JPS58160095A - Slitter device automatically positioning slitter knife - Google Patents

Slitter device automatically positioning slitter knife

Info

Publication number
JPS58160095A
JPS58160095A JP3889682A JP3889682A JPS58160095A JP S58160095 A JPS58160095 A JP S58160095A JP 3889682 A JP3889682 A JP 3889682A JP 3889682 A JP3889682 A JP 3889682A JP S58160095 A JPS58160095 A JP S58160095A
Authority
JP
Japan
Prior art keywords
lower blade
slitter
blade slide
slide
screw shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3889682A
Other languages
Japanese (ja)
Other versions
JPS6111753B2 (en
Inventor
義則 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meisan Co Ltd
Original Assignee
Meisan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meisan Co Ltd filed Critical Meisan Co Ltd
Priority to JP3889682A priority Critical patent/JPS58160095A/en
Publication of JPS58160095A publication Critical patent/JPS58160095A/en
Publication of JPS6111753B2 publication Critical patent/JPS6111753B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 リットするスリツタ装置に関するものである,。[Detailed description of the invention] This relates to a slitter device for slitting.

従来、この攬スリツタ装置のスリッタ刃を所要ノート幅
にセットするには、これをことごとくスケールによって
各ナイフ幅間の間隔を測定していちいち手動で上下刃の
移動を行って固定していたが,この幅定の作業は非常に
手数を要するのみならず、寸法に誤差が生じ易いという
問題があった。
Conventionally, in order to set the slitter blades of this slitter device to the required note width, the distance between each knife width was measured using a scale and the upper and lower blades were manually moved and fixed. This work of determining the width not only requires a lot of effort, but also has the problem that errors are likely to occur in the dimensions.

このような問題を解決するため,本田V人は、スリッタ
ナイフの位置定めを自動的に迅速にしかも正確に行なえ
るようにしたスリッタ装置を提案した(%公昭J− j
 − 31.4t71p号公報参照)。この自動位1定
めスリッタ装置は、自動的且つ正碌にスリッタナイフの
位置定めを行なえる点で、非常に好オしい一のであるが
,スリッタナイフの移動量を検出する機構がねじのピッ
チと雌ねじの回転数から演算する方式のためパラフラッ
フ1等による誤差の生ずるおそれtあるもので、この点
史に改良の金離のあるものである。
In order to solve these problems, V. Honda proposed a slitter device that could automatically position the slitter knife quickly and accurately.
- 31.4t71p publication). This automatic positioning slitter device is very advantageous in that it can automatically and precisely position the slitter knife, but the mechanism for detecting the amount of movement of the slitter knife is based on the screw pitch. Since the method is calculated based on the number of rotations of the female thread, there is a risk of errors caused by parafluff 1, etc., and there is a great deal of improvement in this area.

本発明の目的は,このような従来技術にがんがみて,ス
リッタナイフの移動量を直接的に検出することにより、
更に正確なスリッタナイフの自動位置定めを行なえるよ
うなスリツタ装fillを提供することである。
The purpose of the present invention is to improve upon such conventional techniques by directly detecting the amount of movement of the slitter knife.
It is an object of the present invention to provide a slitter device that allows more accurate automatic positioning of a slitter knife.

次に、添付図面に基づいて本発明の実施例について本発
明の詳細な説明する、 第1図は、本発明の一実施例としてのスリッタ装置の特
罠機構St−概略的に示シ7,第2図はその制御部をブ
ロック線図で示している。第1図において、参照番号1
は下刃スライドビームであって。
Next, the present invention will be described in detail with reference to an embodiment of the present invention based on the accompanying drawings. FIG. 2 shows the control section in a block diagram. In Figure 1, reference number 1
is the lower blade slide beam.

