203A (en) | 1983-12-06 |
| JPS6367744B2 (enExample) | 1988-12-27 |
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