JPS58160095A - スリツタナイフの自動位置定めの行なえるスリツタ装置 - Google Patents

スリツタナイフの自動位置定めの行なえるスリツタ装置

Info

Publication number
JPS58160095A
JPS58160095A JP3889682A JP3889682A JPS58160095A JP S58160095 A JPS58160095 A JP S58160095A JP 3889682 A JP3889682 A JP 3889682A JP 3889682 A JP3889682 A JP 3889682A JP S58160095 A JPS58160095 A JP S58160095A
Authority
JP
Japan
Prior art keywords
lower blade
slitter
blade slide
slide
screw shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3889682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6111753B2 (enrdf_load_stackoverflow
Inventor
義則 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meisan Co Ltd
Original Assignee
Meisan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meisan Co Ltd filed Critical Meisan Co Ltd
Priority to JP3889682A priority Critical patent/JPS58160095A/ja
Publication of JPS58160095A publication Critical patent/JPS58160095A/ja
Publication of JPS6111753B2 publication Critical patent/JPS6111753B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
JP3889682A 1982-03-12 1982-03-12 スリツタナイフの自動位置定めの行なえるスリツタ装置 Granted JPS58160095A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3889682A JPS58160095A (ja) 1982-03-12 1982-03-12 スリツタナイフの自動位置定めの行なえるスリツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3889682A JPS58160095A (ja) 1982-03-12 1982-03-12 スリツタナイフの自動位置定めの行なえるスリツタ装置

Publications (2)

Publication Number Publication Date
JPS58160095A true JPS58160095A (ja) 1983-09-22
JPS6111753B2 JPS6111753B2 (enrdf_load_stackoverflow) 1986-04-04

Family

ID=12537963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3889682A Granted JPS58160095A (ja) 1982-03-12 1982-03-12 スリツタナイフの自動位置定めの行なえるスリツタ装置

Country Status (1)

Country Link
JP (1) JPS58160095A (enrdf_load_stackoverflow)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176095U (enrdf_load_stackoverflow) * 1987-05-06 1988-11-15
JPS6411793A (en) * 1987-07-01 1989-01-17 Meisan Kk Slitter device
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176095U (enrdf_load_stackoverflow) * 1987-05-06 1988-11-15
JPS6411793A (en) * 1987-07-01 1989-01-17 Meisan Kk Slitter device
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method

Also Published As

Publication number Publication date
JPS6111753B2 (enrdf_load_stackoverflow) 1986-04-04

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