これに沿ってスライドする下刃スライドペース2。Lower blade slide pace 2 slides along this.

l9および20を設け,これは下刃スライドベース2,
l9および20にはそれぞれモータ又はギヤゲツクス2
1.22および23により回転させられる下刃3、4お
よび5がそれぞれ取付けられている3また、下刃スライ
ドベース2、19および20には、それぞれの移動用モ
ータ6,7および8が装着されると共に,これらスライ
ドペース2、19および20自体には,機枠長手方向に
固定した下刃ねじ軸9にかみ合う雌ねじ体10.11お
よびl2が回転自在に装着されており、移動用モータ6
、7および8の回転に・伴い,モータ2l%22および
23の回転軸上に取付けた下刃3,4および5をスライ
ドペースと一緒に左右に移動させるようになっている。
19 and 20 are provided, which are the lower blade slide base 2,
l9 and 20 each have a motor or gearbox 2.
1. Lower blades 3, 4 and 5 rotated by 22 and 23 are respectively attached. 3Moreover, lower blade slide bases 2, 19 and 20 are equipped with respective movement motors 6, 7 and 8. In addition, these slide paces 2, 19, and 20 themselves are rotatably equipped with female screw bodies 10.11 and 12 that engage with the lower blade screw shaft 9 fixed in the longitudinal direction of the machine frame, and the movement motor 6
, 7 and 8, the lower blades 3, 4 and 5 mounted on the rotation shafts of the motors 21% 22 and 23 are moved left and right together with the slide pace.

更に,下刃スライドビームには,その長手方向に沿って
、例えば、磁気的に目盛・ぐルスを記録したようなリニ
ヤ−スケール33が設けられており,下刃スライドベー
ス2。
Further, the lower blade slide beam is provided with a linear scale 33 along its longitudinal direction, for example, a linear scale 33 with graduations recorded magnetically, and the lower blade slide base 2.

19および20には,リニヤ−スケ−〜33に対向する
位置にそのリニヤ−スケール33の目盛・9ルスを読み
取るための、例えば、磁気ヘッドでよい絖取りヘッド2
4,25および26がそれぞれ設けられている。これら
読取りヘッド24、25および26は,雌ねじ体10、
1lおよびl2の回転によって下刃スライドベース2、
l9および20がそれぞれ下刃ねじ軸9、従って,下刃
スライドビームlに沿って移動するとき、それら下刃ス
ライドベース2、l9および20と一緒に移動し、リニ
ヤ−スケール33の目盛ハルスを読ミ取りそれに応じた
・ぐルス出力をそれぞれ発生するものである。従って、
読取りヘッド24,25および26の各々は、各灼応す
る下刃スライドベース2、l9および20の移動量を検
出し、これを・ぐルス出力の如き電気信号として第2図
に示す制御部に送信するようになっている。
At 19 and 20, a thread removing head 2, which may be a magnetic head, for example, is installed at a position facing the linear scale 33 to read the scale of the linear scale 33.
4, 25 and 26 are provided, respectively. These read heads 24, 25 and 26 are connected to the internally threaded body 10,
By rotating 1l and 12, the lower blade slide base 2,
When the lower blade slide bases 2, 19 and 20 respectively move along the lower blade screw shaft 9 and therefore the lower blade slide beam l, they move together with the lower blade slide bases 2, 19 and 20, and read the scale hals of the linear scale 33. Each output generates a corresponding output. Therefore,
Each of the reading heads 24, 25 and 26 detects the amount of movement of the respective lower blade slide bases 2, 19 and 20 and transmits this as an electrical signal such as a signal output to the control section shown in FIG. It is set to send.

上刃l6、l7および18についても、これを左右へ移
動させる機構は、前述した下刃3、4および5の場合と
同様であるが、一般にはこの移動量を検出する手段は不
要であり,この場合上刃はただ下刃に同期して追従する
ようにしである。尚。
The mechanism for moving the upper blades l6, l7 and 18 left and right is the same as that for the lower blades 3, 4 and 5 described above, but generally there is no need for a means to detect the amount of movement. In this case, the upper blade simply follows the lower blade in synchronization. still.

第1図において,参照番号l′は下刃スライドビームl
と平行に延長した上刃スライドピーム,2′。
In Figure 1, the reference number l' is the lower blade slide beam l.
Upper blade slide beam extended parallel to 2'.

19′および20′ハ上刃スライドペースであって、こ
れらには移動用モータ6’、7’および8′がそれぞれ
設けられており,且つ10’,11’および12′は雌
ねじ体であるっ 次に、このスリッタ装置の機構部を制御する制御部につ
いて説明すると,第一図において,参照符号^、8.C
Fi.第1.@2、第32’jツ/すイフの移動量を電
気信号として発信する可逆式トランスジューサであって
第1図における絖取りヘッド24.25および26にそ
れぞれ対応しておゆ、これらWs、取りヘッド24.2
5および26の移動による・母ルス出力は、スリットさ
れるシート幅の広くなろ向きの移動時に生ずるものをプ
ラス、十の逆の時に生ずるものをマイナスとする。従っ
て、@1スリッタナイフと第2スリツタナイフ及び第2
スリツタナイフと第3スリツタナイフトハ第2スリツタ
ナイフに関する限り同一方向への移動は勺いに極性が逆
となる これら読取りヘッドからの信号はそれぞれ雑音
防止回路a、 a/ 、a #。
19' and 20' are upper blade slide paces, which are respectively provided with moving motors 6', 7' and 8', and 10', 11' and 12' are female screw bodies. Next, a description will be given of the control section that controls the mechanical section of this slitter apparatus.In FIG. 1, reference numerals ^, 8. C
Fi. 1st. @2, 32' A reversible transducer that transmits the amount of movement of the two/swifts as an electrical signal, and these Ws, wires correspond to the threading heads 24, 25 and 26 in Fig. 1, respectively. Head 24.2
The base las output due to the movement of 5 and 26 is positive if it occurs when the sheet to be slit is moved in the direction of widening, and if it occurs in the opposite direction of 10, it is negative. Therefore, @1 slitter knife, 2nd slitter knife and 2nd slitter knife
As far as the slitting knife and the third slitting knife are concerned, the movements in the same direction are often of opposite polarity. The signals from these read heads are passed through noise prevention circuits a, a/, a#, respectively.

波形成形回路す、b’、b′を経て、信号伝達回路C1
dから可逆計数カラ/り・、tに入る。
Via the waveform shaping circuits S, b', b', the signal transmission circuit C1
From d, enter the reversible count color/ri・, t.

この信号伝達回路C%dは一種のす子回路であって、読
取りヘッドの信号(即ち移動量)と移動方向国、(−)
を特別な指令を要せずに次の可逆計数カラ/りe、fに
伝達し、連続的に下刃3.4および5相互間の距離とし
て計数されるようになっている 但し図中トランスジニ
ーv8 (a取りヘッド25)の如く互いに隣同志のシ
ート幅に対して長憾逆作廟となるトランスジューサから
の・ぐルス出力の極性は、前述の如く同一方向の移動に
対して互いに逆になるので、それぞれの7一ト幅を表わ
す可逆計数カウンタe、 fへの伝達は、この信号回路
c、dによって互いに逆転される。この計数された距離
ti表示器g、yi’罠よって常時表示される。
This signal transmission circuit C%d is a kind of child circuit, which includes the reading head signal (i.e., the amount of movement) and the direction of movement (-).
is transmitted to the next reversible counting machine e, f without requiring any special command, and is continuously counted as the distance between the lower blades 3.4 and 5. However, the transformer in the figure As mentioned above, the polarity of the output from the transducer, which is a negative effect on the width of adjacent sheets such as Genie V8 (A head 25), is opposite to each other for movement in the same direction. Therefore, the transmissions to the reversible counters e, f representing the respective 7-tot widths are reversed by the signal circuits c, d. The counted distances ti are constantly displayed by the indicators g and yi'.

−可逆計数カウンタによって計数された各スリッタナイ
フ間の距離は次の比較判別回路り、h’においてデジタ
ル寸法設定器(スイッチ)1.l’lc設定された所要
寸法と比較され、この所定寸法より「大きいか」、「小
さいか」、「等しいか」及びその「修正方向」會判別し
1次の出力指示回路1、j’、 j’に伝え、1!jに
、出力指示回路から修正信号をサーフモータ制御回路に
、に’、k′に出す。サーゼ毛−タI?!lI御回路−
1k′、ビは移動用モータ6.7および81にその方向
に移動させる。こうして。
- The distance between each slitter knife counted by the reversible counting counter is passed through the next comparison/discrimination circuit, and at h', the digital dimension setter (switch) 1. l'lc is compared with the set required dimension and determines whether it is "larger", "smaller", or "equal" than this predetermined dimension and its "correction direction", and the primary output instruction circuit 1, j', Tell j', 1! At j, a correction signal is sent from the output instruction circuit to the surf motor control circuit at ' and k'. Sarze hair-ta I? ! lI control circuit
1k' and Bi cause the moving motors 6.7 and 81 to move in that direction. thus.

設定値に達した時に停止信号を出し、移動用モータを停
止させる。
When the set value is reached, a stop signal is issued and the moving motor is stopped.

従って、★際の使用方法とし′tri始動時のみ4各ス
リッタナイフ間の距mをスケールで測定し、この測定し
喪数値をデジタル寸法設定51.1’に竜ノトシ、且つ
可逆計数カウンタe、fにこれを移し記憶表示させる。
Therefore, the method of use is to measure the distance m between each slitter knife with a scale only when starting the tri, and set the measured value to the digital dimension setting 51.1', and the reversible counting counter e. Move this to f and display it in memory.

以後はデジタル寸法設定器■。After that, use the digital dimension setting device■.

1′に所要シート幅寸法を設定するだけで充分である。It is sufficient to set the required sheet width dimension in 1'.

前述し九実施例はスリッタナイフt−3組備えたもの、
即ち2つ割りのものについての説明でめったが、何組の
ものであっても基本的には同様である。
The nine embodiments mentioned above are equipped with three sets of slitter knives,
In other words, although the explanation is rarely about the two-part one, it is basically the same no matter how many sets there are.

また、前述した実施例のものでは、相隣接するスリッタ
ナイフに関連したトランスジューサ^。
Also, in the embodiments described above, the transducers associated with adjacent slitter knives.

B、 C(@堆りヘッド24.25.26)からの信号
を各対応する信号伝達回路にて処理して対応する相隣接
するスリッタナイフ間の間隔を所望値へ設定していく−
の、すなわち、第2図において相1IiI接するトラン
スジューサA及びBからの信号を信号伝達回路CKて処
理して第1図において相隣接する下刃3及び4の間隔を
設定し、相@接するトランスジユーサ8及びCからの信
号を信号伝達回路d t[て処理して相隣接する下刃4
及び5の間隔を設定していくものであったが、本発明に
よれば、必ずしも相@接するものの信号を処理する−の
に@らず、任意の2組のスリッタナイフ間の信号をそれ
ぞれ処理することによっても各スリッタナイフ間の間隔
を所望値へより迅速に設定できるものである。例えば、
第2図においてトランスツユ−す^及び8からの信号を
1つの信号伝達回路にて処理し、トランスジューサ^及
びCからの信号を別の7つの信号伝達回路にて処理する
ことによって、第1図において下刃3と下刃4との間及
び下刃4と下刃5との間の間隔をそれぞれ所望値に設定
していくような制御が前述し友のと同様にして行なえる
ものである。従って、スリッタナイフ間隔の設定に際し
、各スリッタナイフを同時に移動させてすべてのスリッ
タナイフの各間隔を所望値へ設定できるので、その設定
動作に要する時間は非常に短縮されうる。
Signals from B and C (@banking head 24, 25, 26) are processed by the corresponding signal transmission circuits to set the distance between the corresponding adjacent slitter knives to a desired value.
In other words, the signal transmission circuit CK processes the signals from the transducers A and B that are in contact with each other in phase 1IiI in FIG. The signals from the users 8 and C are processed by the signal transmission circuit dt[ and the adjacent lower blades 4
However, according to the present invention, the signals between any two sets of slitter knives are not necessarily processed, but the signals between any two pairs of slitter knives are processed. By doing so, the spacing between each slitter knife can be more quickly set to a desired value. for example,
By processing the signals from transducers ^ and 8 in Fig. 2 in one signal transmission circuit, and processing the signals from transducers ^ and C in another 7 signal transmission circuits, in Fig. Control such as setting the distances between the lower blades 3 and 4 and between the lower blades 4 and 5 to desired values can be performed in the same manner as described above. Therefore, when setting the slitter knife intervals, each slitter knife can be moved simultaneously to set each interval of all the slitter knives to a desired value, so that the time required for the setting operation can be greatly shortened.

前述した如く1本発明のスリッタ装置によれば。According to the slitter device of the present invention, as described above.

固定したねじ軸に係合した雌ねじ体の回転によってスリ
ッタナイフをイー々に左右に開隔なく自由に移動させる
ことができ、しかtリニアースケールと読取りヘッドと
の組み合せによってスリッタナイフの移動量を検出しそ
れに応じたイルス出力を信号伝達回路および可逆針数、
カウンタ等を含む制御部にて処理し、特別な基準点を介
することなく直接的にスリッタナイフ相互間の距離を指
示享せ。
The slitter knife can be moved freely from side to side by rotating the female screw body engaged with the fixed screw shaft, and the amount of movement of the slitter knife can be detected by the combination of a linear scale and a reading head. Then, the signal transmission circuit and the number of reversible stitches,
Processing is performed by a control unit including a counter, etc., and the distance between the slitter knives can be directly indicated without using a special reference point.

また、スリッタナイフ間の距離をデジタル的に所望値に
設定することかで舞、しかもこの各lvr望値への設定
に際して各スリッタナイフを同時に移動させていくこと
も可能となるので、スリッタナイフ間隔の所望値への設
定動作が正確かつ迅速に行なえ、特に、スリッタナイフ
間隔を蒙更する場合各スリッタナイフt−基準点へ戻す
ような操作を必要としないのでff勅作がより迅速に竹
なえる上、スリッタナイフの移動量の検出をリニヤ−ス
ケールと読取りヘッドとの組み合せによって行なってい
るので、その検出機構が非常に簡単となり装置全体とし
て簡素化及び低価格化をはかれ、tた、回転部を自しな
いのでその移動量検出をより正確に行なえ、従って、ス
リッタナイフ間の間隔をより精度よく設定することがで
きる。
In addition, it is possible to digitally set the distance between the slitter knives to a desired value, and it is also possible to move each slitter knife at the same time when setting each lvr to the desired value, so the slitter knife interval can be adjusted. The setting operation to the desired value can be performed accurately and quickly, and in particular, when changing the slitter knife interval, it is not necessary to return each slitter knife to the t-reference point, so the ff cut can be made more quickly. Furthermore, since the amount of movement of the slitter knife is detected by a combination of a linear scale and a reading head, the detection mechanism is extremely simple, simplifying and reducing the cost of the entire device. Since the parts do not move automatically, the amount of movement can be detected more accurately, and therefore the interval between the slitter knives can be set more accurately.

【図面の簡単な説明】[Brief explanation of the drawing]

添付図面の第1図は本発明の一実施例としてのスリッタ
装置の特に機構部を示す概略図、#IJ2図は47図の
スリッタ装置の制@部を示すブロック線図である。 l・・・T刃スライドビーム、1′・・・上刃スライド
ビーム、2,19.20・・・下刃スライドベース。 2′、19’、20’・・・上刃スライドベース。 3.4.5・・・下刃、6,7.8.6’、7’、8’
・・・・・移動用モータ、9・・・下刃ねじ軸、9′・
・・上刃ねじ軸、10.10’、11,11’、12.
12’・・・雌ねじ体、16.’17.18・・・上刃
。 24.25.26・・・暁取りヘッド、33・・・リニ
ヤ−スケール、A%B、C・・・トランスノ一−サ、c
、d・・・信号伝達回路、e、ず・・・可逆計数カウン
タ、h、h’・・・比較判別回路、1.1′・・・デジ
タル寸法設定器、1.1′、j′・・・出力指示回路、
k、に’、k’・・・サーフモータ制−回路。
FIG. 1 of the accompanying drawings is a schematic diagram showing in particular the mechanical part of a slitter apparatus as an embodiment of the present invention, and FIG. #IJ2 is a block diagram showing the control part of the slitter apparatus shown in FIG. 47. l...T-blade slide beam, 1'...upper blade slide beam, 2,19.20...lower blade slide base. 2', 19', 20'... Upper blade slide base. 3.4.5...Lower blade, 6, 7.8.6', 7', 8'
...Movement motor, 9...Lower blade screw shaft, 9'.
... Upper blade screw shaft, 10.10', 11,11', 12.
12'...Femally threaded body, 16. '17.18... Upper blade. 24.25.26...Dawn removal head, 33...Linear scale, A%B, C...Transnoiser, c
, d... Signal transmission circuit, e, Z... Reversible counting counter, h, h'... Comparison/discrimination circuit, 1.1'... Digital dimension setter, 1.1', j'/・Output instruction circuit,
k, ni', k'... Surf motor control circuit.

Claims (1)

【特許請求の範囲】 ノート状物体を連続的にスリットするスリッタ装置であ
って、下刃ねじ軸を固定して有し九下刃スライドビーム
と、誼下刃ねじ軸の上方VCl2間してそれと平行に延
長する上刃ねじ軸を固定して有した上刃スライドビーふ
と、前記下刃スライドビームに独立(摺動しうるように
取シ付けられた少・ なくとも3つの下刃スライドペー
スと、前記上刃スライドビームに独立に摺動しうるよう
に取り付けられた前記下刃スライドペースの数に対応す
る数の上刃スライドペースとを備えており、前記下刃ス
ライドペースの各々には、スリッタナイフの回転下刃、
前記下刃ねじ軸に係合した雌ねじ体。 該雌ねじ体を回転駆動させることによって下刃スライド
(−スが下刃スライドビームに沿って左右に移動するよ
うにする移動用モータが一体的に取妙付けられており、
前記上刃スライドペースの各々には、対応する回転下刃
と結合してスリッタナイフを構成する上刃、前記上刃ね
じ軸に係合した雌ねじ体および該雌ねじ体を回転駆動さ
せることによって前記対応する下刃スライドペースの移
動に追従して上刃スライドペースが上刃スライドビーム
に沿って左右に移動するようにする移動用モータが一体
的に取り付けられており、更に、前記各移動用モータの
駆動を制御して前記各スリッタナイフ間の距−を所望値
に自動的に認定するための制御部を備えたスリッタ装置
において、前記下刃スライド1ビームに、その長手方向
に沿って設けられたリニヤ−スケールと、前記下刃スラ
イドペースの各々に設けられそれら下刃スライドベー不
の移動につれて前記リニヤ−スケールに沿って移動して
そのリニヤ−スケールの目盛を読み取り各対応した下刃
スライドペースの移動量を示す信号を発生し該信号會制
鞠用信号として前記制御部へ送るための貌取りヘッドと
を備えることを特徴とするスリッタ装置。
[Claims] A slitter device that continuously slits a notebook-like object, which has a fixed lower blade screw shaft and is connected between a nine lower blade slide beam and an upper VCl2 of the lower blade screw shaft. The upper blade slide beam has a fixed upper blade screw shaft extending in parallel, and at least three lower blade slide beams are attached to the lower blade slide beam independently (slidingly). , a number of upper blade slide spaces corresponding to the number of the lower blade slide spaces attached to the upper blade slide beam so as to be able to slide independently, each of the lower blade slide spaces: The rotating lower blade of the slitter knife,
A female screw body engaged with the lower blade screw shaft. A moving motor is integrally attached to the mount, which causes the lower blade slide to move from side to side along the lower blade slide beam by rotationally driving the female threaded body.
Each of the upper blade slide paces includes an upper blade that is combined with a corresponding rotating lower blade to form a slitter knife, a female screw body that engages with the screw shaft of the top blade, and a corresponding one by rotating the female screw body. A moving motor is integrally attached to move the upper blade slide pace to the left and right along the upper blade slide beam in accordance with the movement of the lower blade slide pace. In the slitter apparatus equipped with a control unit for controlling the drive and automatically certifying the distance between the respective slitter knives to a desired value, the lower blade slide 1 is provided on the beam along its longitudinal direction. A linear scale is provided on each of the lower blade slide paces, and as the lower blade slide base moves, it moves along the linear scale and reads the scale of the linear scale. 1. A slitter apparatus comprising: a cutting head for generating a signal indicating the amount of movement and sending the signal to the control section as a signal control signal.
JP3889682A 1982-03-12 1982-03-12 Slitter device automatically positioning slitter knife Granted JPS58160095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3889682A JPS58160095A (en) 1982-03-12 1982-03-12 Slitter device automatically positioning slitter knife

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3889682A JPS58160095A (en) 1982-03-12 1982-03-12 Slitter device automatically positioning slitter knife

Publications (2)

Publication Number Publication Date
JPS58160095A true JPS58160095A (en) 1983-09-22
JPS6111753B2 JPS6111753B2 (en) 1986-04-04

Family

ID=12537963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3889682A Granted JPS58160095A (en) 1982-03-12 1982-03-12 Slitter device automatically positioning slitter knife

Country Status (1)

Country Link
JP (1) JPS58160095A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176095U (en) * 1987-05-06 1988-11-15
JPS6411793A (en) * 1987-07-01 1989-01-17 Meisan Kk Slitter device
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176095U (en) * 1987-05-06 1988-11-15
JPS6411793A (en) * 1987-07-01 1989-01-17 Meisan Kk Slitter device
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package

Also Published As

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